Small-size MEMS accelerometer encapsulated in vacuum using Sigma-Delta modulation

A vacuum encapsulated MEMS accelerometer using Sigma-Delta modulation is here presented. Three different modulation orders (second, third, and fourth) were implemented in a field-programable gate array (FPGA), enabling flexibility for tuning the loop parameters in real-time. Three devices were measured, and the results are in good agreement with simulations performed in Simulink. A noise figure of 123 μg/√Hz for a bandwidth of 400 Hz and a range of at least ±1 g was experimentally measured. A figure of merit considering device size and bandwidth is proposed, highlighting the relevance of the results for the current state of the art.FCT - Fundação para a Ciência e a Tecnologia (PDE/BDE/114563/2016

A sigma-delta interface built-in self-test and calibration for microelectromechanical system accelerometer's utilizing interpolation method

This work presents the capacitive micromechanical accelerometer with a completely differential high-order switched capacitor sigma-delta modulator interface. Such modulation interface circuit generates one-bit output data using a third sigma-delta modulator low-noise front-end, doing away with the requirement for a second enhanced converter of resolution to encode the feedback route analog signal. A capacitive micromechanical sensor unit with just a greater quality factor has been specifically employed to give greater resolution. The closed-loop and electrical correction control are used to dampen the high-Q values to get the system's stability with high-order. This microelectromechanical system (MEMS) capacitive accelerometer was calibrated using a lookup table and Akima interpolation to find manufacturing flaws by recalculating voltage levels for the test electrodes. To determine the proper electrode voltages for fault compensation, COMSOL software simulates a number of defects upon that spring as well as the fingers of the sensor system. When it comes time for the feedback phase of a proof mass displacement correction, these values are subsequently placed in the lookup table

CMOS systems and circuits for sub-degree per hour MEMS gyroscopes

The objective of our research is to develop system architectures and CMOS circuits that interface with high-Q silicon microgyroscopes to implement navigation-grade angular rate sensors. The MEMS sensor used in this work is an in-plane bulk-micromachined mode-matched tuning fork gyroscope (M² – TFG ), fabricated on silicon-on-insulator substrate. The use of CMOS transimpedance amplifiers (TIA) as front-ends in high-Q MEMS resonant sensors is explored. A T-network TIA is proposed as the front-end for resonant capacitive detection. The T-TIA provides on-chip transimpedance gains of 25MΩ, has a measured capacitive resolution of 0.02aF /√Hz at 15kHz, a dynamic range of 104dB in a bandwidth of 10Hz and consumes 400μW of power. A second contribution is the development of an automated scheme to adaptively bias the mechanical structure, such that the sensor is operated in the mode-matched condition. Mode-matching leverages the inherently high quality factors of the microgyroscope, resulting in significant improvement in the Brownian noise floor, electronic noise, sensitivity and bias drift of the microsensor. We developed a novel architecture that utilizes the often ignored residual quadrature error in a gyroscope to achieve and maintain perfect mode-matching (i.e.0Hz split between the drive and sense mode frequencies), as well as electronically control the sensor bandwidth. A CMOS implementation is developed that allows mode-matching of the drive and sense frequencies of a gyroscope at a fraction of the time taken by current state of-the-art techniques. Further, this mode-matching technique allows for maintaining a controlled separation between the drive and sense resonant frequencies, providing a means of increasing sensor bandwidth and dynamic range. The mode-matching CMOS IC, implemented in a 0.5μm 2P3M process, and control algorithm have been interfaced with a 60μm thick M2−TFG to implement an angular rate sensor with bias drift as low as 0.1°/hr ℃ the lowest recorded to date for a silicon MEMS gyro.Ph.D.Committee Chair: Farrokh Ayazi; Committee Member: Jennifer Michaels; Committee Member: Levent Degertekin; Committee Member: Paul Hasler; Committee Member: W. Marshall Leac

Signal Processing of MEMS Gyroscope Arrays to Improve Accuracy Using a 1st Order Markov for Rate Signal Modeling

This paper presents a signal processing technique to improve angular rate accuracy of the gyroscope by combining the outputs of an array of MEMS gyroscope. A mathematical model for the accuracy improvement was described and a Kalman filter (KF) was designed to obtain optimal rate estimates. Especially, the rate signal was modeled by a first-order Markov process instead of a random walk to improve overall performance. The accuracy of the combined rate signal and affecting factors were analyzed using a steady-state covariance. A system comprising a six-gyroscope array was developed to test the presented KF. Experimental tests proved that the presented model was effective at improving the gyroscope accuracy. The experimental results indicated that six identical gyroscopes with an ARW noise of 6.2 °/√h and a bias drift of 54.14 °/h could be combined into a rate signal with an ARW noise of 1.8 °/√h and a bias drift of 16.3 °/h, while the estimated rate signal by the random walk model has an ARW noise of 2.4 °/√h and a bias drift of 20.6 °/h. It revealed that both models could improve the angular rate accuracy and have a similar performance in static condition. In dynamic condition, the test results showed that the first-order Markov process model could reduce the dynamic errors 20% more than the random walk model

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

A Label Free CMOS-Based Smart Petri Dish for Cellular Analysis

RÉSUMÉ Le dépistage de culture cellulaire à haut débit est le principal défi pour une variété d’applications des sciences de la vie, y compris la découverte de nouveaux médicaments et le suivi de la cytotoxicité. L’analyse classique de culture cellulaire est généralement réalisée à l’aide de techniques microscopiques non-intégrées avec le système de culture cellulaire. Celles-ci sont laborieuses spécialement dans le cas des données recueillies en temps réel ou à des fins de surveillance continue. Récemment, les micro-réseaux cellulaires in-vitro ont prouvé de nombreux avantages dans le domaine de surveillance des cellules en réduisant les coûts, le temps et la nécessité d’études sur des modèles animaux. Les microtechniques, y compris la microélectronique et la microfluidique,ont été récemment utilisé dans la biotechnologie pour la miniaturisation des systèmes biologiques et analytiques. Malgré les nombreux efforts consacrés au développement de dispositifs microfluidiques basés sur les techniques de microscopie optique, le développement de capteurs intégrés couplés à des micropuits pour le suivi des paramètres cellulaires tel que la viabilité, le taux de croissance et cytotoxicité a été limité. Parmi les différentes méthodes de détection disponibles, les techniques capacitives offrent une plateforme de faible complexité. Celles-ci ont été considérablement utilisées afin d’étudier l’interaction cellule-surface. Ce type d’interaction est le plus considéré dans la majorité des études biologiques. L’objectif de cette thèse est de trouver des nouvelles approches pour le suivi de la croissance cellulaire et la surveillance de la cytotoxicité à l’aide d’un réseau de capteurs capacitifs entièrement intégré. Une plateforme hybride combinant un circuit microélectronique et une structure microfluidique est proposée pour des applications de détection de cellules et de découverte de nouveaux médicaments. Les techniques biologiques et chimiques nécessaires au fonctionnement de cette plateforme sont aussi proposées. La technologie submicroniques Standard complementary metal-oxide-Semiconductor (CMOS) (TSMC 0.35 μm) est utilisée pour la conception du circuit microélectronique de cette plateforme. En outre, les électrodes sont fabriquées selon le processus CMOS standard sans la nécessité d’étapes de post-traitement supplémentaires. Ceci rend la plateforme proposée unique par rapport aux plateformes de dépistage de culture cellulaire à haut débit existantes. Plusieurs défis ont été identifiés durant le développement de cette plateforme comme la sensibilité, la bio-compatibilité et la stabilité et les solutions correspondantes sont fournies.----------ABSTRACT High throughput cell culture screening is a key challenge for a variety of life science applications, including drug discovery and cytotoxicity monitoring. Conventional cell culture analysis is widely performed using microscopic techniques that are not integrated into the target cell culture system. Additionally, these techniques are too laborious in particular to be used for real-time and continuous monitoring purposes. Recently, it has been proved that invitro cell microarrays offer great advantages for cell monitoring applications by reducing cost, time, and the need for animal model studies. Microtechnologies, including microelectronics and microfluidics, have been recently used in biotechnology for miniaturization of biological and analytical systems. Despite many efforts in developing microfluidic devices using optical microscopy techniques, less attention have been paid on developing fully integrated sensors for monitoring cell parameters such as viability, growth rate, and cytotoxicity. Among various available sensing methods, capacitive techniques offer low complexity platforms. This technique has significantly attracted attentions for the study of cell-surface interaction which is widely considered in biological studies. This thesis focuses on new approaches for cell growth and cytotoxicity monitoring using a fully integrated capacitive sensor array. A hybrid platform combining microelectronic circuitry and microfluidic structure is proposed along with other required biological and chemical techniques for single cell detection and drug discovery applications. Standard submicron complementary metal–oxide–semiconductor (CMOS) technology (TSMC 0.35 μm) is used to develop the microelectronic part of this platform. Also, the sensing electrodes are fabricated in standard CMOS process without the need for any additional post processing step, which makes the proposed platform unique compared to other state of the art high throughput cell assays. Several challenges in implementing this platform such as sensitivity, bio-compatibility, and stability are discussed and corresponding solutions are provided. Specifically, a new surface functionalization method based on polyelectrolyte multilayers deposition is proposed to enhance cell-electrode adherence and to increase sensing electrodes’ life time. In addition, a novel technique for microwell fabrication and its integration with the CMOS chip is proposed to allow parallel screening of cells. With the potential to perform inexpensive, fast, and real-time cell analyses, the proposed platform opens up the possibility to transform from passive traditional cell assays to a smart on-line monitoring system

Hybrid microfluidic CMOS capacitive sensors for lab-on-chip applications

Methods and applications of CMOS-based Locs -- Hybrid microfluidic/cmos platform -- Cmos based capacitive sensors for locs -- Direct-write microfluidic packaging procedure -- Core-cbcm capacitive sensor array for locs

Development and implementation of a deflection amplification mechanism for capacitive accelerometers

Micro-Electro-Mechanical-Systems (MEMS) and especially physical sensors are part of a flourishing market ranging from consumer electronics to space applications. They have seen a great evolution throughout the last decades, and there is still considerable research effort for further improving their performance. This is reflected by the plethora of commercial applications using them but also by the demand from industry for better specifications. This demand together with the needs of novel applications fuels the research for better physical sensors.Applications such as inertial, seismic, and precision tilt sensing demand very high sensitivity and low noise. Bulk micromachined capacitive inertial sensors seem to be the most viable solution as they offer a large inertial mass, high sensitivity, good noise performance, they are easy to interface with, and of low cost. The aim of this thesis is to improve the performance of bulk micromachined capacitive sensors by enhancing their sensitivity and noise floor.MEMS physical sensors, most commonly, rely on force coupling and a resulting deflection of a proof mass or membrane to produce an output proportional to a stimulus of the physical quantity to be measured. Therefore, the sensitivity to a physical quantity may be improved by increasing the resulting deflection of a sensor. The work presented in this thesis introduces an approach based on a mechanical motion amplifier with the potential to improve the performance of mechanical MEMS sensors that rely on deflection to produce an output signal.The mechanical amplifier is integrated with the suspension system of a sensor. It comprises a system of micromachined levers (microlevers) to enhance the deflection of a proof mass caused by an inertial force. The mechanism can be used in capacitive accelerometers and gyroscopes to improve their performance by increasing their output signal. As the noise contribution of the electronic read-out circuit of a MEMS sensor is, to first order, independent of the amplitude of its input signal, the overall signal-to-noise ratio (SNR) of the sensor is improved.There is a rather limited number of reports in the literature for mechanical amplification in MEMS devices, especially when applied to amplify the deflection of inertial sensors. In this study, after a literature review, mathematical and computational methods to analyse the behaviour of microlevers were considered. By using these methods the mechanical and geometrical characteristics of microlevers components were evaluated. In order to prove the concept, a system of microlevers was implemented as a mechanical amplifier in capacitive accelerometers.All the mechanical structures were simulated using Finite Element Analysis (FEA) and system level simulations. This led to first order optimised devices that were used to design appropriate masks for fabrication. Two main fabrication processes were used; a Silicon on Insulator (SOI) process and a Silicon on Glass (SoG) process. The SOI process carried out at the University of Southampton evolved from a one mask to a two mask dicing free process with a yield of over 95%, in its third generation. The SoG is a well-established process at the University of Peking that uses three masks.The sensors were evaluated using both optical and electrical means. The results from the first prototype sensor design (1HAN) revealed an amplification factor of 40 and a mechanically amplified sensitivity of 2.39V/g. The measured natural frequency of the first mode of the sensor was at 734Hz and the full-scale measurement range was up to 7g with a maximum nonlinearity of 2%. The measurements for all the prototype sensor designs were very close to the predicted values with the highest discrepancy being 22%. The results of this research show that mechanical amplification is a very promising concept that can offer increased sensitivity in inertial sensors without increasing the noise. Experimental results show that there is plenty of room for improvement and that viable solutions may be produced by using the presented approach. The applications of this scheme are not restricted only to inertial sensors but as the results show it can be used in a broader range of micromachined devices

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields