Novel TCAD Approach for the Investigation of Charge Transport in Thick Amorphous SiO2 Insulators

A TCAD approach for the investigation of charge transport in thick amorphous silicon dioxide is presented for the first time. Thick oxides are investigated representing the best candidates for integrated galvanic insulators in future power applications. The large electric fields, such devices experience and the preexisting defects in the amorphous material, give rise to a leakage current, which leads to degradation and failure. Hence, it is crucial to have a complete understanding of the main physical mechanisms responsible for the charge transport in amorphous silicon oxide. For this reason, metal-insulator-metal structures have been experimentally characterized at different high-field stress conditions and a TCAD approach has been implemented in order to gain insight into the microscopic physical mechanisms responsible for the leakage current. In particular, the role of charge injection at contacts and charge build-up due to trapping-detrapping mechanisms in the bulk of the oxide layer has been investigated and modeled to the purpose of understanding the oxide behavior under dc- and ac-stress conditions. Numerical simulations have been compared against experiments to quantitatively validate the proposed approach

Characterisation and modelling of degradation mechanisms in RF MEMS capacitive switches during hold-down operation

RF MEMS switches represent an attractive alternative technology to current mechanical (e.g. coaxial and waveguide) and solid-state (e.g. PIN diode and FET transistor) RF switch technologies. The materials and fabrication techniques used in MEMS manufacture enable mechanically moveable devices with high RF performance to be fabricated on a miniature scale. However, the operation of these devices is affected by several mechanical and electrical reliability concerns which limit device lifetimes and have so far prevented the widespread adoption and commercialisation of RF MEMS. While a significant amount of research and development on RF MEMS reliability has been performed in recent years, the degradation mechanisms responsible for these reliability concerns are still poorly understood. This is due to the multi-physical nature of MEMS switches where multiple mechanical and electrical degradation mechanisms can simultaneously affect device behaviour with no clear way of distinguishing between their individual effects. As such, little progress has been made in proposing solutions to these reliability concerns. While some RF MEMS switches have recently been commercialised, their success has come at the expense of decreased performance due to design changes necessarily imposed to prevent device failure. However, more high performance switches could be developed if the mechanisms responsible for reliability problems could be understood and solved. The work of this thesis is focussed on the isolation and study of individual reliability mechanisms in RF MEMS capacitive switches. A bipolar hold-down technique is used to minimise the effects of dielectric charging and allow mechanical degradation to be studied in isolation in aluminium-based capacitive switches. An investigation of mechanical degradation leads to the identification of grain boundary sliding as the physical process responsible for the decreased mechanical performance of a switch. An alternative material for the switch movable electrode is investigated and shown to be mechanically robust. The effects of dielectric charging are isolated from mechanical degradation using mechanically robust switches. The isolated investigation of dielectric charging leads to the identification of two major charging mechanisms which take place at the bulk and surface of the dielectric, respectively. The exchange of charge from interface traps is identified as the physical mechanism responsible for bulk dielectric charging. An investigation of surface dielectric charging reveals how this reliability concern depends on the structure and design of a switch. Finally, electrical and material means of minimising dielectric charging are investigated. The findings and results presented in this thesis represent a significant contribution to the state-of the- art understanding of RF MEMS capacitive switch reliability. By implementing the design changes and material solutions proposed in this work, the performance and lifetime of RF MEMS capacitive switches can be greatly improved

Characterization of low pressure chemically vapor deposited Boron Nitride films as low dielectric constant materials

Boron nitride thin films were synthesized on Si and quartz wafers by low pressure chemical vapor deposition using borane triethylamine complex and ammonia as precursors. The films were processed at 400°C, 475°C and 550°C at a constant pressure of 0.5 Torr and at different precursor flow ratios. The films deposited were uniform, amorphous and the composition of the films varied with deposition temperature and precursor flow ratios. The thickness of the film increased with increasing flow ratio, but, decreased with increasing temperature. The stresses in the film were either mildly tensile or compressive. The least dielectric constant for the films that could be attained was 2.73 at 550°C and at high flow ratios of NH3/TEAB (50/1). Thus, stoichiometric boron nitride films tend to have a lower dielectric constant. The limitation of attaining lower values could be due to the presence of carbon as an impurity in the film and the presence of mobile charge carriers in the films as well as at the substrate-film interface as seen from the capacitance-voltage characteristics

The planar anodic Al2O3-ZrO2 nanocomposite capacitor dielectrics for advanced passive device integration

The need for integrated passive devices (IPDs) emerges from the increasing consumer demand for electronic product miniaturization. Metal-insulator-metal (MIM) capacitors are vital components of IPD systems. Developing new materials and technologies is essential for advancing capacitor characteristics and co-integrating with other electronic passives. Here we present an innovative electrochemical technology joined with the sputter-deposition of Al and Zr layers to synthesize novel planar nanocomposite metal-oxide dielectrics consisting of ZrO2 nanorods self-embedded into the nanoporous Al2O3 matrix such that its pores are entirely filled with zirconium oxide. The technology is utilized in MIM capacitors characterized by modern surface and interface analysis techniques and electrical measurements. In the 95-480 nm thickness range, the best-achieved MIM device characteristics are the one-layer capacitance density of 112 nF center dot cm(-2), the loss tangent of 4 center dot 10(-3) at frequencies up to 1 MHz, the leakage current density of 40 pA center dot cm(-2), the breakdown field strength of up to 10 MV center dot cm(-1), the energy density of 100 J center dot cm(-3), the quadratic voltage coefficient of capacitance of 4 ppm center dot V-2, and the temperature coefficient of capacitance of 480 ppm center dot K-1 at 293-423 K at 1 MHz. The outstanding performance, stability, and tunable capacitors' characteristics allow for their application in low-pass filters, coupling/decoupling/bypass circuits, RC oscillators, energy-storage devices, ultrafast charge/discharge units, or high-precision analog-to-digital converters. The capacitor technology based on the non-porous planar anodic-oxide dielectrics complements the electrochemical conception of IPDs that combined, until now, the anodized aluminum interconnection, microresistors, and microinductors, all co-related in one system for use in portable electronic devices

Low pressure chemical vapor deposition of boron nitride thin films from triethylamine borane complex and ammonia

Boron nitride thin films were synthesized on Silicon and quartz substrates by low pressure chemical vapor deposition using triethylamine-borane complex and ammonia as precursors. The films were processed at 550°C, 575°C and 600°C at a constant pressure of 0.05 Torr at different precursor flow rates and flow ratios. Several analytical methods such as Fourier transform infrared spectroscopy, x- ray photo-electron spectroscopy, ultra-violet/visible spectrophotornetry, ellipsometry, surface profilometry and scanning electron microscopy were used to study the deposited films. The films deposited were uniform, amorphous and the composition of the films varied with deposition temperature and precursor flow ratios. The stresses in the film were either mildly tensile or compressive. Dielectric constant characterization of LPCVD boron nitride was made using metal-insulator-semiconductor (MIS) and metal-insulator-metal (M IM) structures. The boron nitride films were stable and showed dielectric constant values between 3.8 and 4.7. The limitation of attaining lower values could be due to the presence of carbon as an impurity in the film and the presence of mobile charge carriers in the films as well as at the substrate-film interface

Synthesis and characterization of silicon dioxide thin films by low pressure chemical vapor deposition using ditertiarybutylsilane and oxygen

This study is focused on the synthesis and characterization of silicon dioxide thin films deposited on silicon wafers by Low Pressure Chemical Vapor Deposition (LPCVD), using ditertiarybutylsilane (DTBS) as a precursor and oxygen as the oxidant. The dependence of film growth rate on various process parameters were studied. The growth rate was found to follow an Arrhenius curve with the variation in the temperature with an activation energy of 12.6 kcal/mol. The growth rate was found to be inversely proportional to the temperature in the range 550-750 °C. The refractive index and density were observed to be close to 1.47 and 2.71 g/cm3 respectively with flow rate ratio O2/DTBS = 2/1. Producing crack-free thick oxide films were performed at two different conditions. One was at 850 °C with flow rate ratio O2/DTBS = 5/1 which produced compressive stress with lower growth rate, and the other was at 700 °C with flow rate ratio O2/DTBS = 10/1 which produced tensile stress with higher growth rate. Both conditions were able to produce about 10 μm oxide films with no sign of cracking

Physical modeling and numerical simulations of degradation mechanisms in devices and insulators for power applications

In this thesis, a TCAD approach for the investigation of charge transport in amorphous silicon dioxide is presented for the first time. The proposed approach is used to investigate high-voltage silicon oxide thick TEOS capacitors embedded in the back-end inter-level dielectric layers for galvanic insulation applications. In the first part of this thesis, a detailed review of the main physical and chemical properties of silicon dioxide and the main physical models for the description of charge transport in insulators are presented. In the second part, the characterization of high-voltage MIM structures at different high-field stress conditions up to the breakdown is presented. The main physical mechanisms responsible of the observed results are then discussed in details. The third part is dedicated to the implementation of a TCAD approach capable of describing charge transport in silicon dioxide layers in order to gain insight into the microscopic physical mechanisms responsible of the leakage current in MIM structures. In particular, I investigated and modeled the role of charge injection at contacts and charge build-up due to trapping and de-trapping mechanisms in the oxide layer to the purpose of understanding its behavior under DC and AC stress conditions. In addition, oxide breakdown due to impact-ionization of carriers has been taken into account in order to have a complete representation of the oxide behavior at very high fields. Numerical simulations have been compared against experiments to quantitatively validate the proposed approach. In the last part of the thesis, the proposed approach has been applied to simulate the breakdown in realistic structures under different stress conditions. The TCAD tool has been used to carry out a detailed analysis of the most relevant physical quantities, in order to gain a detailed understanding on the main mechanisms responsible for breakdown and guide design optimization

Integrated Circuits/Microchips

With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

Dielectric reliability of copper/low-k interconnects

Ph.DDOCTOR OF PHILOSOPH