Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Design choices for next-generation IIoT-connected MES/MOM:An empirical study on smart factories

The role of enterprise information systems is becoming increasingly crucial for improving customer responsiveness in the manufacturing industry. However, manufacturers engaged in mass customization are currently facing challenges related to implementing Industrial Internet of Things (IIoT) concepts of Industry 4.0 in order to increase responsiveness. In this article, we apply the findings from a two-year design science study to establish the role of manufacturing execution systems/manufacturing operations management (MES/MOM) in an IIoT-enabled brownfield manufacturing enterprise. We also present design recommendations for developing next-generation MES/MOM as a strong core to make factories smart and responsive. First, we analyze the architectural design challenges of MES/MOM in IIoT through a selective literature review. We then present an exploratory case study in which we implement our homegrown MES/MOM data model design based on ISA 95 in Aalborg University's Smart Production Lab, which is a reconfigurable cyber-physical production system. This was achieved through the use of a custom module for the open-source Odoo ERP platform (mainly version 14). Finally, we enrich our case study with three industrial design demonstrators and combine the findings with a quality function deployment (QFD) method to determine design requirements for next-generation IIoT-connected MES/MOM. The results from our QFD analysis indicate that interoperability is the most important characteristic when designing a responsive smart factory, with the highest relative importance of 31% of the eight characteristics we studied

Human-Centred Dissemination of Data, Information and Knowledge in Industry 4.0

The manufacturing industry faces immense challenges for maintaining and increasing their productivity and flexibility. In this context, it is important for companies to ensure that their employees have the relevant data, information and knowledge necessary to make well-informed decisions. Due to recent development with Industry 4.0 enabling technologies that create new possibilities, the amount of available data, information and knowledge increase rapidly, but the insights into how to utilize it to its full potential are still lacking. In this paper, a human-centred perspective has been applied, aiming at improving how to cognitively support humans at work with new Industry 4.0 enabling technologies. Heavy emphasis is placed on people’s requirements and preferences of data, information and knowledge for enhancing their performance and satisfaction at work. This paper examines the relationship between existing literature on dissemination of data, information and knowledge within the manufacturing industry with state-of-the-art research on Industry 4.0. The outcome of the research recognizes the increased importance of utilizing data, information and knowledge for people at work, facilitated by exploiting the new possibilities from Industry 4.0. To accomplish this, it is concluded that there exists an urgency to design: both a holistic framework for identifying and accommodating individuals’ needs and expectations of relevant data, information and knowledge; and demonstrators and concepts to simplify the implementation of Industry 4.0 enabling technologies that support the aforementioned dissemination of data, information and knowledge

Conformable light emitting modules

As we become increasingly aware that there is more to light than the image it forms on our retina, and as we become more environmentally aware, the value of non-image-forming light increases along with the need for various new light related appliances. In particular, some lighting related applications are emerging which demand conformability (flexibility and stretchability). Well-being, automotive or wearable electronic applications are just a few examples where these trends can be observed. We are finding that conformability could bring various benefits to both users (tactile and optical comfort, optical efficiency, multi-functionality, work/living space savings) as well as manufacturers (heterogeneous integration, light-weight, design freedom, differentiation and less stringent tolerancing). Developed by Ghent University, the SMI (Stretchable Molded Interconnect) technology attempts to address these demands and has been the main focus of this work. With the SMI technology it was possible to design highly conformable circuits using fabrication methods similar to these found in the PCB and FCB industries and standard off-the-shelf electronic components. The goal of this work was to characterize the technology materials in terms of mechanical, optical and reliability performance as well as define a set of design rules to support creation of robust and efficient light modules, also using a set of new, commercially available elastomeric, polymer materials. The developments are illustrated with demonstration devices

Benefits and challenges of applying Semantic Web Services in the e-Government domain

Joining up services in e-Government usually implies governmental agencies acting in concert without a central control regime. This requires the sharing of scattered and heterogeneous data. Semantic Web Service (SWS) technology can help to integrate, mediate and reason between these datasets. However, since few real-world applications have been developed, it is still unclear which are the actual benefits and issues of adopting such a technology in the e-Government domain. In this paper, we contribute to raising awareness of the potential benefits in the e-Government community by analyzing motivations, requirements, and expected results, before proposing a reusable SWS-based framework. We demonstrate the application of this framework by a compelling use case: a GIS-based emergency planning system. We illustrate the obtained benefits and the key challenges which remain to be addressed

Dynamics of Smart Specialisation Agri-food Trans-regional Cooperation S3 Policy Brief Series No. 21/2017

The objective of this paper is to inform the community of researchers, policymakers and practitioners about the dynamics of setting up the Thematic Smart Specialisation Platform on Agri-food, and to provide information about its functioning and governance. This work outlines the milestones of the process and the main achievements. The paper proposes the steps to be followed by policymakers and regional officers who are motivated to lead, support and actively contribute to a thematic platform within the Thematic Smart Specialisation Platform on Agri-food. At the same time, it discusses specific cases of such partnerships and describes the motivations and objectives of the regions that decided to embark on the journey towards establishment of specific thematic partnerships through this Platform.JRC.B.3-Territorial Developmen

Progress in the Smart Pixel Technologies

The purpose of this paper is to review the recent progress in the developing smart pixel technologies. The paper begins by reviewing some of the rapidly evolving smart pixel terminologies. It then describes several of the smart pixel technologies that have recently emerged. Finally, it outlines the performance of these technologies in both device complexity and aggregate capacity. The reviewed SPA technologies include both the modulator-based FET-SEED, hybrid CMOS-SEED, and LCOS smart pixels and the source-based hybrid VCSEL/MSM, ELO, flip-chip-bonded VCSEL/MSM, and monolithic MSM/MESFET/VCSEL smart pixels