76 research outputs found

    Diamond semiconductor technology for RF device applications

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    This paper presents a comprehensive review of diamond electronics from the RF perspective. Our aim was to find and present the potential, limitations and current status of diamond semiconductor devices as well as to investigate its suitability for RF device applications. While doing this, we briefly analysed the physics and chemistry of CVD diamond process for a better understanding of the reasons for the technological challenges of diamond material. This leads to Figure of Merit definitions which forms the basis for a technology choice in an RF device/system (such as transceiver or receiver) structure. Based on our literature survey, we concluded that, despite the technological challenges and few mentioned examples, diamond can seriously be considered as a base material for RF electronics, especially RF power circuits, where the important parameters are high speed, high power density, efficient thermal management and low signal loss in high power/frequencies. Simulation and experimental results are highly regarded for the surface acoustic wave (SAW) and field emission (FE) devices which already occupies space in the RF market and are likely to replace their conventional counterparts. Field effect transistors (FETs) are the most promising active devices and extremely high power densities are extracted (up to 30 W/mm). By the surface channel FET approach 81 GHz operation is developed. Bipolar devices are also promising if the deep doping problem can be solved for operation at room temperature. Pressure, thermal, chemical and acceleration sensors have already been demonstrated using micromachining/MEMS approach, but need more experimental results to better exploit thermal, physical/chemical and electronic properties of diamond

    Toward Sustainable Transparent and Flexible Electronics with Amorphous Zinc Tin Oxide

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    The present thesis addresses a sustainable approach to mechanically flexible and transparent electronic devices based on the amorphous oxide semiconductor zinc tin oxide (ZTO) as abundant and low-cost alternative to already industrially established materials such as amorphous indium gallium zinc oxide. ZTO thin films are deposited by radio frequency long-throw magnetron sputtering at room temperature to generally enable the implementation of common photolithography processes and further facilitate patterning of digital circuit elements on thermally unstable organic substrates. Starting with the most basic device building blocks of integrated circuitry, various types of field-effect transistors are fabricated by implementation of amorphous ZTO as active channel material. Metal-semiconductor field-effect transistors and pn heterodiode based junctions field-effect transistors as well as conventional metal-insulatorsemiconductor field-effect transistors are then compared regarding their electrical performance and long-term stability over a couple of months. A decisive step toward the successful interconnection of fundamental digital circuit elements, such as previously demonstrated simple inverters, is to ensure sufficient output level compatibility between the signals of associated logic components. Accordingly, the Schottky diode field-effect transistor logic approach is adapted for amorphous ZTO based devices in order to facilitate cascading of multiple inverters consisting of unipolar devices. Field-effect transistor properties as well as the circuit design have been continuously improved to enhance the overall performance in terms of functionality and low-voltage operation. Corresponding logic inverters are finally integrated in ring oscillator circuits to gain insights into the dynamic properties of digital circuit building blocks based on amorphous ZTO. Ultimately, ZTO has been fabricated on mechanically flexible polyimide substrates to determine the elastic and electrical properties of amorphous ZTO thin films in dependence on external tensile and compressive stress induced by mechanical bending. Further, associated flexible metal-semiconductor field-effect transistor are investigated regarding their performance stability under tensile strain.Die vorliegende Arbeit umfasst die Herstellung und Charakterisierung aktiver elektrischer Bauelemente und integrierter Schaltkreise auf Basis des amorphen Oxidhalbleiters Zink-Zinnoxid (ZTO). Als vielversprechende nachhaltige und kostengünstigere Alternative zu dem bereits industriell etablierten Halbleiter Indium-Gallium-Zinkoxid wird insbesondere die Eignung von ZTO in optisch transparenter sowie mechanisch flexibler Elektronik untersucht. Um entsprechend Kompatibilität mit thermisch instabilen organischen Substraten sowie herkömmlichen Fotolithografieverfahren zu gewährleisten, beschränkt sich die Züchtung von ZTO-Dünnfilmen mittels Hochfrequenz-Magnetron-Distanzkathodenzerstäubung ausschließlich auf Herstellungsprozesse bei Raumtemperatur. Zunächst wird auf die Umsetzung verschiedener Feldeffekttransistor-Typen auf Basis amorphen ZTOs eingegangen, welche elektrisch charakterisiert und schließlich vor dem Hintergrund der Anwendung in integrierten Schaltkreisen vergleichend gegenübergestellt werden. Neben konventionellen Metall-Isolator-Halbleiterstrukturen wird vor allem näher auf Metall-Halbleiter-Feldeffekttransistoren sowie Sperrschicht-Feldeffekttransistoren auf der Grundlage von pn-Heteroübergängen eingegangen, da diese hauptsächlich in Bereichen hoher geforderter Schaltfrequenzen zum Einsatz kommen. Da integrierte Schaltkreise auf Basis unipolarer Feldeffekttransistoren eines Ladungsträgertyps inkonsistente Signaleingangs- sowie -ausgangspegel aufweisen, wird die Schottky- Dioden-Transistorlogik adaptiert, um entsprechend die Verknüpfung mehrerer Logikgatter auf Basis amorphen ZTOs zu gewährleisten. Durch geeignete Signalrückkopplung werden komplexere Schaltungen wie Ringoszillatoren realisiert, welche anhand von Laufzeitanalysen Aufschluss über die Schaltgeschwindigkeit ZTO basierter Feldeffekttransistoren geben. Abschließend werden amorphe ZTO-Dünnfilme auf flexiblen Polyimid-Substraten hergestellt und bezüglich der elastischen sowie elektrischen Eigenschaften in Abhängigkeit von exzessivem mechanischen Stress untersucht. Darüber hinaus werden flexible Metall-Halbleiter-Feldeffekttransistoren hinsichtlich ihrer Funktionalität und Stabilität gegenüber durch Biegeprozesse induzierte Verspannungen elektrisch charakterisiert

    Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors

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    In this paper we report on the optimization of the SiNchi:H insulator, deposited by the electron cyclotron resonance (ECR) plasma method, as a dielectric for metal-insulator-semiconductor (MIS) structures built on an InP compound semiconductor. Two different MIS structures have been obtained in which the minimum of the interface trap density (D-it,D-min) at the insulator/InP interface attains values of device quality. In the first structure, a Al/SiN1.5:H/SiN1.6:H/InP dual-layer insulator was obtained and optimized after rapid thermal annealing treatment at 500 degreesC for 30s. After this treatment, the value of D-it,D-min was 9 x 10(11) cm(-2) eV(-1). In the second structure, the MIS structure was Al/SiN1.6:H/InP single-layer insulator, in which the InP surface was exposed to an N-2 plasma prior to the SiN1.6:H film deposition. In this case, the value of D-it.min was 1.6 x 10(12) cm(-2) eV(-1). Both types of structures were used as gate insulators on N-channel enhanced-mode MIS field-effect transistor test devices. From the dc output characteristics of the transistors, we obtain values for the electron channel mobility in the range 1550-1600 cm(-2) V-1 s(-1). This is a confirmation of the great potential of the ECR plasma method as a simple way to obtain device quality gate structures on InP without the use of passivation processes of the InP surface prior to the deposition of the gate dielectric, thus simplifying the whole device fabrication procedure

    AlGaN/GaN-based power semiconductor switches

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    Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2013.Cataloged from PDF version of thesis.Includes bibliographical references (p. 209-219).AlGaN/GaN-based high-electron-mobility transistors (HEMTs) have great potential for their use as high efficiency and high speed power semiconductor switches, thanks to their high breakdown electric field, mobility and charge density. The ability to grow these devices on large-diameter Si wafers also reduces device cost and makes them easier for wide market adoption. However, the development of AlGaN/GaN-based power switches has encountered three major obstacles: the limited breakdown voltage of AlGaN/GaN transistors grown on Si substrates; the low performance of normally-off AlGaN/GaN transistors; and the degradation of device performance under high voltage pulsed conditions. This thesis studies these issues and presents new approaches to address these obstacles. The first part of the thesis studies the breakdown mechanism in AlGaN/GaN-on-Si transistors. A new quantitative model-trap-limited space-charge impact-ionization model- is developed. Based on this model, a set of design rules is proposed to improve the breakdown voltage of AlGaN/GaN-on-Si transistors. New technologies have also been demonstrated to increase the breakdown voltage of AlGaN/GaN-on-Si transistors beyond 1500 V. The second part of the thesis presents three technologies to improve the performance of normally-off AlGaN/GaN transistors. First, a dual-gate normally-off MISFET achieved high threshold voltage, high current and high breakdown voltage simultaneously by using an integrated cascode structure. Second, a tri-gate AlGaN/GaN MISFET demonstrated the highest current on/off ratio in normally-off GaN transistors with the enhanced electrostatic control from a tri-gate structure. Finally, a new etch-stop barrier structure is designed to address low channel mobility, high interface density and non-uniformity issues associated with the conventional gate recess technology. Using this new structure, normally-off MISFETs demonstrated high uniformity, steep sub-threshold slope and a record channel effective mobility. The thesis concludes with a new dynamic on-resistance measurement technique. With this method, the hard- and soft-switching characteristics of GaN transistors were measured for the first time.by Bin Lu.Ph.D

    Solution-processed Amorphous Oxide Semiconductors for Thin-film Power Management Circuitry

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    Thin-film electronics has opened up new applications not achievable by wafer-based electronics. Following commercial success in displays and solar cells, the future industry sectors for thin film devices are limitless, and include novel wearable electronics and medical devices. Such new applications enabled by human-size electronics have been widely investigated, but their potential use in power-management circuitry has been seldom addressed. The key strengths of thin-film electronics are that they can be deposited on various substrates at a large-area scale, and they can be additively deposited on existing device layers without degrading them. These advantageous features can be used to overcome the current barriers facing silicon (Si) electronics in power-management applications. Namely, thin film electronics can be used to directly deposit circuits including power harvesters on RFID tags to reduce the current tag cost based on Si IC. Furthermore, they can be directly heterointegrated with Si chips to enhance their voltage handling capability. Finally, thin film electronics can be deposited onto solar cell arrays to improve efficiency by managing partial shading conditions. Among thin-film materials, we explore the scope of solution-derived amorphous oxide semiconductor (AOS) due to its high carrier mobility, wide band-gap, and in-air deposition capability. In this thesis, we push the boundaries of AOS by (i) developing an air-stable, ink-based deposition process for high-performance amorphous zinc-tin-oxide semiconductor. We choose a deposition process based on metal-organic decomposition, such that the film properties are independent of relative humidity in the deposition ambient, enabling future large-area roll-to-roll processing. (ii) Second, by exploiting in situ chemical evolution, namely reduction and oxidation, at the interface of zinc-tin-oxide and various metal electrodes (primarily Pd, Mo, and Ag), we intentionally manipulate the electrode contact properties to form high-quality ohmic contacts and Schottky barriers. We explain the results based on competing thermodynamic processes and interlayer diffusion. (iii) Third, we combine these techniques to fabricate novel devices, namely vertically-conducting thin-film diodes and Schottky-gated TFTs, and we investigate the impact of the contact formation process on the resulting device physics using temperature-dependent current-voltage measurements. (iv) Finally, we demonstrate the use of these devices in several novel thin-film power electronics applications. These circuits include thin-film RFID energy harvesters, thin-film heterointegrated 3D-IC on Si chip for voltage bridging, and thin-film bypass diodes for future integration on solar cells to improve efficiency under partial shading conditions.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/149911/1/ybson_1.pd

    Advanced 3-V semiconductor technology assessment

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    Components required for extensions of currently planned space communications systems are discussed for large antennas, crosslink systems, single sideband systems, Aerostat systems, and digital signal processing. Systems using advanced modulation concepts and new concepts in communications satellites are included. The current status and trends in materials technology are examined with emphasis on bulk growth of semi-insulating GaAs and InP, epitaxial growth, and ion implantation. Microwave solid state discrete active devices, multigigabit rate GaAs digital integrated circuits, microwave integrated circuits, and the exploratory development of GaInAs devices, heterojunction devices, and quasi-ballistic devices is considered. Competing technologies such as RF power generation, filter structures, and microwave circuit fabrication are discussed. The fundamental limits of semiconductor devices and problems in implementation are explored

    Design, Microfabrication, and Characterization of Polar III-Nitride HFETs

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    ABSTRACT Design, Microfabrication, and Characterization of Polar III-Nitride HFETs Alireza Loghmany, Ph.D. Concordia University, 2016 With excellent performance in high-frequency power amplifiers, AlGaN/GaN heterojunction field-effect transistors (HFETs) as next generation power amplifiers have drawn a great deal of attention in the last decade. These HFETs, however, are still quite limited by their inherently depletion-mode (D-mode: negative pinch-off voltage) nature, relatively poor gate-leakage, and questionable long-terms reliability. In addition, since AlGaN/GaN HFETs operate at extremely high-power densities, performance of these devices has so far remained quite limited by self-heating effects. While a number of techniques have already been developed for realization of enhancement-mode (E-mode: positive pinch-off voltage) AlGaN/GaN HFETs, these techniques in addition to having a number of difficulties in achieving enhancement-/depletion-mode pairs, fall short of satisfying requirements such as low leakage-current, drain-current stability, and pinch-off voltage stability at the high operating temperatures and at elevated electric-fields. Among these techniques, fluoride-based plasma treatment is the most widely accepted. As an alternative to this mainstream technique, polarization-engineering of AlGaN/GaN HFETs through exploring the impacts of the mesa geometry is studied as a possible avenue for selective transformation of the D-mode nature of AlGaN/GaN HFETs to an E-mode character. Whereas limited experimental studies on the pinch-off voltage of HFETs realized on different isolation-feature geometries have indicated the presence of a certain correlation between the two, such observations lack the required depth to accurately identify the true culprit. This technique is expected to be ultimately capable of producing enhancement-/depletion-mode pairs without adding any extra steps to the microfabrication process. In light of this requirement, microfabrication of AlGaN/GaN HFETs using a number of alternative isolation-feature geometries is explored in this study. In addition to developing an in-house microfabrication process, transistors designed according to these novel isolation-feature geometries have been fabricated through the services offered by Canadian Microelectronics Corporation (CMC). Investigation of the variation of pinch-off voltage among the devices fabricated through this latter means has conclusively indicated that the pinch-off voltage shift, rather than exclusively being caused by the surrounding-field effect, is also correlated to the perimeter-to-area ratio of the isolation-features. In addition, through characterization and thermal modeling of these groups of devices, in this study a new approach is unveiled for reducing self-heating in AlGaN/GaN HFETs. According to finite element analysis (FEA) and electrical measurement of average channel temperature, an improved heat-dissipation was observed in HFETs enjoying a more distributed nature of the two-dimensional electron gas (2DEG) channel. This is observed to be the case especially for isolation features which offered the center of the channel a smaller distance to the side walls. Observations also indicate a more distinct gain in thermal management with reduction of the gate-length and also the surface area of the isolation pattern. Results suggest that self-heating in AlGaN/GaN HFETs can be substantially nullified by reducing the island-width below a certain threshold value, while maintaining the total width of the transistor constant. In addition to exploring these alternatives on AlGaN/GaN HFET structures, in-house microfabrication of AlN/GaN MISFETs is also studied. The results of DC characterization of these novel transistors are also presented

    Transparent semiconducting oxides for active multi-electrode arrays

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    Die vorliegende Arbeit befasst sich mit der Anwendbarkeit von transparenter Elektronik basierend auf oxidischen Halbleitern in Multielektrodenarrays zur Messung von neuronalen Signalen. Im ersten experimentellen Kapitel werden auf Zinkoxid basierende Bauelemente untersucht. Verschiedene Varianten von Feldeffekttransistoren (FETs) werden charakterisiert und ihre Eignung zur Detektion von Zellsignalen überprüft. Die Anwendbarkeit physikalischer Modelle zur Beschreibung von ZnO-basierten Metal-Halbleiter-FETs (MESFETs) wird behandelt. Weiterhin wird die Eignung von einfachen Inverterschaltungen zur Spannungsverstärkung diskutiert. Das zweite Kapitel thematisiert Rauschmessungen an unterschiedlichen ZnO-basierten Proben, darunter Dünnfilme, Mikronadeln, MESFETs und Inverter. Darauf aufbauend wird die Auswirkung des gemessenen Stromrauschens auf die Sensitivität der Bauelemente nachvollzogen und theoretisch modelliert. Im dritten Kapitel wird das Verhalten der Bauelemente im Kontakt mit Elektolyt beschrieben. Die Signalübertragung von Spannungsänderungen im Elektrolyt auf die Chipelektronik wird mit verschiedenen Messmethoden charakterisiert. Dabei kommt teilweise ein selbstgebauter Vorverstärker zum Einsatz, dessen Aufbau ebenfalls beschrieben wird. Die Stabilität der verwendeten Materialien in physiologischen Salzlösungen und ihre Biokompatibilität wird überprüft. Darüber hinaus werden FETs mit Elektrolytgate und Zinkzinnoxid-Kanal vorgestellt.:1. Introduction 2. Measurement Setup and Sample Fabrication 2.1. Device Fabrication 2.2. Measurement Methods 2.3. Current Amplifier with Offset Compensation 3. Oxide Semiconductor Based Devices 3.1. Theoretical Description 3.2. Thin Films 3.4. Simple Inverter 3.5. Test Circuit for Active Matrix Configurations 4. Noise 4.1. Noise Sources 4.2. Contributions from Measurement Setup 4.3. Homogenous ZnO Samples 4.4. ZnO Based Devices 5. Experiments in Electrolyte and with Cells 5.1. Cell-Transistor Coupling 5.2. Materials in Electrolytical and Biological Environment 5.3. Electrode Arrays with Field-Effect Transistors 5.4. Electrode Arrays with Simple Inverters 5.5. Electrode Arrays with Solution Gated Transistors 6. Conclusion and Outlook Appendices Bibliography Symbols and Abbreviations List of Own and Contributed Articles Acknowledgement

    Technology of MISFET with SiO2/BaTiO3 System as a Gate Insulator, Journal of Telecommunications and Information Technology, 2009, nr 4

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    The properties of barium titanate (BaTiO3, BT), such as high dielectric constant and resistivity, allow it to find numerous applications in the field of microelectronics. In this work silicon metal-insulator-semiconductor field effect transistor (MISFET) structures with BaTiO3 thin films (containing La2O3 admixture) acting as gate insulator were investigated. The films were produced by means of radio frequency plasma sputtering (RF PS) of sintered BaTiO3 + La2O3 (2% wt.) target. In the paper transfer and output I−V, transconductance and output conductance characteristics of the obtained transistors are presented and discussed. Basic parameters of these devices, such as threshold voltage (VTH) are determined and discussed

    Realization and Characterization of Metal-Semiconductor Field-Effect Transistors based on Amorphous Zinc Tin Oxide

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    Im ersten Teil der vorliegenden Arbeit werden die physikalischen Eigenschaften, insbesondere die elektrische Leitfähigkeit, von Zink-Zinn-Oxid Dünnschichten sowie darauf basierenden Schottky-Dioden in Abhängigkeit von der Kationenkomposition bestimmt. Zur Herstellung dieser Dünnschichten wurde ein Verfahren genutzt, welches die Herstellung von kontinuierlichen Kompositiongradienten im Rahmen eines gepulsten Laserabscheidungsprozesses bei Raumtemperatur ermöglicht. Erster Schwerpunkt der Diskussion ist die Abhängigkeit elektrischer Eigenschaften der Dünnschichten sowie die Diodeneigenschaften vom Kationenverhältnis. Des Weiteren wird die Langzeitstabilität der Schottky-Dioden und der Einfluss der Sauerstoffzufuhr während der Kontaktherstellung auf die Eigenschaften der Schottky-Dioden herausgestellt. DieErgebnissetiefenaufgelösterRöntgenphotoelektronenspektroskopiewerden diskutiert und ein Mechanismus, welcher zu einer Verbesserung der Schottky-Dioden über die Zeit führt, wird vorgestellt. Die Erkenntnisse über die optimale Kationenkomposition und den Einfluss des Sauerstoffs auf die Eigenschaften von Schottky-Dioden wurden genutzt, um Metall-Halbleiter-Feldeffekttransistoren herzustellen, welche im zweiten Teil der vorliegenden Arbeit beschrieben werden. In einem ersten Schritt wurden hierfür die Abscheidebedingungen in der Sputterkammer optimiert und eine neue Abscheiderezeptur für die Herstellung von Feldeffekttransistoren eingeführt. Auch hier finden alle Abscheidungen bei Raumtemperatur statt. Die Abscheidung mittels Sputtern wurde gewählt, da diese Abscheidemethode größere industrielle Relevanz als die gepulste Laserabscheidung hat. Metall-Halbleiter-Feldeffekttransistoren mit zwei verschiedenen Gate-Typen werden vorgestellt und jeweils der Einfluss der Kanalschichtdicke auf die Transistoreigenschaften untersucht. Der Einfluss des durch die Herstellung erzeugten Sauerstoffreservoirs in dem Schottky-Gate Kontakt auf die Eigenschaften der Feldeffekttransistoren wird ebenso gezeigt wie der Einfluss eines thermischen Ausheizprozesses auf die Schaltgeschwindigkeit der Feldeffekttransistoren. Außerdem werden einfache Inverter, welche auf zwei gleichartigen Feldeffekttransistoren basieren, vorgestellt. Ebenfalls werden SchottkyDioden Feldeffekttransistoren Logik basierte Inverter vorgestellt und charakterisiert. AbschließendwerdenRingoszillatoren,aufgebautausmehrereninReihegeschaltetenSchottkyDiodenFeldeffekttransistorenLogikbasiertenInverternvorgestellt. DerEinflussderKanalschichtdicke und der Gate-Geometrie auf die Oszillationsfrequenz wird diskutiert.:Contents 1 Introduction 2 Theoretical Descriptions 2.1 The Amorphous Semiconductor Zinc Tin Oxide 2.2 Schottky Barrier Diodes 2.3 Field-Effect Transistors 2.4 Inverter 2.5 Inverter Chain and Ring Oscillator 3 Methods 3.1 Growth and Structuring Techniques 3.1.1 Pulsed Laser Deposition 3.1.2 Sputtering Deposition 3.1.3 Photolithography 3.2 Characterization Techniques 3.2.1 Hall Effect Measurements 3.2.2 XRD and XRR Measurements 3.2.3 Static and Dynamic Current-Voltage Measurements 3.2.4 Further Characterization Techniques 4 Physical Properties of Amorphous Zinc Tin Oxide 4.1 Characterization of Pulsed Laser Deposited Zinc Tin Oxide Thin Films Having a Continuous Composition Spread 4.2 Properties of Schottky Barrier Diodes in Dependence on the Cation Composition 4.3 Long Term Stability of Schottky Barrier Diodes 4.4 ImportantRoleofOxygenfortheFormationofHighlyRectifyingContacts 4.5 Processes Governing the Long Term Stability 5 Demonstration and Characterization of Zinc Tin Oxide Based Devices 5.1 Implementation of a New Sputtering Recipe 5.1.1 CharacterizationandElectricalOptimizationoftheZincTinOxide Thin Films .1.2 Optimization of the Gate Contact 5.2 Devices with PtOx/Pt Gate Contact 5.2.1 Variation of the Channel Thickness 5.2.2 Influence of the Oxygen Reservoir on the Performance and Long Term Stability of Devices 5.2.3 Tuning of the Electron Mobility 5.2.4 Frequency Dependent Switching of Transistors 5.3 Devices with i-ZTO/PtOx/Pt Gate Contact 5.3.1 Transistors with Varying Channel Thickness 5.3.2 Simple Inverter 5.3.3 SDFL Inverter 5.3.4 Inverter Chain 5.3.5 Ring Oscillators 5.4 Comparison to Literature 6 Summary and Outlook Abbreviations List of Symbols Bibliography List of Own and Contributed Articles AppendixIn the first part of the present work the physical properties, especially the electrical properties, of zinc tin oxide thin films as well as Schottky diodes based thereon are determined as a function of the cation composition. For film growth, a room temperature pulsed laser deposition process was used, which allows the realization of a continuous composition gradient within one sample. First focus of the discussion is the dependence of electrical properties of thin films as well as diode properties on the cation ratio. Furthermore, the long-term stability of the Schottky diodes and the influence of the oxygen supply during contact fabrication on the properties of the Schottky diodes are highlighted. The results of depth-resolved Xray photoelectron spectroscopy measurements are discussed and a mechanism leading to an improvement of the Schottky diodes over time is elucidated. The findings on the optimal cation composition and the influence of oxygen on the properties of Schottky diodes were used to produce metal-semiconductor field-effect transistors, which are described in the second part of this thesis. In a first step, the deposition conditions in the sputter chamber were optimized and a new deposition recipe for the fabrication of field effect transistors was developed. Here, too, all depositions take place at room temperature. Sputter deposition was chosen because this deposition method has greater industrial relevance than pulsed laser deposition. Metal-semiconductor field-effect-transistors with two different gate types are presented and the influence of the channel layer thickness on the transistor properties is investigated. The influence of the oxygen reservoir in the Schottky gate contact on the properties of the field-effect-transistors is shown as well as the influence of a thermal annealing process on the switching speed of the field-effect-transistors. In addition, simple inverters based on two identical field-effect-transistors are demonstrated. Also Schottky diode field-effect-transistor logic based inverters are presented and characterized. Finally, ring oscillators consisting of several series-connected Schottky diode field-effecttransistor logic based inverters are presented. The influence of channel layer thickness and gate geometry on the oscillation frequency is discussed.:Contents 1 Introduction 2 Theoretical Descriptions 2.1 The Amorphous Semiconductor Zinc Tin Oxide 2.2 Schottky Barrier Diodes 2.3 Field-Effect Transistors 2.4 Inverter 2.5 Inverter Chain and Ring Oscillator 3 Methods 3.1 Growth and Structuring Techniques 3.1.1 Pulsed Laser Deposition 3.1.2 Sputtering Deposition 3.1.3 Photolithography 3.2 Characterization Techniques 3.2.1 Hall Effect Measurements 3.2.2 XRD and XRR Measurements 3.2.3 Static and Dynamic Current-Voltage Measurements 3.2.4 Further Characterization Techniques 4 Physical Properties of Amorphous Zinc Tin Oxide 4.1 Characterization of Pulsed Laser Deposited Zinc Tin Oxide Thin Films Having a Continuous Composition Spread 4.2 Properties of Schottky Barrier Diodes in Dependence on the Cation Composition 4.3 Long Term Stability of Schottky Barrier Diodes 4.4 ImportantRoleofOxygenfortheFormationofHighlyRectifyingContacts 4.5 Processes Governing the Long Term Stability 5 Demonstration and Characterization of Zinc Tin Oxide Based Devices 5.1 Implementation of a New Sputtering Recipe 5.1.1 CharacterizationandElectricalOptimizationoftheZincTinOxide Thin Films .1.2 Optimization of the Gate Contact 5.2 Devices with PtOx/Pt Gate Contact 5.2.1 Variation of the Channel Thickness 5.2.2 Influence of the Oxygen Reservoir on the Performance and Long Term Stability of Devices 5.2.3 Tuning of the Electron Mobility 5.2.4 Frequency Dependent Switching of Transistors 5.3 Devices with i-ZTO/PtOx/Pt Gate Contact 5.3.1 Transistors with Varying Channel Thickness 5.3.2 Simple Inverter 5.3.3 SDFL Inverter 5.3.4 Inverter Chain 5.3.5 Ring Oscillators 5.4 Comparison to Literature 6 Summary and Outlook Abbreviations List of Symbols Bibliography List of Own and Contributed Articles Appendi
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