Use It or Lose It: Proactive, Deterministic Longevity in Future Chip Multiprocessors

Ever since the VLSI process technology crossed the sub-micron threshold, there is an increased interest in design of fault-tolerant systems to mitigate the wearout of transistors. Hot Carrier Injection (HCI) and Negative Bias Temperature Instability (NBTI) are two prominent usage based transistor degradation mechanisms in the deep sub-micron process technologies. This wearout of transistors can lead to timing violations along the critical paths which will eventually lead to permanent failures of the chip. While there have been many studies which concentrate on decreasing the wearout in a single core, the failure of an individual core need not be catastrophic in the context of Chip Multi-Processors (CMPs). However, a failure in the interconnect in these CMPs can lead to the failure of entire chip as it could lead to protocol-level deadlocks, or even partition away vital components such as the memory controller or other critical I/O. Analysis of HCI and NBTI stresses caused by real workloads on interconnect microachitecture shows that wearout in the CMP on-chip interconnect is correlated with lack of load observed in the network-on-chip routers. It is proven that exercising the wearout-sensitive components of routers under low load with random inputs can decelerate the NBTI wearout. In this work, we propose a novel deterministic approach for the generation of appropriate exercise mode data to maximize the life-time improvement, ensuring design parameter targets are met. The results from this new proposed design yields ~2300x decrease in the rate of CMP wear due to NBTI compared to that of ~28x decrease shown by previous work

Energy and Reliability in Future NOC Interconnected CMPS

In this dissertation, I explore energy and reliability in future NoC (Network-on-Chip) interconnected CMPs (chip multiprocessors) as they have become a first-order constraint in future CMP design. In the first part, we target the root cause of network energy consumption through techniques that reduce link and router-level switching activity. We specifically focus on memory subsystem traffic, as it comprises the bulk of NoC load in a CMP. By transmitting only the flits that contain words that we predicted would be useful using a novel spatial locality predictor, our scheme seeks to reduce network activity. We aim to further lower NoC energy consumption through microarchitectural mechanisms that inhibit datapath switching activity caused by unused words in individual flits. Using simulation-based performance studies and detailed energy models based on synthesized router designs and different link wire types, we show that (a) the pre- diction mechanism achieves very high accuracy, with an average rate of false-unused prediction of just 2.5%; (b) the combined NoC energy savings enabled by the predictor and microarchitectural support are 36% on average and up to 57% in the best case; and (c) there is no system performance penalty as a result of this technique. In the second part, we present a method for dynamic voltage/frequency scaling of networks-on-chip and last level caches in CMP designs, where the shared resources form a single voltage/frequency domain. We develop a new technique for monitoring and control and validate it by running PARSEC benchmarks through full system simulations. These techniques reduce energy-delay product by 46% compared to a state-of-the-art prior work. In the third part, we develop critical path models for HCI- and NBTI-induced wear assuming stress caused under realistic workload conditions, and apply them onto the interconnect microarchitecture. A key finding from this modeling is that, counter to prevailing wisdom, wearout in the CMP on-chip interconnect is correlated with a lack of load observed in the NoC routers, rather than high load. We then develop a novel wearout-decelerating scheme in which routers under low load have their wearout-sensitive components exercised without significantly impacting the router’s cycle time, pipeline depth, and area or power consumption. We subsequently show that the proposed design yields a 13.8∼65× increase in CMP lifetime

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Run-time management of many-core SoCs: A communication-centric approach

The single core performance hit the power and complexity limits in the beginning of this century, moving the industry towards the design of multi- and many-core system-on-chips (SoCs). The on-chip communication between the cores plays a criticalrole in the performance of these SoCs, with power dissipation, communication latency, scalability to many cores, and reliability against the transistor failures as the main design challenges. Accordingly, we dedicate this thesis to the communicationcentered management of the many-core SoCs, with the goal to advance the state-ofthe-art in addressing these challenges. To this end, we contribute to on-chip communication of many-core SoCs in three main directions. First, we start with a synthesizable SoC with full system simulation. We demonstrate the importance of the networking overhead in a practical system, and propose our sophisticated network interface (NI) that offloads the work from SW to HW. Our results show around 5x and up to 50x higher network performance, compared to previous works. As the second direction of this thesis, we study the significance of run-time application mapping. We demonstrate that contiguous application mapping not only improves the network latency (by 23%) and power dissipation (by 50%), but also improves the system throughput (by 3%) and quality-of-service (QoS) of soft real-time applications (up to 100x less deadline misses). Also our hierarchical run-time application mapping provides 99.41% successful mapping when up to 8 links are broken. As the final direction of the thesis, we propose a fault-tolerant routing algorithm, the maze-routing. It is the first-in-class algorithm that provides guaranteed delivery, a fully-distributed solution, low area overhead (by 16x), and instantaneous reconfiguration (vs. 40K cycles down time of previous works), all at the same time. Besides the individual goals of each contribution, when applicable, we ensure that our solutions scale to extreme network sizes like 12x12 and 16x16. This thesis concludes that the communication overhead and its optimization play a significant role in the performance of many-core SoC

Dynamic Lifetime Reliability and Energy Management for Network-on-Chip based Chip Multiprocessors

In this dissertation, we study dynamic reliability management (DRM) and dynamic energy management (DEM) techniques for network-on-chip (NoC) based chip multiprocessors (CMPs). In the first part, the proposed DRM algorithm takes both the computational and the communication components of the CMP into consideration and combines thread migration and dynamic voltage and frequency scaling (DVFS) as the two primary techniques to change the CMP operation. The goal is to increase the lifetime reliability of the overall system to the desired target with minimal performance degradation. The simulation results on a variety of benchmarks on 16 and 64 core NoC based CMP architectures demonstrate that lifetime reliability can be improved by 100% for an average performance penalty of 7.7% and 8.7% for the two CMP architectures. In the second part of this dissertation, we first propose novel algorithms that employ Kalman filtering and long short term memory (LSTM) for workload prediction. These predictions are then used as the basis on which voltage/frequency (V/F) pairs are selected for each core by an effective dynamic voltage and frequency scaling algorithm whose objective is to reduce energy consumption but without degrading performance beyond the user set threshold. Secondly, we investigate the use of deep neural network (DNN) models for energy optimization under performance constraints in CMPs. The proposed algorithm is implemented in three phases. The first phase collects the training data by employing Kalman filtering for workload prediction and an efficient heuristic algorithm based on DVFS. The second phase represents the training process of the DNN model and in the last phase, the DNN model is used to directly identify V/F pairs that can achieve lower energy consumption without performance degradation beyond the acceptable threshold set by the user. Simulation results on 16 and 64 core NoC based architectures demonstrate that the proposed approach can achieve up to 55% energy reduction for 10% performance degradation constraints. Simulation experiments compare the proposed algorithm against existing approaches based on reinforcement learning and Kalman filtering and show that the proposed DNN technique provides average improvements in energy-delay-product (EDP) of 6.3% and 6% for the 16 core architecture and of 7.4% and 5.5% for the 64 core architecture

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

A Survey of Software-Defined Networks-on-Chip: Motivations, Challenges and Opportunities

Current computing platforms encourage the integration of thousands of processing cores, and their interconnections, into a single chip. Mobile smartphones, IoT, embedded devices, desktops, and data centers use Many-Core Systems-on-Chip (SoCs) to exploit their compute power and parallelism to meet the dynamic workload requirements. Networks-on-Chip (NoCs) lead to scalable connectivity for diverse applications with distinct traffic patterns and data dependencies. However, when the system executes various applications in traditional NoCs—optimized and fixed at synthesis time—the interconnection nonconformity with the different applications’ requirements generates limitations in the performance. In the literature, NoC designs embraced the Software-Defined Networking (SDN) strategy to evolve into an adaptable interconnection solution for future chips. However, the works surveyed implement a partial Software-Defined Network-on-Chip (SDNoC) approach, leaving aside the SDN layered architecture that brings interoperability in conventional networking. This paper explores the SDNoC literature and classifies it regarding the desired SDN features that each work presents. Then, we described the challenges and opportunities detected from the literature survey. Moreover, we explain the motivation for an SDNoC approach, and we expose both SDN and SDNoC concepts and architectures. We observe that works in the literature employed an uncomplete layered SDNoC approach. This fact creates various fertile areas in the SDNoC architecture where researchers may contribute to Many-Core SoCs designs.Las plataformas informáticas actuales fomentan la integración de miles de núcleos de procesamiento y sus interconexiones, en un solo chip. Los smartphones móviles, el IoT, los dispositivos embebidos, los ordenadores de sobremesa y los centros de datos utilizan sistemas en chip (SoC) de muchos núcleos para explotar su potencia de cálculo y paralelismo para satisfacer los requisitos de las cargas de trabajo dinámicas. Las redes en chip (NoC) conducen a una conectividad escalable para diversas aplicaciones con distintos patrones de tráfico y dependencias de datos. Sin embargo, cuando el sistema ejecuta varias aplicaciones en las NoC tradicionales -optimizadas y fijadas en el momento de síntesis, la disconformidad de la interconexión con los requisitos de las distintas aplicaciones genera limitaciones en el rendimiento. En la literatura, los diseños de NoC adoptaron la estrategia de redes definidas por software (SDN) para evolucionar hacia una solución de interconexión adaptable para los futuros chips. Sin embargo, los trabajos estudiados implementan un enfoque parcial de red definida por software en el chip (SDNoC) de SDN, dejando de lado la arquitectura en capas de SDN que aporta interoperabilidad en la red convencional. Este artículo explora la literatura sobre SDNoC y la clasifica en función de las características SDN que presenta cada trabajo. A continuación, describimos los retos y oportunidades detectados a partir del estudio de la literatura. Además, explicamos la motivación para un enfoque SDNoC, y exponemos los conceptos y arquitecturas de SDN y SDNoC. Observamos que los trabajos en la literatura emplean un enfoque SDNoC por capas no completo. Este hecho crea varias áreas fértiles en la arquitectura SDNoC en las que los investigadores pueden contribuir a los diseños de SoCs de muchos núcleos

Resource Management Algorithms for Computing Hardware Design and Operations: From Circuits to Systems

The complexity of computation hardware has increased at an unprecedented rate for the last few decades. On the computer chip level, we have entered the era of multi/many-core processors made of billions of transistors. With transistor budget of this scale, many functions are integrated into a single chip. As such, chips today consist of many heterogeneous cores with intensive interaction among these cores. On the circuit level, with the end of Dennard scaling, continuously shrinking process technology has imposed a grand challenge on power density. The variation of circuit further exacerbated the problem by consuming a substantial time margin. On the system level, the rise of Warehouse Scale Computers and Data Centers have put resource management into new perspective. The ability of dynamically provision computation resource in these gigantic systems is crucial to their performance. In this thesis, three different resource management algorithms are discussed. The first algorithm assigns adaptivity resource to circuit blocks with a constraint on the overhead. The adaptivity improves resilience of the circuit to variation in a cost-effective way. The second algorithm manages the link bandwidth resource in application specific Networks-on-Chip. Quality-of-Service is guaranteed for time-critical traffic in the algorithm with an emphasis on power. The third algorithm manages the computation resource of the data center with precaution on the ill states of the system. Q-learning is employed to meet the dynamic nature of the system and Linear Temporal Logic is leveraged as a tool to describe temporal constraints. All three algorithms are evaluated by various experiments. The experimental results are compared to several previous work and show the advantage of our methods

Software-based and regionally-oriented traffic management in Networks-on-Chip

Since the introduction of chip-multiprocessor systems, the number of integrated cores has been steady growing and workload applications have been adapted to exploit the increasing parallelism. This changed the importance of efficient on-chip communication significantly and the infrastructure has to keep step with these new requirements. The work at hand makes significant contributions to the state-of-the-art of the latest generation of such solutions, called Networks-on-Chip, to improve the performance, reliability, and flexible management of these on-chip infrastructures