1,003 research outputs found

    14-bit 2.2-MS/s sigma-delta ADC's

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    Application of LSI to signal detection: The deltic DFPCC

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    The development of the DELTIC DFPCC serial mode signal processor is discussed. The processor is designed to detect in the presence of background noise a signal coded into the zero crossings of the waveform. The unique features of the DELTIC DFPCC include versatility in handling a variety of signals and relative simplicity in implementation. A theoretical performance model is presented which predicts the expected value of the output signal as a function of the input signal to noise ratio. Experimental results obtained with the prototype system, which was breadboarded with LSI, MSI and SSI components, are given. The device was compared with other LSI schemes for signal processing and it was concluded that the DELTIC DFPCC is simpler and in some cases more versatile than other systems. With established LSI technology, low frequency systems applicable to sonar and similar problems are feasible

    Preliminary candidate advanced avionics system for general aviation

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    An integrated avionics system design was carried out to the level which indicates subsystem function, and the methods of overall system integration. Sufficient detail was included to allow identification of possible system component technologies, and to perform reliability, modularity, maintainability, cost, and risk analysis upon the system design. Retrofit to older aircraft, availability of this system to the single engine two place aircraft, was considered

    Second year technical report on-board processing for future satellite communications systems

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    Advanced baseband and microwave switching techniques for large domestic communications satellites operating in the 30/20 GHz frequency bands are discussed. The nominal baseband processor throughput is one million packets per second (1.6 Gb/s) from one thousand T1 carrier rate customer premises terminals. A frequency reuse factor of sixteen is assumed by using 16 spot antenna beams with the same 100 MHz bandwidth per beam and a modulation with a one b/s per Hz bandwidth efficiency. Eight of the beams are fixed on major metropolitan areas and eight are scanning beams which periodically cover the remainder of the U.S. under dynamic control. User signals are regenerated (demodulated/remodulated) and message packages are reformatted on board. Frequency division multiple access and time division multiplex are employed on the uplinks and downlinks, respectively, for terminals within the coverage area and dwell interval of a scanning beam. Link establishment and packet routing protocols are defined. Also described is a detailed design of a separate 100 x 100 microwave switch capable of handling nonregenerated signals occupying the remaining 2.4 GHz bandwidth with 60 dB of isolation, at an estimated weight and power consumption of approximately 400 kg and 100 W, respectively

    Product assurance technology for custom LSI/VLSI electronics

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    The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

    Electromagnetic Interference (EMI) of System-on-Package (SOP)

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    Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration

    PIC based hand-held IC tester

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    Nowadays, electrical devices are very common in our life, for example televisions, computers, cellular phones, remote control, automobile etc. All the electrical devices consist of integrated circuits (ICs). As the FKEE students, dealing with ICs has become a norm. However, the IC tester used in laboratory to verify the availability of the ICs is big, not portable, heavy and expensive. Thus, a hand-held IC tester is developed to test common ICs used in the laboratory. In this project, the microcontroller used is PIC18F4525 to control the operation of the system. In addition, it is equipped with a numerical keypad, keypad encoder, IC socket, liquid crystal display screen, beeper and a 9V cell battery power supply. The ICs to-be-tested will be placed into IC socket. The code of the IC will be keyed in by using the keypad. Then, the outcome of the test will be shown at the LCD screen and beeper to indicate the status of the ICs. The system is compact, portable and can test various forms of 20 pins ICs such as basic logic gate, multiplexer, de-multiplexer, encoder, decoder, counter, flip-flop, and etc
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