Doctor of Philosophy

dissertationThe design of integrated circuit (IC) requires an exhaustive verification and a thorough test mechanism to ensure the functionality and robustness of the circuit. This dissertation employs the theory of relative timing that has the advantage of enabling designers to create designs that have significant power and performance over traditional clocked designs. Research has been carried out to enable the relative timing approach to be supported by commercial electronic design automation (EDA) tools. This allows asynchronous and sequential designs to be designed using commercial cad tools. However, two very significant holes in the flow exist: the lack of support for timing verification and manufacturing test. Relative timing (RT) utilizes circuit delay to enforce and measure event sequencing on circuit design. Asynchronous circuits can optimize power-performance product by adjusting the circuit timing. A thorough analysis on the timing characteristic of each and every timing path is required to ensure the robustness and correctness of RT designs. All timing paths have to conform to the circuit timing constraints. This dissertation addresses back-end design robustness by validating full cyclical path timing verification with static timing analysis and implementing design for testability (DFT). Circuit reliability and correctness are necessary aspects for the technology to become commercially ready. In this study, scan-chain, a commercial DFT implementation, is applied to burst-mode RT designs. In addition, a novel testing approach is developed along with scan-chain to over achieve 90% fault coverage on two fault models: stuck-at fault model and delay fault model. This work evaluates the cost of DFT and its coverage trade-off then determines the best implementation. Designs such as a 64-point fast Fourier transform (FFT) design, an I2C design, and a mixed-signal design are built to demonstrate power, area, performance advantages of the relative timing methodology and are used as a platform for developing the backend robustness. Results are verified by performing post-silicon timing validation and test. This work strengthens overall relative timed circuit flow, reliability, and testability

Power supply noise in delay testing

As technology scales into the Deep Sub-Micron (DSM) regime, circuit designs have become more and more sensitive to power supply noise. Excessive noise can significantly affect the timing performance of DSM designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This will eventually result in delay test overkill. To reduce this overkill, we propose a low-cost pattern-dependent approach to analyze noise-induced delay variation for each delay test pattern applied to the design. Two noise models have been proposed to address array bond and wire bond power supply networks, and they are experimentally validated and compared. Delay model is then applied to calculate path delay under noise. This analysis approach can be integrated into static test compaction or test fill tools to control supply noise level of delay tests. We also propose an algorithm to predict transition count of a circuit, which can be applied to control switching activity during dynamic compaction. Experiments have been performed on ISCAS89 benchmark circuits. Results show that compacted delay test patterns generated by our compaction tool can meet a moderate noise or delay constraint with only a small increase in compacted test set size. Take the benchmark circuit s38417 for example: a 10% delay increase constraint only results in 1.6% increase in compacted test set size in our experiments. In addition, different test fill techniques have a significant impact on path delay. In our work, a test fill tool with supply noise analysis has been developed to compare several test fill techniques, and results show that the test fill strategy significant affect switching activity, power supply noise and delay. For instance, patterns with minimum transition fill produce less noise-induced delay than random fill. Silicon results also show that test patterns filled in different ways can cause as much as 14% delay variation on target paths. In conclusion, we must take noise into consideration when delay test patterns are generated

Analog System-on-a-Chip with Application to Biosensors

This dissertation facilitates the design and fabrication of analog systems-on-a-chip (SoCs). In this work an analog SoC is developed with application to organic fluid analysis. The device contains a built-in self-test method for performing on-chip analysis of analog macros. The analog system-on-a-chip developed in this dissertation can be used to evaluate the properties of fluids for medical diagnoses. The research herein described covers the development of: analog SoC models, an improved set of chemical sensor arrays, a self-contained system-on-a-chip for the determination of fluid properties, and a method of performing on-chip testing of analog SoC sub-blocks

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits