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Ensuring Access to Safe and Nutritious Food for All Through the Transformation of Food Systems
A Design Science Research Approach to Smart and Collaborative Urban Supply Networks
Urban supply networks are facing increasing demands and challenges and thus constitute a relevant field for research and practical development. Supply chain management holds enormous potential and relevance for society and everyday life as the flow of goods and information are important economic functions. Being a heterogeneous field, the literature base of supply chain management research is difficult to manage and navigate. Disruptive digital technologies and the implementation of cross-network information analysis and sharing drive the need for new organisational and technological approaches. Practical issues are manifold and include mega trends such as digital transformation, urbanisation, and environmental awareness.
A promising approach to solving these problems is the realisation of smart and collaborative supply networks. The growth of artificial intelligence applications in recent years has led to a wide range of applications in a variety of domains. However, the potential of artificial intelligence utilisation in supply chain management has not yet been fully exploited. Similarly, value creation increasingly takes place in networked value creation cycles that have become continuously more collaborative, complex, and dynamic as interactions in business processes involving information technologies have become more intense.
Following a design science research approach this cumulative thesis comprises the development and discussion of four artefacts for the analysis and advancement of smart and collaborative urban supply networks. This thesis aims to highlight the potential of artificial intelligence-based supply networks, to advance data-driven inter-organisational collaboration, and to improve last mile supply network sustainability. Based on thorough machine learning and systematic literature reviews, reference and system dynamics modelling, simulation, and qualitative empirical research, the artefacts provide a valuable contribution to research and practice
Boosting the Cycle Counting Power of Graph Neural Networks with I-GNNs
Message Passing Neural Networks (MPNNs) are a widely used class of Graph
Neural Networks (GNNs). The limited representational power of MPNNs inspires
the study of provably powerful GNN architectures. However, knowing one model is
more powerful than another gives little insight about what functions they can
or cannot express. It is still unclear whether these models are able to
approximate specific functions such as counting certain graph substructures,
which is essential for applications in biology, chemistry and social network
analysis. Motivated by this, we propose to study the counting power of Subgraph
MPNNs, a recent and popular class of powerful GNN models that extract rooted
subgraphs for each node, assign the root node a unique identifier and encode
the root node's representation within its rooted subgraph. Specifically, we
prove that Subgraph MPNNs fail to count more-than-4-cycles at node level,
implying that node representations cannot correctly encode the surrounding
substructures like ring systems with more than four atoms. To overcome this
limitation, we propose I-GNNs to extend Subgraph MPNNs by assigning
different identifiers for the root node and its neighbors in each subgraph.
I-GNNs' discriminative power is shown to be strictly stronger than Subgraph
MPNNs and partially stronger than the 3-WL test. More importantly, I-GNNs
are proven capable of counting all 3, 4, 5 and 6-cycles, covering common
substructures like benzene rings in organic chemistry, while still keeping
linear complexity. To the best of our knowledge, it is the first linear-time
GNN model that can count 6-cycles with theoretical guarantees. We validate its
counting power in cycle counting tasks and demonstrate its competitive
performance in molecular prediction benchmarks
Zero-Shot Rumor Detection with Propagation Structure via Prompt Learning
The spread of rumors along with breaking events seriously hinders the truth
in the era of social media. Previous studies reveal that due to the lack of
annotated resources, rumors presented in minority languages are hard to be
detected. Furthermore, the unforeseen breaking events not involved in
yesterday's news exacerbate the scarcity of data resources. In this work, we
propose a novel zero-shot framework based on prompt learning to detect rumors
falling in different domains or presented in different languages. More
specifically, we firstly represent rumor circulated on social media as diverse
propagation threads, then design a hierarchical prompt encoding mechanism to
learn language-agnostic contextual representations for both prompts and rumor
data. To further enhance domain adaptation, we model the domain-invariant
structural features from the propagation threads, to incorporate structural
position representations of influential community response. In addition, a new
virtual response augmentation method is used to improve model training.
Extensive experiments conducted on three real-world datasets demonstrate that
our proposed model achieves much better performance than state-of-the-art
methods and exhibits a superior capacity for detecting rumors at early stages.Comment: AAAI 202
Deep Transfer Learning Applications in Intrusion Detection Systems: A Comprehensive Review
Globally, the external Internet is increasingly being connected to the
contemporary industrial control system. As a result, there is an immediate need
to protect the network from several threats. The key infrastructure of
industrial activity may be protected from harm by using an intrusion detection
system (IDS), a preventive measure mechanism, to recognize new kinds of
dangerous threats and hostile activities. The most recent artificial
intelligence (AI) techniques used to create IDS in many kinds of industrial
control networks are examined in this study, with a particular emphasis on
IDS-based deep transfer learning (DTL). This latter can be seen as a type of
information fusion that merge, and/or adapt knowledge from multiple domains to
enhance the performance of the target task, particularly when the labeled data
in the target domain is scarce. Publications issued after 2015 were taken into
account. These selected publications were divided into three categories:
DTL-only and IDS-only are involved in the introduction and background, and
DTL-based IDS papers are involved in the core papers of this review.
Researchers will be able to have a better grasp of the current state of DTL
approaches used in IDS in many different types of networks by reading this
review paper. Other useful information, such as the datasets used, the sort of
DTL employed, the pre-trained network, IDS techniques, the evaluation metrics
including accuracy/F-score and false alarm rate (FAR), and the improvement
gained, were also covered. The algorithms, and methods used in several studies,
or illustrate deeply and clearly the principle in any DTL-based IDS subcategory
are presented to the reader
A Decision Support System for Economic Viability and Environmental Impact Assessment of Vertical Farms
Vertical farming (VF) is the practice of growing crops or animals using the vertical dimension via multi-tier racks or vertically inclined surfaces. In this thesis, I focus on the emerging industry of plant-specific VF. Vertical plant farming (VPF) is a promising and relatively novel practice that can be conducted in buildings with environmental control and artificial lighting. However, the nascent sector has experienced challenges in economic viability, standardisation, and environmental sustainability. Practitioners and academics call for a comprehensive financial analysis of VPF, but efforts are stifled by a lack of valid and available data.
A review of economic estimation and horticultural software identifies a need for a decision support system (DSS) that facilitates risk-empowered business planning for vertical farmers. This thesis proposes an open-source DSS framework to evaluate business sustainability through financial risk and environmental impact assessments. Data from the literature, alongside lessons learned from industry practitioners, would be centralised in the proposed DSS using imprecise data techniques. These techniques have been applied in engineering but are seldom used in financial forecasting. This could benefit complex sectors which only have scarce data to predict business viability.
To begin the execution of the DSS framework, VPF practitioners were interviewed using a mixed-methods approach. Learnings from over 19 shuttered and operational VPF projects provide insights into the barriers inhibiting scalability and identifying risks to form a risk taxonomy. Labour was the most commonly reported top challenge. Therefore, research was conducted to explore lean principles to improve productivity.
A probabilistic model representing a spectrum of variables and their associated uncertainty was built according to the DSS framework to evaluate the financial risk for VF projects. This enabled flexible computation without precise production or financial data to improve economic estimation accuracy. The model assessed two VPF cases (one in the UK and another in Japan), demonstrating the first risk and uncertainty quantification of VPF business models in the literature. The results highlighted measures to improve economic viability and the viability of the UK and Japan case.
The environmental impact assessment model was developed, allowing VPF operators to evaluate their carbon footprint compared to traditional agriculture using life-cycle assessment. I explore strategies for net-zero carbon production through sensitivity analysis. Renewable energies, especially solar, geothermal, and tidal power, show promise for reducing the carbon emissions of indoor VPF. Results show that renewably-powered VPF can reduce carbon emissions compared to field-based agriculture when considering the land-use change.
The drivers for DSS adoption have been researched, showing a pathway of compliance and design thinking to overcome the ‘problem of implementation’ and enable commercialisation. Further work is suggested to standardise VF equipment, collect benchmarking data, and characterise risks. This work will reduce risk and uncertainty and accelerate the sector’s emergence
Educating Sub-Saharan Africa:Assessing Mobile Application Use in a Higher Learning Engineering Programme
In the institution where I teach, insufficient laboratory equipment for engineering education pushed students to learn via mobile phones or devices. Using mobile technologies to learn and practice is not the issue, but the more important question lies in finding out where and how they use mobile tools for learning. Through the lens of Kearney et al.’s (2012) pedagogical model, using authenticity, personalisation, and collaboration as constructs, this case study adopts a mixed-method approach to investigate the mobile learning activities of students and find out their experiences of what works and what does not work. Four questions are borne out of the over-arching research question, ‘How do students studying at a University in Nigeria perceive mobile learning in electrical and electronic engineering education?’ The first three questions are answered from qualitative, interview data analysed using thematic analysis. The fourth question investigates their collaborations on two mobile social networks using social network and message analysis. The study found how students’ mobile learning relates to the real-world practice of engineering and explained ways of adapting and overcoming the mobile tools’ limitations, and the nature of the collaborations that the students adopted, naturally, when they learn in mobile social networks. It found that mobile engineering learning can be possibly located in an offline mobile zone. It also demonstrates that investigating the effectiveness of mobile learning in the mobile social environment is possible by examining users’ interactions. The study shows how mobile learning personalisation that leads to impactful engineering learning can be achieved. The study shows how to manage most interface and technical challenges associated with mobile engineering learning and provides a new guide for educators on where and how mobile learning can be harnessed. And it revealed how engineering education can be successfully implemented through mobile tools
Statistical Learning for Gene Expression Biomarker Detection in Neurodegenerative Diseases
In this work, statistical learning approaches are used to detect biomarkers for neurodegenerative diseases (NDs). NDs are becoming increasingly prevalent as populations age, making understanding of disease and identification of biomarkers progressively important for facilitating early diagnosis and the screening of individuals for clinical trials. Advancements in gene expression profiling has enabled the exploration of disease biomarkers at an unprecedented scale. The work presented here demonstrates the value of gene expression data in understanding the underlying processes and detection of biomarkers of NDs. The value of novel approaches to previously collected -omics data is shown and it is demonstrated that new therapeutic targets can be identified. Additionally, the importance of meta-analysis to improve power of multiple small studies is demonstrated. The value of blood transcriptomics data is shown in applications to researching NDs to understand underlying processes using network analysis and a novel hub detection method. Finally, after demonstrating the value of blood gene expression data for investigating NDs, a combination of feature selection and classification algorithms were used to identify novel accurate biomarker signatures for the diagnosis and prognosis of Parkinson’s disease (PD) and Alzheimer’s disease (AD). Additionally, the use of feature pools based on previous knowledge of disease and the viability of neural networks in dimensionality reduction and biomarker detection is demonstrated and discussed. In summary, gene expression data is shown to be valuable for the investigation of ND and novel gene biomarker signatures for the diagnosis and prognosis of PD and AD
Fiabilité de l’underfill et estimation de la durée de vie d’assemblages microélectroniques
Abstract : In order to protect the interconnections in flip-chip packages, an underfill material layer
is used to fill the volumes and provide mechanical support between the silicon chip and
the substrate. Due to the chip corner geometry and the mismatch of coefficient of thermal
expansion (CTE), the underfill suffers from a stress concentration at the chip corners when
the temperature is lower than the curing temperature. This stress concentration leads
to subsequent mechanical failures in flip-chip packages, such as chip-underfill interfacial
delamination and underfill cracking. Local stresses and strains are the most important
parameters for understanding the mechanism of underfill failures. As a result, the industry
currently relies on the finite element method (FEM) to calculate the stress components, but
the FEM may not be accurate enough compared to the actual stresses in underfill. FEM
simulations require a careful consideration of important geometrical details and material
properties. This thesis proposes a modeling approach that can accurately estimate the underfill delamination
areas and crack trajectories, with the following three objectives. The first
objective was to develop an experimental technique capable of measuring underfill deformations
around the chip corner region. This technique combined confocal microscopy and
the digital image correlation (DIC) method to enable tri-dimensional strain measurements
at different temperatures, and was named the confocal-DIC technique. This techique was
first validated by a theoretical analysis on thermal strains. In a test component similar
to a flip-chip package, the strain distribution obtained by the FEM model was in good
agreement with the results measured by the confocal-DIC technique, with relative errors
less than 20% at chip corners. Then, the second objective was to measure the strain near
a crack in underfills. Artificial cracks with lengths of 160 μm and 640 μm were fabricated
from the chip corner along the 45° diagonal direction. The confocal-DIC-measured
maximum hoop strains and first principal strains were located at the crack front area for
both the 160 μm and 640 μm cracks. A crack model was developed using the extended
finite element method (XFEM), and the strain distribution in the simulation had the same
trend as the experimental results. The distribution of hoop strains were in good agreement
with the measured values, when the model element size was smaller than 22 μm to
capture the strong strain gradient near the crack tip. The third objective was to propose
a modeling approach for underfill delamination and cracking with the effects of manufacturing
variables. A deep thermal cycling test was performed on 13 test cells to obtain the
reference chip-underfill delamination areas and crack profiles. An artificial neural network
(ANN) was trained to relate the effects of manufacturing variables and the number of
cycles to first delamination of each cell. The predicted numbers of cycles for all 6 cells in
the test dataset were located in the intervals of experimental observations. The growth
of delamination was carried out on FEM by evaluating the strain energy amplitude at
the interface elements between the chip and underfill. For 5 out of 6 cells in validation,
the delamination growth model was consistent with the experimental observations. The
cracks in bulk underfill were modelled by XFEM without predefined paths. The directions of edge cracks were in good agreement with the experimental observations, with an error
of less than 2.5°. This approach met the goal of the thesis of estimating the underfill
initial delamination, areas of delamination and crack paths in actual industrial flip-chip
assemblies.Afin de protéger les interconnexions dans les assemblages, une couche de matériau d’underfill est utilisée pour remplir le volume et fournir un support mécanique entre la puce de silicium et le substrat. En raison de la géométrie du coin de puce et de l’écart du coefficient de dilatation thermique (CTE), l’underfill souffre d’une concentration de contraintes dans les coins lorsque la température est inférieure à la température de cuisson. Cette concentration de contraintes conduit à des défaillances mécaniques dans les encapsulations de flip-chip, telles que la délamination interfaciale puce-underfill et la fissuration d’underfill. Les contraintes et déformations locales sont les paramètres les plus importants pour comprendre le mécanisme des ruptures de l’underfill. En conséquent, l’industrie utilise actuellement la méthode des éléments finis (EF) pour calculer les composantes de la contrainte, qui ne sont pas assez précises par rapport aux contraintes actuelles dans l’underfill. Ces simulations nécessitent un examen minutieux de détails géométriques importants et des propriétés des matériaux. Cette thèse vise à proposer une approche de modélisation permettant d’estimer avec précision les zones de délamination et les trajectoires des fissures dans l’underfill, avec les trois objectifs suivants. Le premier objectif est de mettre au point une technique expérimentale capable de mesurer la déformation de l’underfill dans la région du coin de puce. Cette technique, combine la microscopie confocale et la méthode de corrélation des images numériques (DIC) pour permettre des mesures tridimensionnelles des déformations à différentes températures, et a été nommée le technique confocale-DIC. Cette technique a d’abord été validée par une analyse théorique en déformation thermique. Dans un échantillon similaire à un flip-chip, la distribution de la déformation obtenues par le modèle EF était en bon accord avec les résultats de la technique confocal-DIC, avec des erreurs relatives inférieures à 20% au coin de puce. Ensuite, le second objectif est de mesurer la déformation autour d’une fissure dans l’underfill. Des fissures artificielles d’une longueuer de 160 μm et 640 μm ont été fabriquées dans l’underfill vers la direction diagonale de 45°. Les déformations circonférentielles maximales et principale maximale étaient situées aux pointes des fissures correspondantes. Un modèle de fissure a été développé en utilisant la méthode des éléments finis étendue (XFEM), et la distribution des contraintes dans la simuation a montré la même tendance que les résultats expérimentaux. La distribution des déformations circonférentielles maximales était en bon accord avec les valeurs mesurées lorsque la taille des éléments était plus petite que 22 μm, assez petit pour capturer le grand gradient de déformation près de la pointe de fissure. Le troisième objectif était d’apporter une approche de modélisation de la délamination et de la fissuration de l’underfill avec les effets des variables de fabrication. Un test de cyclage thermique a d’abord été effectué sur 13 cellules pour obtenir les zones délaminées entre la puce et l’underfill, et les profils de fissures dans l’underfill, comme référence. Un réseau neuronal artificiel (ANN) a été formé pour établir une liaison entre les effets des variables de fabrication et le nombre de cycles à la délamination pour chaque cellule. Les nombres de cycles prédits pour les 6 cellules de l’ensemble de test étaient situés dans les intervalles d’observations expérimentaux. La croissance de la délamination a été réalisée par l’EF en évaluant l’énergie de la déformation au niveau des éléments interfaciaux entre la puce et l’underfill. Pour 5 des 6 cellules de la validation, le modèle de croissance du délaminage était conforme aux observations expérimentales. Les fissures dans l’underfill ont été modélisées par XFEM sans chemins prédéfinis. Les directions des fissures de bord étaient en bon accord avec les observations expérimentales, avec une erreur inférieure à 2,5°. Cette approche a répondu à la problématique qui consiste à estimer l’initiation des délamination, les zones de délamination et les trajectoires de fissures dans l’underfill pour des flip-chips industriels
Causal-Aware Generative Imputation for Automated Underwriting
Underwriting is an important process in insurance and is concerned with accepting individuals into insurance policy with tolerable claim risk. Underwriting is a tedious and labor intensive process relying on underwriters' domain knowledge and experience, thus is labor intensive and prone to error. Machine learning models are recently applied to automate the underwriting process and thus to ease the burden on the underwriters as well as improve underwriting accuracy. However, observational data used for underwriting modelling is high dimensional, sparse and incomplete, due to the dynamic evolving nature (e.g., upgrade) of business information systems. Simply applying traditional supervised learning methods e.g., logistic regression or Gradient boosting on such highly incomplete data usually leads to the unsatisfactory underwriting result, thus requiring practical data imputation for training quality improvement. In this paper, rather than choosing off-the-shelf solutions tackling the complex data missing problem, we propose an innovative Generative Adversarial Nets (GAN) framework that can capture the missing pattern from a causal perspective. Specifically, we design a structural causal model to learn the causal relations underlying the missing pattern of data. Then, we devise a Causality-aware Generative network (CaGen) using the learned causal relationship prior to generating missing values, and correct the imputed values via the adversarial learning. We also show that CaGen significantly improves the underwriting prediction in real-world insurance applications
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