10 research outputs found

    Performance Evaluation for Stacked-Layer Data Bus Based on Isolated Unit-Size Repeater Insertion

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    The data bus of a stacked-layer chip always supports that data of a program are frequently running on the bus at different timing periods. The average data access time of a data bus to the timing periods dominates the program performance. In this paper, we proposed an evaluated approach to reconstruct a 3D data bus with inserted unit-size repeaters to motivate that the average data access time of the bus on a complete timing period can speed up at least 10%. The approach is trying to insert a number of unit-size repeaters into bus wires along the path of a source-sink pair for isolating extra capacitive loadings at each timing period to reduce their access time. The above process is repeated until no any improvement for each access time. Each inserted repeater with just one unit size due to the limited space of a chip area and the minor reconstruction of a data bus in practical. The approach has the advantages of uniform repeater insertion, less extra area occupation, and simplified time-to-space tradeoff. Experimental results show that our approach has the rapid capable evaluation for a stacked-layer data bus within one millisecond and the saving in average access time is up to 50.81% with the inserted repeater sizes of 70 on average

    Energy reduction in 3D NoCs through communication optimization

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    Cataloged from PDF version of article.Network-on-Chip (NoC) architectures and three-dimensional (3D) integrated circuits have been introduced as attractive options for overcoming the barriers in interconnect scaling while increasing the number of cores. Combining these two approaches is expected to yield better performance and higher scalability. This paper explores the possibility of combining these two techniques in a heterogeneity aware fashion. Specifically, on a heterogeneous 3D NoC architecture, we explore how different types of processors can be optimally placed to minimize data access costs. Moreover, we select the optimal set of links with optimal voltage levels. The experimental results indicate significant savings in energy consumption across a wide range of values of our major simulation parameters

    Path-Based partitioning methods for 3D Networks-on-Chip with minimal adaptive routing

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    © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Combining the benefits of 3D ICs and Networks-on-Chip (NoCs) schemes provides a significant performance gain in Chip Multiprocessors (CMPs) architectures. As multicast communication is commonly used in cache coherence protocols for CMPs and in various parallel applications, the performance of these systems can be significantly improved if multicast operations are supported at the hardware level. In this paper, we present several partitioning methods for the path-based multicast approach in 3D mesh-based NoCs, each with different levels of efficiency. In addition, we develop novel analytical models for unicast and multicast traffic to explore the efficiency of each approach. In order to distribute the unicast and multicast traffic more efficiently over the network, we propose the Minimal and Adaptive Routing (MAR) algorithm for the presented partitioning methods. The analytical and experimental results show that an advantageous method named Recursive Partitioning (RP) outperforms the other approaches. RP recursively partitions the network until all partitions contain a comparable number of switches and thus the multicast traffic is equally distributed among several subsets and the network latency is considerably decreased. The simulation results reveal that the RP method can achieve performance improvement across all workloads while performance can be further improved by utilizing the MAR algorithm. Nineteen percent average and 42 percent maximum latency reduction are obtained on SPLASH-2 and PARSEC benchmarks running on a 64-core CMP.Ebrahimi, M.; Daneshtalab, M.; Liljeberg, P.; Plosila, J.; Flich Cardo, J.; Tenhunen, H. (2014). Path-Based partitioning methods for 3D Networks-on-Chip with minimal adaptive routing. IEEE Transactions on Computers. 63(3):718-733. doi:10.1109/TC.2012.255S71873363

    Energy reduction in 3D NoCs through communication optimization

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    Network-on-Chip (NoC) architectures and three-dimensional (3D) integrated circuits have been introduced as attractive options for overcoming the barriers in interconnect scaling while increasing the number of cores. Combining these two approaches is expected to yield better performance and higher scalability. This paper explores the possibility of combining these two techniques in a heterogeneity aware fashion. Specifically, on a heterogeneous 3D NoC architecture, we explore how different types of processors can be optimally placed to minimize data access costs. Moreover, we select the optimal set of links with optimal voltage levels. The experimental results indicate significant savings in energy consumption across a wide range of values of our major simulation parameters. © 2013, Springer-Verlag Wien

    Adaptive Routing Approaches for Networked Many-Core Systems

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    Through advances in technology, System-on-Chip design is moving towards integrating tens to hundreds of intellectual property blocks into a single chip. In such a many-core system, on-chip communication becomes a performance bottleneck for high performance designs. Network-on-Chip (NoC) has emerged as a viable solution for the communication challenges in highly complex chips. The NoC architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication challenges such as wiring complexity, communication latency, and bandwidth. Furthermore, the combined benefits of 3D IC and NoC schemes provide the possibility of designing a high performance system in a limited chip area. The major advantages of 3D NoCs are the considerable reductions in average latency and power consumption. There are several factors degrading the performance of NoCs. In this thesis, we investigate three main performance-limiting factors: network congestion, faults, and the lack of efficient multicast support. We address these issues by the means of routing algorithms. Congestion of data packets may lead to increased network latency and power consumption. Thus, we propose three different approaches for alleviating such congestion in the network. The first approach is based on measuring the congestion information in different regions of the network, distributing the information over the network, and utilizing this information when making a routing decision. The second approach employs a learning method to dynamically find the less congested routes according to the underlying traffic. The third approach is based on a fuzzy-logic technique to perform better routing decisions when traffic information of different routes is available. Faults affect performance significantly, as then packets should take longer paths in order to be routed around the faults, which in turn increases congestion around the faulty regions. We propose four methods to tolerate faults at the link and switch level by using only the shortest paths as long as such path exists. The unique characteristic among these methods is the toleration of faults while also maintaining the performance of NoCs. To the best of our knowledge, these algorithms are the first approaches to bypassing faults prior to reaching them while avoiding unnecessary misrouting of packets. Current implementations of multicast communication result in a significant performance loss for unicast traffic. This is due to the fact that the routing rules of multicast packets limit the adaptivity of unicast packets. We present an approach in which both unicast and multicast packets can be efficiently routed within the network. While suggesting a more efficient multicast support, the proposed approach does not affect the performance of unicast routing at all. In addition, in order to reduce the overall path length of multicast packets, we present several partitioning methods along with their analytical models for latency measurement. This approach is discussed in the context of 3D mesh networks.Siirretty Doriast

    Big Data and Artificial Intelligence in Digital Finance

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    This open access book presents how cutting-edge digital technologies like Big Data, Machine Learning, Artificial Intelligence (AI), and Blockchain are set to disrupt the financial sector. The book illustrates how recent advances in these technologies facilitate banks, FinTech, and financial institutions to collect, process, analyze, and fully leverage the very large amounts of data that are nowadays produced and exchanged in the sector. To this end, the book also describes some more the most popular Big Data, AI and Blockchain applications in the sector, including novel applications in the areas of Know Your Customer (KYC), Personalized Wealth Management and Asset Management, Portfolio Risk Assessment, as well as variety of novel Usage-based Insurance applications based on Internet-of-Things data. Most of the presented applications have been developed, deployed and validated in real-life digital finance settings in the context of the European Commission funded INFINITECH project, which is a flagship innovation initiative for Big Data and AI in digital finance. This book is ideal for researchers and practitioners in Big Data, AI, banking and digital finance

    Big Data and Artificial Intelligence in Digital Finance

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    This open access book presents how cutting-edge digital technologies like Big Data, Machine Learning, Artificial Intelligence (AI), and Blockchain are set to disrupt the financial sector. The book illustrates how recent advances in these technologies facilitate banks, FinTech, and financial institutions to collect, process, analyze, and fully leverage the very large amounts of data that are nowadays produced and exchanged in the sector. To this end, the book also describes some more the most popular Big Data, AI and Blockchain applications in the sector, including novel applications in the areas of Know Your Customer (KYC), Personalized Wealth Management and Asset Management, Portfolio Risk Assessment, as well as variety of novel Usage-based Insurance applications based on Internet-of-Things data. Most of the presented applications have been developed, deployed and validated in real-life digital finance settings in the context of the European Commission funded INFINITECH project, which is a flagship innovation initiative for Big Data and AI in digital finance. This book is ideal for researchers and practitioners in Big Data, AI, banking and digital finance

    Unmanned Aerial Vehicle (UAV)-Enabled Wireless Communications and Networking

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    The emerging massive density of human-held and machine-type nodes implies larger traffic deviatiolns in the future than we are facing today. In the future, the network will be characterized by a high degree of flexibility, allowing it to adapt smoothly, autonomously, and efficiently to the quickly changing traffic demands both in time and space. This flexibility cannot be achieved when the network’s infrastructure remains static. To this end, the topic of UAVs (unmanned aerial vehicles) have enabled wireless communications, and networking has received increased attention. As mentioned above, the network must serve a massive density of nodes that can be either human-held (user devices) or machine-type nodes (sensors). If we wish to properly serve these nodes and optimize their data, a proper wireless connection is fundamental. This can be achieved by using UAV-enabled communication and networks. This Special Issue addresses the many existing issues that still exist to allow UAV-enabled wireless communications and networking to be properly rolled out

    HIBS — Novel inter-layer bus structure for stacked architectures

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