Low Power system Design techniques for mobile computers

Portable products are being used increasingly. Because these systems are battery powered, reducing power consumption is vital. In this report we give the properties of low power design and techniques to exploit them on the architecture of the system. We focus on: min imizing capacitance, avoiding unnecessary and wasteful activity, and reducing voltage and frequency. We review energy reduction techniques in the architecture and design of a hand-held computer and the wireless communication system, including error control, sys tem decomposition, communication and MAC protocols, and low power short range net works

An Energy and Performance Exploration of Network-on-Chip Architectures

In this paper, we explore the designs of a circuit-switched router, a wormhole router, a quality-of-service (QoS) supporting virtual channel router and a speculative virtual channel router and accurately evaluate the energy-performance tradeoffs they offer. Power results from the designs placed and routed in a 90-nm CMOS process show that all the architectures dissipate significant idle state power. The additional energy required to route a packet through the router is then shown to be dominated by the data path. This leads to the key result that, if this trend continues, the use of more elaborate control can be justified and will not be immediately limited by the energy budget. A performance analysis also shows that dynamic resource allocation leads to the lowest network latencies, while static allocation may be used to meet QoS goals. Combining the power and performance figures then allows an energy-latency product to be calculated to judge the efficiency of each of the networks. The speculative virtual channel router was shown to have a very similar efficiency to the wormhole router, while providing a better performance, supporting its use for general purpose designs. Finally, area metrics are also presented to allow a comparison of implementation costs

Design techniques for low-power systems

Portable products are being used increasingly. Because these systems are battery powered, reducing power consumption is vital. In this report we give the properties of low-power design and techniques to exploit them on the architecture of the system. We focus on: minimizing capacitance, avoiding unnecessary and wasteful activity, and reducing voltage and frequency. We review energy reduction techniques in the architecture and design of a hand-held computer and the wireless communication system including error control, system decomposition, communication and MAC protocols, and low-power short range networks

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Case Studies on Clock Gating and Local Routign for VLSI Clock Mesh

The clock is the important synchronizing element in all synchronous digital systems. The difference in the clock arrival time between sink points is called the clock skew. This uncertainty in arrival times will limit operating frequency and might cause functional errors. Various clock routing techniques can be broadly categorized into 'balanced tree' and 'fixed mesh' methods. The skew and delay using the balanced tree method is higher compared to the fixed mesh method. Although fixed mesh inherently uses more wire length, the redundancy created by loops in a mesh structure reduces undesired delay variations. The fixed mesh method uses a single mesh over the entire chip but it is hard to introduce clock gating in a single clock mesh. This thesis deals with the introduction of 'reconfigurability' by using control structures like transmission gates between sub-clock meshes, thus enabling clock gating in clock mesh. By using the optimum value of size for PMOS and NMOS of transmission gate (SZF) and optimum number of transmission gates between sub-clock meshes (NTG) for 4x4 reconfigurable mesh, the average of the maximum skew for all benchmarks is reduced by 18.12 percent compared to clock mesh structure when no transmission gates are used between the sub-clock meshes (reconfigurable mesh with NTG =0). Further, the research deals with a ‘modified zero skew method' to connect synchronous flip-flops or sink points in the circuit to the clock grids of clock mesh. The wire length reduction algorithms can be applied to reduce the wire length used for a local clock distribution network. The modified version of ‘zero skew method’ of local clock routing which is based on Elmore delay balancing aims at minimizing wire length for the given bounded skew of CDN using clock mesh and H-tree. The results of ‘modified zero skew method' (HC_MZSK) show average local wire length reduction of 17.75 percent for all ISPD benchmarks compared to direct connection method. The maximum skew is small for HC_MZSK in most of the test cases compared to other methods of connections like direct connections and modified AHHK. Thus, HC_MZSK for local routing reduces the wire length and maximum skew

On-Chip Power Supply Noise: Scaling, Suppression and Detection

Design metrics such as area, timing and power are generally considered as the primary criteria in the design of modern day circuits, however, the minimization of power supply noise, among other noise sources, is appreciably more important since not only can it cause a degradation in these parameters but can cause entire chips to fail. Ensuring the integrity of the power supply voltage in the power distribution network of a chip is therefore crucial to both building reliable circuits as well as preventing circuit performance degradation. Power supply noise concerns, predicted over two decades ago, continue to draw significant attention, and with present CMOS technology projected to keep on scaling, it is shown in this work that these issues are not expected to diminish. This research also considers the management and on-chip detection of power supply noise. There are various methods of managing power supply noise, with the use of decoupling capacitors being the most common technique for suppressing the noise. An in-depth analysis of decap structures including scaling effects is presented in this work with corroborating silicon results. The applicability of various decaps for given design constraints is provided. It is shown that MOS-metal hybrid structures can provide a significant increase in capacitance per unit area compared to traditional structures and will continue to be an important structure as technology continues to scale. Noise suppression by means of current shifting within the clock period of an ALU block is further shown to be an additional method of reducing the minimum voltage observed on its associated supply. A simple, and area and power efficient technique for on-chip supply noise detection is also proposed

Skybridge: A New Nanoscale 3-D Computing Framework for Future Integrated Circuits

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, continuing the traditional way of scaling to sub-20nm technologies is proving to be very difficult as MOSFETs are reaching their fundamental performance limits [1] and interconnection bottleneck is dominating IC operational power and performance [2]. Migrating to 3-D, as a way to advance scaling, has been elusive due to inherent customization and manufacturing requirements in CMOS architecture that are incompatible with 3-D organization. Partial attempts with die-die [3] and layer-layer [4] stacking have their own limitations [5]. We propose a new 3-D IC fabric technology, Skybridge [6], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge’s core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance/watt benefits, and 10x reduction in interconnect lengths vs. scaled 16-nm CMOS [6]. Fabric-level heat extraction features are found to be effective in managing IC thermal profiles in 3-D. This 3-D integrated fabric proposal overcomes the current impasse of CMOS in a manner that can be immediately adopted, and offers unique solution to continue technology scaling in the 21st century

Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are reaching their fundamental limits and interconnection bottleneck is dominating IC operational power and performance. Migrating to 3-D, as a way to advance scaling, has eluded us due to inherent customization and manufacturing requirements in CMOS that are incompatible with 3-D organization. Partial attempts with die-die and layer-layer stacking have their own limitations. We propose a 3-D IC fabric technology, Skybridge[TM], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge's core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance per watt benefits, and 10X reduction in interconnect lengths vs. scaled 16-nm CMOS. Fabric-level heat extraction features are shown to successfully manage IC thermal profiles in 3-D. Skybridge can provide continuous scaling of integrated circuits beyond CMOS in the 21st century.Comment: 53 Page