Noise shaping Asynchronous SAR ADC based time to digital converter

Time-to-digital converters (TDCs) are key elements for the digitization of timing information in modern mixed-signal circuits such as digital PLLs, DLLs, ADCs, and on-chip jitter-monitoring circuits. Especially, high-resolution TDCs are increasingly employed in on-chip timing tests, such as jitter and clock skew measurements, as advanced fabrication technologies allow fine on-chip time resolutions. Its main purpose is to quantize the time interval of a pulse signal or the time interval between the rising edges of two clock signals. Similarly to ADCs, the performance of TDCs are also primarily characterized by Resolution, Sampling Rate, FOM, SNDR, Dynamic Range and DNL/INL. This work proposes and demonstrates 2nd order noise shaping Asynchronous SAR ADC based TDC architecture with highest resolution of 0.25 ps among current state of art designs with respect to post-layout simulation results. This circuit is a combination of low power/High Resolution 2nd Order Noise Shaped Asynchronous SAR ADC backend with simple Time to Amplitude converter (TAC) front-end and is implemented in 40nm CMOS technology. Additionally, special emphasis is given on the discussion on various current state of art TDC architectures.Electrical and Computer Engineerin

Image compression and energy harvesting for energy constrained sensors

Title from PDF of title page, viewed on June 21, 2013Dissertation advisor: Walter D. Leon-SalasVitaIncludes bibliographic references (pages 176-[187])Thesis (Ph.D.)--School of Computing and Engineering. University of Missouri--Kansas City, 2013The advances in complementary metal-oxide-semiconductor (CMOS) technology have led to the integration of all components of electronic system into a single integrated circuit. Ultra-low power circuit techniques have reduced the power consumption of circuits. Moreover, solar cells with improved efficiency can be integrated on chip to harvest energy from sunlight. As a result of all the above, a new class of miniaturized electronic systems known as self-powered system on a chip has emerged. There is an increasing research interest in the area of self-powered devices which provide cost-effective solutions especially when these devices are used in the areas that changing or replacing batteries is too costly. Therefore, image compression and energy harvesting are studied in this dissertation. The integration of energy harvesting, image compression, and an image sensor on the same chip provides the energy source to charge a battery, reduces the data rate, and improves the performance of wireless image sensors. Integrated circuits of image compression, solar energy harvesting, and image sensors are studied, designed, and analyzed in this work. In this dissertation, a hybrid image sensor that can perform the tasks of sensing and energy harvesting is presented. Photodiodes of hybrid image sensor can be programmed as image sensors or energy harvesting cells. The hybrid image sensor can harvest energy in between frames, in sleep mode, and even when it is taking images. When sensing images and harvesting energy are both needed at the same time, some pixels have to work as sensing pixels, and the others have to work as solar cells. Since some pixels are devoted to harvest energy, the resolution of the image will be reduced. To preserve the resolution or to keep the fair resolution when a lot of energy collection is needed, image reconstruction algorithms and compressive sensing theory provide solutions to achieve a good image quality. On the other hand, when the battery has enough charge, image compression comes into the picture. Multiresolution decomposition image compression provides a way to compress image data in order to reduce the energy need from data transmission. The solution provided in this dissertation not only harvests energy but also saves energy resulting long lasting wireless sensors. The problem was first studied at the system level to identify the best system-level configuration which was then implemented on silicon. As a proof of concept, a 32 x 32 array of hybrid image sensor, a 32 x 32 array of image sensor with multiresolution decomposition compression, and a compressive sensing converter have been designed and fabricated in a standard 0.5 [micrometer] CMOS process. Printed circuit broads also have been designed to test and verify the proposed and fabricated chips. VHDL and Matlab codes were written to generate the proper signals to control, and read out data from chips. Image processing and recovery were carried out in Matlab. DC-DC converters were designed to boost the inherently low voltage output of the photodiodes. The DC-DC converter has also been improved to increase the efficiency of power transformation.Introduction -- Hybrid imager system and circuit design -- Hybrid imager energy harvesting and image acquisition results and discussion -- Detailed description and mathematical analysis for a circuit of energy harvesting using on-chip solar cells -- Multiresolution decomposition for lossless and near-lossless compression -- An incremental [sigma-delta] converter for compressive sensing -- Detailed description of a sigma-delta random demodulator converter architecture for compressive sensing applications -- Conclusion -- Appendix A. Chip pin-out -- Appendix B. Schematics -- Appendix C. Pictures of custom PC

Integrated temperature sensors in deep sub-micron CMOS technologies

textIntegrated temperature sensors play an important role in enhancing the performance of on-chip power and thermal management systems in today's highly-integrated system-on-chip (SoC) platforms, such as microprocessors. Accurate on-chip temperature measurement is essential to maximize the performance and reliability of these SoCs. However, due to non-uniform power consumption by different functional blocks, microprocessors have fairly large thermal gradient (and variation) across their chips. In the case of multi-core microprocessors for example, there are task-specific thermal gradients across different cores on the same die. As a result, multiple temperature sensors are needed to measure the temperature profile at all relevant coordinates of the chip. Subsequently, the results of the temperature measurements are used to take corrective measures to enhance the performance, or save the SoC from catastrophic over-heating situations which can cause permanent damage. Furthermore, in a large multi-core microprocessor, it is also imperative to continuously monitor potential hot-spots that are prone to thermal runaway. The locations of such hot spots depend on the operations and instruction the processor carries out at a given time. Due to practical limitations, it is an overkill to place a big size temperature sensor nearest to all possible hot spots. Thus, an ideal on-chip temperature sensor should have minimal area so that it can be placed non-invasively across the chip without drastically changing the chip floor plan. In addition, the power consumption of the sensors should be very low to reduce the power budget overhead of thermal monitoring system, and to minimize measurement inaccuracies due to self-heating. The objective of this research is to design an ultra-small size and ultra-low power temperature sensor such that it can be placed in the intimate proximity of all possible hot spots across the chip. The general idea is to use the leakage current of a reverse-bias p-n junction diode as an operand for temperature sensing. The tasks within this project are to examine the theoretical aspect of such sensors in both Silicon-On-Insulator (SOI), and bulk Complementary Metal-Oxide Semiconductor (CMOS) technologies, implement them in deep sub-micron technologies, and ultimately evaluate their performances, and compare them to existing solutions.Electrical and Computer Engineerin

Low-voltage Low-power Switched-Capacitor ?S Modulator Design

Ph.DDOCTOR OF PHILOSOPH

Voltage and Time-Domain Analog Circuit Techniques for Scaled CMOS Technologies

CMOS technology scaling has resulted in reduced supply voltage and intrinsic voltage gain of the transistor. This presents challenges to the analog circuit designers due to lower signal swing and achievable signal to noise ratio (SNR), leading to increased power consumption. At the same time, device speed has increased in lower design nodes, which has not been directly beneficial for analog circuit design. This thesis presents voltage-domain and time-domain circuit scaling friendly circuit architectures that minimize the power consumption and benefit from the increasing transistor speeds. In the voltage-domain, an on-the-fly gain selection block is demonstrated as an alternative to the traditional MDAC architecture to enhance the input dynamic range of a medium-resolution medium-speed analog-to-digital converter (ADC) at reduced supply voltages. The proposed design also eliminates the need for a reference buffer, thus providing power savings. The measured prototype enhances the input dynamic range of a 12bit, 40MSPS ADC to 80.6dB at 1.2V supply voltage. In the time-domain, a generic circuit design approach is presented, followed by an in-depth analysis of Voltage-Controlled-Oscillator based Operational Transconductance Amplifiers (VCO-OTAs). A discrete-time-domain small-signal model based on the zero crossings of the internal VCOs is developed to predict the stability, the step response, and the frequency response of the circuit when placed in feedback. The model accurately predicts the circuit behavior for an arbitrary input frequency, even as the VCO free-running frequency approaches the unity-gain bandwidth of the closed-loop system, where other intuitive small-signal models available in the literature fail. Next, we present an application of VCO-OTA in designing a baseband trans-impedance amplifier (TIA) for current-mode receivers as a scaling-friendly and power-efficient alternative to the inverter-based OTA. We illustrate a design methodology for the choice of the VCO-OTA parameters in the context of a receiver design with an example of a 20MHz RF-channel-bandwidth receiver operating at 2GHz. Receiver simulation results demonstrate an improvement of up to 12dB in blocker 1dB compression point (B1dB) for slightly higher power consumption or up to 2.6x power reduction of the TIA resulting in up to 2x power reduction of the receiver for similar B1dB performance. Next, we present some examples of VCO-OTAs. We first illustrate the benefit of a VCO-OTA in a low-dropout-voltage regulator to achieve a dropout voltage of only100mV and operating down to 0.8V input supply, compared to the prototype based on traditional OTA with a minimum dropout voltage of 150mV, operating at a minimum of 1.2V supply. Both the capacitor-less prototypes can drive up to 1nF load capacitor and provide a current of 60mA. The next prototype showcases a method to reduce the power consumption of a VCO-OTA and spurs at the VCO frequency, with an application in the design of a fourth-order Butterworth filter at 4MHz. The thesis concludes with a design example of 0.2V VCO-OTA

Power efficient analog-to-digital converters using both voltage and time domain information

As advanced wired and wireless communication systems attempt to achieve higher performance, the demand for high resolution and wide signal bandwidth in their associated ADCs is strongly increased. Recently, time-domain quantization has drawn attention from its scalability in deep submicron CMOS processes. Furthermore, there are several interesting aspects of time-domain quantizer by processing the signal in time rather than only in voltage domain especially for power efficiency. This research focuses on developing a new architecture for power efficient, high resolution ADCs using both voltage and time domain information. As a first approach, a new ΔƩ ADC based on a noise-shaped two-step integrating quantizer which quantizes the signal in voltage and time domains is presented. Attaining an extra order of noise-shaping from the integrating quantizer, the proposed ΔƩ ADC manifests a second-order noise-shaping with a first-order loop filter. Furthermore, this quantizer provides an 8b uantization in itself, drastically reducing the oversampling requirement. The proposed ADC also incorporates a new feedback DAC topology that alleviates the feedback DAC complexity of a two-step 8b quantizer. The measured results of the prototype ADC implemented in a 0.13μm CMOS demonstrate peak SNDR of 70.7dB (11.5b ENOB) at 8.1mW power, with an 8x OSR at 80MHz sampling frequency. To further improve ADC performance, a Nyquist ADC based on a time-based pipelined TDC is also proposed as a second approach. In this work, a simple V-T conversion scheme with a cheap low gain amplifier in its first stage and a hybrid time-domain quantization stage based on simple charge pump and capacitive DAC in its backend stages, are also proposed to improve ADC linearity and power efficiency. Using voltage and time domain information, the proposed ADC architecture is beneficial for both resolution and power efficiency, with MSBs resolved in voltage domain and LSBs in time domain. The measured results of the prototype ADC implemented in a 0.13μm CMOS demonstrate peak SNDR of 69.3dB (11.2b ENOB) at 6.38mW power and 70MHz sampling frequency. The FOM is 38.2fJ/conversion-step

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.