Cycle-accurate evaluation of reconfigurable photonic networks-on-chip

There is little doubt that the most important limiting factors of the performance of next-generation Chip Multiprocessors (CMPs) will be the power efficiency and the available communication speed between cores. Photonic Networks-on-Chip (NoCs) have been suggested as a viable route to relieve the off- and on-chip interconnection bottleneck. Low-loss integrated optical waveguides can transport very high-speed data signals over longer distances as compared to on-chip electrical signaling. In addition, with the development of silicon microrings, photonic switches can be integrated to route signals in a data-transparent way. Although several photonic NoC proposals exist, their use is often limited to the communication of large data messages due to a relatively long set-up time of the photonic channels. In this work, we evaluate a reconfigurable photonic NoC in which the topology is adapted automatically (on a microsecond scale) to the evolving traffic situation by use of silicon microrings. To evaluate this system's performance, the proposed architecture has been implemented in a detailed full-system cycle-accurate simulator which is capable of generating realistic workloads and traffic patterns. In addition, a model was developed to estimate the power consumption of the full interconnection network which was compared with other photonic and electrical NoC solutions. We find that our proposed network architecture significantly lowers the average memory access latency (35% reduction) while only generating a modest increase in power consumption (20%), compared to a conventional concentrated mesh electrical signaling approach. When comparing our solution to high-speed circuit-switched photonic NoCs, long photonic channel set-up times can be tolerated which makes our approach directly applicable to current shared-memory CMPs

Optical interconnection networks based on microring resonators

Optical microring resonators can be integrated on a chip to perform switching operations directly in the optical domain. Thus they become a building block to create switching elements in on-chip optical interconnection networks, which promise to overcome some of the limitations of current electronic networks. However, the peculiar asymmetric power losses of microring resonators impose new constraints on the design and control of on-chip optical networks. In this work, we study the design of multistage interconnection networks optimized for a particular metric that we name the degradation index, which characterizes the asymmetric behavior of microrings. We also propose a routing control algorithm to maximize the overall throughput, considering the maximum allowed degradation index as a constrain

A performance model of multicast communication in wormhole-routed networks on-chip

Collective communication operations form a part of overall traffic in most applications running on platforms employing direct interconnection networks. This paper presents a novel analytical model to compute communication latency of multicast as a widely used collective communication operation. The novelty of the model lies in its ability to predict the latency of the multicast communication in wormhole-routed architectures employing asynchronous multi-port routers scheme. The model is applied to the Quarc NoC and its validity is verified by comparing the model predictions against the results obtained from a discrete-event simulator developed using OMNET++

Optical Interconnection Networks Based on Microring Resonators

Abstract — Interconnection networks must transport an always increasing information density and connect a rising number of processing units. Electronic technologies have been able to sustain the traffic growth rate, but are getting close to their physical limits. In this context, optical interconnection networks are becoming progressively more attractive, especially because new photonic devices can be directly integrated in CMOS technology. Indeed, interest in microring resonators as switching components is rising, but their usability in full optical interconnection architectures is still limited by their physical characteristics. Indeed, differently from classical devices used for switching, switching elements based on microring resonators exhibit asymmetric power losses depending on the output ports input signals are directed to. In this paper, we study classical interconnection architectures such as crossbar, Benes and Clos networks exploiting microring resonators as building blocks. Since classical interconnection networks lack either scalability or complexity, we propose two new architectures to improve performance of microring based interconnection networks while keeping a reasonable complexity. I

Shortest path routing algorithm for hierarchical interconnection network-on-chip

Interconnection networks play a significant role in efficient on-chip communication for multicore systems. This paper introduces a new interconnection topology called the Hierarchical Cross Connected Recursive network (HCCR) and a shortest path routing algorithm for the HCCR. Proposed topology offers a high degree of regularity, scalability, and symmetry with a reduced number of links and node degree. A unique address encoding scheme is proposed for hierarchical graphical representation of HCCR networks, and based on this scheme a shortest path routing algorithm is devised. The algorithm requires 5(k-1) time where k=logn4-2 and k>0, in worst case to determine the next node along the shortest path

Technologies for 3D Heterogeneous Integration

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental processing steps will be described, as well as appropriate handling concepts. Three main concepts for 3D integration have been developed at IZM. The approach with the greatest flexibility called Inter Chip Via - Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences before joining them to integrated stacks.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Octopus - an energy-efficient architecture for wireless multimedia systems

Multimedia computing and mobile computing are two trends that will lead to a new application domain in the near future. However, the technological challenges to establishing this paradigm of computing are non-trivial. Personal mobile computing offers a vision of the future with a much richer and more exciting set of architecture research challenges than extrapolations of the current desktop architectures. In particular, these devices will have limited battery resources, will handle diverse data types, and will operate in environments that are insecure, dynamic and which vary significantly in time and location. The approach we made to achieve such a system is to use autonomous, adaptable modules, interconnected by a switch rather than by a bus, and to offload as much as work as possible from the CPU to programmable modules that is placed in the data streams. A reconfigurable internal communication network switch called Octopus exploits locality of reference and eliminates wasteful data copies