137 research outputs found
MISSED: an environment for mixed-signal microsystem testing and diagnosis
A tight link between design and test data is proposed for speeding up test-pattern generation and diagnosis during mixed-signal prototype verification. Test requirements are already incorporated at the behavioral level and specified with increased detail at lower hierarchical levels. A strict distinction between generic routines and implementation data makes reuse of software possible. A testability-analysis tool and test and DFT libraries support the designer to guarantee testability. Hierarchical backtrace procedures in combination with an expert system and fault libraries assist the designer during mixed-signal chip debuggin
On the test of single via related defects in digital VLSI designs
Vias are critical for digital circuit manufacturing, as they represent a common defect location, and a general DfM rule suggests replicating every instance for redundancy. When this is not achievable, a mandatory requirement is that the remaining single vias must be tested. We propose an automated method for generating tests and accurately evaluating test coverage of such defects, ready for use in any digital implementation flow and for integration within EDA tools, and also providing a useful quality metric. A prototype tool implementation and experimental results for an industrial case study are presented
Modeling and Generation of Test Patterns for Mixed-Signal Boards: Dealing With Basic Signals
International audienceIn the context of maintenance testing and diagnosis of faulty boards, a functional FSM (Finite State Machine)-based model for mixed-signal board has been introduced. The board is broken down into interconnected functional blocks. Each block has an associated functional model which describes its behavior and a test model which specifies how the block can be efficiently tested. A test model for a block is created by merging its functional model and a chosen test strategy. The board checking consists in testing each block individually using its test model and functional models of other blocks. Test patterns for a component are generated by covering the transitions of its test model and propagation to primary inputs/outputs through functional models of other blocks. The board test data set is built by using the test patterns for all the blocks of the board. The current improvement of the method deals with basic signals
Cost modelling and concurrent engineering for testable design
This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system.
This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems.
The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented
Ein Testmustergenerator unter 16-wertiger Logik mit variabler Fehlermodellierung
Die Mikroelektronik hält zunehmend Einzug in Bereiche unseres täglichen Lebens. Die Abhängigkeit des Menschen von der Technik wächst ständig, und damit kommt der Frage nach deren Zuverlässigkeit eine steigende Bedeutung zu. Diese Frage nach der Zuverlässigkeit stellt sich insbesondere bei der Fertigung hochintegrierter Schaltkreise. Leider ist die Chipfertigung, sich immer an der Grenze des technisch machbaren bewegend, sehr fehleranfällig. Defektraten von über 40% sind im VLSI Bereich keine Seltenheit. Man benötigt darum unbedingt leistungsfähige Verfahren, die gefertigte Chips auf ihre Korrektheit überprüfen, sie also testen. Welche Bedeutung der Fertigungstest in der Chipfertigung einnimmt, zeigt eine Schätzung von Milne [Mil85], nach der heute mehr als 25% der Produktkosten im VLSI Bereich auf den Testvorgang entfallen
Test Strategies for Low Power Devices
Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German
An Enhanced Evolutionary Technique for the Generation of Compact Reconfigurable Scan-Network Tests
Nowadays many Integrated Systems embed auxiliary on-chip instruments whose function is to perform test, debug, calibration, configuration, etc. The growing complexity and the increasing number of these instruments have led to new solutions for their access and control, such as the IEEE 1687 standard. The standard introduces an infrastructure composed of scan chains incorporating configurable elements for accessing the instruments in a flexible manner. Such an infrastructure is known as Reconfigurable Scan Network or RSN. Since permanent faults affecting the circuitry can cause malfunction, i.e., inappropriate behaviour, detecting them is of utmost importance. This paper addresses the issue of generating effective sequences for testing the reconfigurable elements within RSNs using evolutionary computation. Test configurations are extracted with automatic test pattern generation (ATPG) and used to guide the evolution. Postprocessing techniques are proposed to improve the evolutionary fittest solution. Results on a standard set of benchmark networks show up to 27% reduced test time with respect to test generation based on RSN exploratio
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Efficient verification/testing of system-on-chip through fault grading and analog behavioral modeling
textThis dissertation presents several cost-effective production test solutions using fault grading and mixed-signal design verification cases enabled by analog behavioral modeling. Although the latest System-on-Chip (SOC) is getting denser, faster, and more complex, the manufacturing technology is dominated by subtle defects that are introduced by small-scale technology. Thus, SOC requires more mature testing strategies. By performing various types of testing, better quality SoC can be manufactured, but test resources are too limited to accommodate all those tests. To create the most efficient production test flow, any redundant or ineffective tests need to be removed or minimized.
Chapter 3 proposes new method of test data volume reduction by combining the nonlinear property of feedback shift register (FSR) and dictionary coding. Instead of using the nonlinear FSR for actual hardware implementation, the expanded test set by nonlinear expansion is used as the one-column test sets and provides big reduction ratio for the test data volume. The experimental results show the combined method reduced the total test data volume and increased the fault coverage. Due to the increased number of test patterns, total test time is increased.
Chapter 4 addresses a whole process of functional fault grading. Fault grading has always been a ”desire-to-have” flow because it can bring up significant value for cost saving and yield analysis. However, it is very hard to perform the fault grading on the complex large scale SOC. A commercial tool called Z01X is used as a fault grading platform, and whole fault grading process is coordinated and each detailed execution is performed. Simulation- based functional fault grading identifies the quality of the given functional tests against the static faults and transition delay faults. With the structural tests and functional tests, functional fault grading can indicate the way to achieve the same test coverage by spending minimal test time. Compared to the consumed time and resource for fault grading, the contribution to the test time saving might not be acceptable as very promising, but the fault grading data can be reused for yield analysis and test flow optimization. For the final production testing, confident decisions on the functional test selection can be made based on the fault grading results.
Chapter 5 addresses the challenges of Package-on-Package (POP) testing. Because POP devices have pins on both the top and the bottom of the package, the increased test pins require more test channels to detect packaging defects. Boundary scan chain testing is used to detect those continuity defects by relying on leakage current from the power supply. This proposed test scheme does not require direct test channels on the top pins. Based on the counting algorithm, minimal numbers of test cycles are generated, and the test achieved full test coverage for any combinations of pin-to-pin shortage defects on the top pins of the POP package. The experimental results show about 10 times increased leakage current from the shorted defect. Also, it can be expanded to multi-site testing with less test channels for high-volume production.
Fault grading is applied within different structural test categories in Chapter 6. Stuck-at faults can be considered as TDFs having infinite delay. Hence, the TDF Automatic Test Pattern Generation (ATPG) tests can detect both TDFs and stuck-at faults. By removing the stuck-at faults being detected by the given TDF ATPG tests, the tests that target stuck-at faults can be reduced, and the reduced stuck-at fault set results in fewer stuck-at ATPG patterns. The structural test time is reduced while keeping the same test coverage. This TDF grading is performed with the same ATPG tool used to generate the stuck-at and TDF ATPG tests.
To expedite the mixed-signal design verification of complex SoC, analog behavioral modeling methods and strategies are addressed in Chapter 7 and case studies for detailed verification with actual mixed-signal design are ad- dressed in Chapter 8. Analog modeling effort can enhance verification quality for a mixed-signal design with less turnaround time, and it enables compatible integration of the mixed-signal design cores into the SoC. The modeling process may reveal any potential design errors or incorrect testbench setup, and it results in minimizing unnecessary debugging time for quality devices.
Two mixed-signal design cases were verified by me using the analog models. A fully hierarchical digital-to-analog converter (DAC) model is implemented and silicon mismatches caused by process variation are modeled and inserted into the DAC model, and the calibration algorithm for the DAC is successfully verified by model-based simulation at the full DAC-level. When the mismatch amount is increased and exceeded the calibration capability of the DAC, the simulation results show the increased calibration error with some outliers. This verification method can identify the saturation range of the DAC and predict the yield of the devices from process variation.
A phase-locked loop (PLL) design cases were also verified by me using the analog model. Both open-loop PLL model and closed-loop PLL model cases are presented. Quick bring-up of open-loop PLL model provides low simulation overhead for widely-used PLLs in the SOC and enables early starting of design verification for the upper-level design using the PLL generated clocks. Accurate closed-loop PLL model is implemented for DCO-based PLL design, and the mixed-simulation with analog models and schematic designs enables flexible analog verification. Only focused analog design block is set to the schematic design and the rest of the analog design is replaced by the analog model. Then, this scaled-down SPICE simulation is performed about 10 times to 100 times faster than full-scale SPICE simulation. The analog model of the focused block is compared with the scaled-down SPICE simulation result and the quality of the model is iteratively enhanced. Hence, the analog model enables both compatible integration and flexible analog design verification.
This dissertation contributes to reduce test time and to enhance test quality, and helps to set up efficient production testing flows. Depending on the size and performance of CUT, proper testing schemes can maximize the efficiency of production testing. The topics covered in this dissertation can be used in optimizing the test flow and selecting the final production tests to achieve maximum test capability. In addition, the strategies and benefits of analog behavioral modeling techniques that I implemented are presented, and actual verification cases shows the effectiveness of analog modeling for better quality SoC products.Electrical and Computer Engineerin
Doctor of Philosophy
dissertationThe design of integrated circuit (IC) requires an exhaustive verification and a thorough test mechanism to ensure the functionality and robustness of the circuit. This dissertation employs the theory of relative timing that has the advantage of enabling designers to create designs that have significant power and performance over traditional clocked designs. Research has been carried out to enable the relative timing approach to be supported by commercial electronic design automation (EDA) tools. This allows asynchronous and sequential designs to be designed using commercial cad tools. However, two very significant holes in the flow exist: the lack of support for timing verification and manufacturing test. Relative timing (RT) utilizes circuit delay to enforce and measure event sequencing on circuit design. Asynchronous circuits can optimize power-performance product by adjusting the circuit timing. A thorough analysis on the timing characteristic of each and every timing path is required to ensure the robustness and correctness of RT designs. All timing paths have to conform to the circuit timing constraints. This dissertation addresses back-end design robustness by validating full cyclical path timing verification with static timing analysis and implementing design for testability (DFT). Circuit reliability and correctness are necessary aspects for the technology to become commercially ready. In this study, scan-chain, a commercial DFT implementation, is applied to burst-mode RT designs. In addition, a novel testing approach is developed along with scan-chain to over achieve 90% fault coverage on two fault models: stuck-at fault model and delay fault model. This work evaluates the cost of DFT and its coverage trade-off then determines the best implementation. Designs such as a 64-point fast Fourier transform (FFT) design, an I2C design, and a mixed-signal design are built to demonstrate power, area, performance advantages of the relative timing methodology and are used as a platform for developing the backend robustness. Results are verified by performing post-silicon timing validation and test. This work strengthens overall relative timed circuit flow, reliability, and testability
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