On the Scalability of Data Reduction Techniques in Current and Upcoming HPC Systems from an Application Perspective

We implement and benchmark parallel I/O methods for the fully-manycore driven particle-in-cell code PIConGPU. Identifying throughput and overall I/O size as a major challenge for applications on today's and future HPC systems, we present a scaling law characterizing performance bottlenecks in state-of-the-art approaches for data reduction. Consequently, we propose, implement and verify multi-threaded data-transformations for the I/O library ADIOS as a feasible way to trade underutilized host-side compute potential on heterogeneous systems for reduced I/O latency.Comment: 15 pages, 5 figures, accepted for DRBSD-1 in conjunction with ISC'1

Characterizing Deep-Learning I/O Workloads in TensorFlow

The performance of Deep-Learning (DL) computing frameworks rely on the performance of data ingestion and checkpointing. In fact, during the training, a considerable high number of relatively small files are first loaded and pre-processed on CPUs and then moved to accelerator for computation. In addition, checkpointing and restart operations are carried out to allow DL computing frameworks to restart quickly from a checkpoint. Because of this, I/O affects the performance of DL applications. In this work, we characterize the I/O performance and scaling of TensorFlow, an open-source programming framework developed by Google and specifically designed for solving DL problems. To measure TensorFlow I/O performance, we first design a micro-benchmark to measure TensorFlow reads, and then use a TensorFlow mini-application based on AlexNet to measure the performance cost of I/O and checkpointing in TensorFlow. To improve the checkpointing performance, we design and implement a burst buffer. We find that increasing the number of threads increases TensorFlow bandwidth by a maximum of 2.3x and 7.8x on our benchmark environments. The use of the tensorFlow prefetcher results in a complete overlap of computation on accelerator and input pipeline on CPU eliminating the effective cost of I/O on the overall performance. The use of a burst buffer to checkpoint to a fast small capacity storage and copy asynchronously the checkpoints to a slower large capacity storage resulted in a performance improvement of 2.6x with respect to checkpointing directly to slower storage on our benchmark environment.Comment: Accepted for publication at pdsw-DISCS 201

Main memory in HPC: do we need more, or could we live with less?

An important aspect of High-Performance Computing (HPC) system design is the choice of main memory capacity. This choice becomes increasingly important now that 3D-stacked memories are entering the market. Compared with conventional Dual In-line Memory Modules (DIMMs), 3D memory chiplets provide better performance and energy efficiency but lower memory capacities. Therefore, the adoption of 3D-stacked memories in the HPC domain depends on whether we can find use cases that require much less memory than is available now. This study analyzes the memory capacity requirements of important HPC benchmarks and applications. We find that the High-Performance Conjugate Gradients (HPCG) benchmark could be an important success story for 3D-stacked memories in HPC, but High-Performance Linpack (HPL) is likely to be constrained by 3D memory capacity. The study also emphasizes that the analysis of memory footprints of production HPC applications is complex and that it requires an understanding of application scalability and target category, i.e., whether the users target capability or capacity computing. The results show that most of the HPC applications under study have per-core memory footprints in the range of hundreds of megabytes, but we also detect applications and use cases that require gigabytes per core. Overall, the study identifies the HPC applications and use cases with memory footprints that could be provided by 3D-stacked memory chiplets, making a first step toward adoption of this novel technology in the HPC domain.This work was supported by the Collaboration Agreement between Samsung Electronics Co., Ltd. and BSC, Spanish Government through Severo Ochoa programme (SEV-2015-0493), by the Spanish Ministry of Science and Technology through TIN2015-65316-P project and by the Generalitat de Catalunya (contracts 2014-SGR-1051 and 2014-SGR-1272). This work has also received funding from the European Union’s Horizon 2020 research and innovation programme under ExaNoDe project (grant agreement No 671578). Darko Zivanovic holds the Severo Ochoa grant (SVP-2014-068501) of the Ministry of Economy and Competitiveness of Spain. The authors thank Harald Servat from BSC and Vladimir Marjanovi´c from High Performance Computing Center Stuttgart for their technical support.Postprint (published version