132 research outputs found

    Portable Computer Technology (PCT) Research and Development Program Phase 2

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    The subject of this project report, focused on: (1) Design and development of two Advanced Portable Workstation 2 (APW 2) units. These units incorporate advanced technology features such as a low power Pentium processor, a high resolution color display, National Television Standards Committee (NTSC) video handling capabilities, a Personal Computer Memory Card International Association (PCMCIA) interface, and Small Computer System Interface (SCSI) and ethernet interfaces. (2) Use these units to integrate and demonstrate advanced wireless network and portable video capabilities. (3) Qualification of the APW 2 systems for use in specific experiments aboard the Mir Space Station. A major objective of the PCT Phase 2 program was to help guide future choices in computing platforms and techniques for meeting National Aeronautics and Space Administration (NASA) mission objectives. The focus being on the development of optimal configurations of computing hardware, software applications, and network technologies for use on NASA missions

    The Design, Development, Characterization, and Validation of a Pathway Measurement Tool (PathMeT)

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    Over 3.6 million people in the United States use a wheelchair for their primary means of mobility, and they rely on functional and accessible pathways to participate in their communities. These wheelchair users are often exposed to dangerous conditions, including vibrations, as they traverse pedestrian pathways. Ambulatory pedestrians also face health risks; approximately one-third of adults 65 or older fall each year, over half of which occur outdoors. Consequently, improving pedestrian pathways is an important task, and this paper describes the development of a tool, referred to as Pathway Measurement Tool (PathMeT), that characterizes pedestrian pathways according to the Americans with Disabilities Act Accessibility Guidelines. The design goals for the product were to develop a user-friendly device that accurately measures slope, level change, and roughness along pedestrian pathways, while gathering pictures and GPS location. Data collection occurred at multiple locations around the United States. Reliability testing was performed to assess the repeatability of PathMeT. Results show that PathMeT is capable of measuring pathway roughness accurately while identifying hazardous level changes. This information can then be uploaded into Geographic Information Systems. Although inclination data was collected, additional development and filtering must occur to record more accurate data to indicate slope. PathMeT has shown to be a reliable device in identifying rough pathways and potential tripping hazards. Many stakeholders believe that PathMeT has great market potential to assist in the planning and reconstruction of pedestrian pathways

    Laser beam characterisation for industrial applications

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    This thesis describes the theory, development and applications of laser beam characterisation for industrial laser materials processing systems. Descriptions are given of novel forms of beam diagnostic systems and their integration into highly automated industrial tools. Work is also presented that has contributed to the new ISO standard on beam characterisation. Particular emphasis is given to excimer laser applications and UV micromachining. [Continues.

    Active Pixel Sensor Architectures for High Resolution Large Area Digital Imaging

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    This work extends the technology of amorphous silicon (a-Si) thin film transistors (TFTs) from traditional switching applications to on-pixel signal amplification for large area digital imaging and in particular, is aimed towards enabling emerging low noise, high resolution and high frame rate medical diagnostic imaging modalities such as digital tomosynthesis. A two transistor (2T) pixel amplifier circuit based on a novel charge-gate thin film transistor (TFT) device architecture is introduced to shrink the TFT based pixel readout circuit size and complexity and thus, improve the imaging array resolution and reliability of the TFT fabrication process. The high resolution pixel amplifier results in improved electrical performance such as on-pixel amplification gain, input referred noise and faster readouts. In this research, a charge-gated TFT that operates as both a switched amplifier and driver is used to replace two transistors (the addressing switch and the amplifier transistor) of previously reported three transistor (3T) APS pixel circuits.. In addition to enabling smaller pixels, the proposed 2T pixel amplifier results in better signal-to-noise (SNR) by removing the large flicker noise source associated with the switched TFT and increased pixel transconductance gain since the large ON-state resistance of the switched TFT is removed from the source of the amplifier TFT. Alternate configurations of 2T APS architectures based on source or drain switched TFTs are also investigated, compared, and contrasted to the gate switched architecture using charge-gated TFT. A new driving scheme based on multiple row resetting is introduced which combined with the on-pixel gain of the APS, offers considerable improvements in imaging frame rates beyond those feasible for PPS based pixels. The novel developed 2T APS architectures is implemented in single pixel test structures and in 88 pixel test arrays with a pixel pitch of 100 µm. The devices were fabricated using an in-house developed top-gate TFT fabrication process. Measured characteristics of the test devices confirm the performance expectations of the 2T architecture design. Based on parameters extracted from fabricated TFTs, the input referred noise is calculated, and the instability in pixel transconductance gain over prolonged operation tine is projected for different imaging frame rates. 2T APS test arrays were packaged and integrated with an amorphous selenium (a-Se) direct x-ray detector, and the x-ray response of the a-Se detector integrated with the novel readout circuit was evaluated. The special features of the APS such as non-destructive readout and voltage programmable on-pixel gain control are verified. The research presented in this thesis extends amorphous silicon pixel amplifier technology into the area of high density pixel arrays such as large area medical X-ray imagers for digital mammography tomosynthesis. It underscores novel device and circuit design as an effective method of overcoming the inherent shortcomings of the a-Si material . Although the developed device and circuit ideas were implemented and tested using a-Si TFTs, the scope of the device and circuit designs is not limited to amorphous silicon technology and has the potential to be applied to more mainstream technologies, for example, in CMOS active pixel sensor (APS) based digital cameras

    Design of LCOS microdisplay backplanes for projection applications

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    De evolutie van licht emitterende diodes (LED) heeft ervoor gezorgd dat het op dit moment interessant wordt om deze componenten als lichtbron te gebruiken in projectiesystemen. LED’s hebben belangrijke voordelen vergeleken met klassieke booglampen. Ze zijn compact, ze hebben een veel grotere levensduur en ogenblikkelijke schakeltijden, ze werken op lage spanningen, etc. LED’s zijn smalbandig en kunnen een groterekleurenbereik realiseren. Ze hebben momenteel echter een beperkte helderheid. Naast de lichtbron is het type van de lichtklep ook bepalend voor de kwaliteit van een projectiesysteem. Er bestaan verschillende lichtkleptechnologieën waaronder die van de reflectieve LCOS-panelen. Deze lichtkleppen kunnen zeer hoge resoluties hebben en wordenvaak gebruikt in kwalitatieve, professionele projectiesystemen. LED’s zijn echter totaal verschillend van booglampen. Ze hebben een andere vorm, package, stralingspatroon, aansturing, fysische en thermische eigenschappen, etc. Hoewel er een twintigtal optische architecturen bekend zijn voor reflectieve beeldschermen (met een booglamp als lichtbron), zijn ze niet geschikt voor LED-projectoren en moeten nieuwe optische architecturen en een elektronische aansturing ontwikkeld worden. In dit doctoraat werd er hieromtrent onderzoek gedaan. Er werd uiteindelijk een driekleurenprojector (R, G, B) met een efficiënt LED-belichtingssysteem gebouwd met twee LCOS-lichtkleppen. Deze LEDprojector heeft superieure eigenschappen (zeer lange levensduur, beeldkwaliteit, etc.) en een matige lichtopbrengst

    Development of an acoustic measurement system of the Modulus of Elasticity in trees, logs and boards

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    The objective of this Bachelor’s Thesis is to develop a portable electronic device capable of quantifying the stiffness of the wood of standing trees, logs and boards using non-destructive testing (NDT) by means of acoustic wave analysis. As an indicator of stiffness, the Modulus of Elasticity (MOE) is used, a standard figure in the industry. This way, wood from forestry can be characterized and classified for different purposes. This Thesis is part of LIFE Wood For Future, a project of the University of Granada (UGR) financed by the European Union’s LIFE programme. LIFE Wood For Future aims to recover the cultivation of poplar (populus sp.) in the Vega de Granada, by proving the quality of its wood through innovative structural bioproducts. Recovering the poplar groves of Granada would have great benefits for the Metropolitan Area: creation of local and sustainable jobs, improvement of biodiversity, and increase in the absorption of carbon dioxide in the long term, helping to reduce the endemic air pollution of Granada. This Final Degree Project has been developed in collaboration with the ADIME research group of the Higher Technical School of Building Engineering (ETSIE) and the aerospace electronics group GranaSat of the UGR. The goal of the developed device, named Tree Inspection Kit (or TIK), is to be an innovative, portable and easy-to-use tool for non-destructive diagnosis and classification of wood by measuring its MOE. TIK is equipped with the necessary electronics to quantify the Time of Flight (ToF) of an acoustic wave that propagates inside a piece of wood. In order to do this, two piezoelectric probes are used, nailed in the wood and separated a given distance longitudinally. The MOE can be derived from the propagation speed of the longitudinal acoustic wave if the density of the is known. For this reason, this device has the possibility of connecting a load cell for weighing logs or boards to estimate their density. It also has an expansion port reserved for future functionality. A methodology based on the Engineering Design Process (EDP) has been followed. The scope of this project embraces all aspects of the development of an electronic product from start to finish: conceptualization, specification of requirements, design, manufacture and verification. A project of this reach requires planning, advanced knowledge of signal analysis, electronics, design and manufacture of Printed Circuit Boards (PCB) and product design, as well as the development of a firmware for the embedded system, based on a RTOS. Prior to the design of the electronics, a Reverse Engineering process of some similar products of the competition is performed; as well as an exhaustive analysis of the signals coming from the piezoelectric sensors that are going to be used, and the frequency response characterization of the piezoelectric probes themselves. This project has as its ultimate goal the demonstration of the multidisciplinary knowledge of engineering, and the capacity of analysis, design and manufacturing by the author; his skill and professionalism in CAD and EDA software required for these tasks, as well as in the documentation of the entire process.El presente Trabajo de Fin de Grado tiene como objetivo el desarrollo de un dispositivo electrónico portátil capaz de cuantificar la rigidez de la madera de árboles en pie, trozas y tablas usando ensayos no destructivos (Non-Destructive Testing, NDT) por medio del análisis de ondas acústicas. Como indicador de la rigidez se usa el Módulo de Elasticidad (MOE), una figura estándar en la industria. Este TFG forma parte de LIFE Wood For Future, un proyecto de la Universidad de Granada (UGR) financiado por el programa LIFE de la Unión Europea. LIFEWood For Future tiene como objetivo recuperar el cultivo del chopo (populus sp.) en la Vega de Granada demostrando la viabilidad de su madera a través de bioproductos estructurales innovadores. Recuperar las choperas de Granada tendría grandes beneficios para la zona del Área Metropolitana: creación de puestos de trabajo locales y sostenibles, mejora de la biodiversidad, e incremento de la tasa de absorción de dióxido de carbono a largo plazo, contribuyendo a reducir la contaminación endémica del aire en Granada. Este Trabajo de Fin de Grado se ha desarrollado con la colaboración del grupo de investigación ADIME de la Escuela Técnica Superior de Ingeniería de Edificación (ETSIE) y el grupo de electrónica aeroespacial GranaSat de la UGR. El objetivo del dispositivo, denominado Tree Inspection Kit (TIK), es ser una herramienta innovadora, portátil y fácil de usar para el diagnóstico y clasificación no destructiva de la madera por medio de su MOE. TIK está dotado de la electrónica necesaria para medir el tiempo de tránsito (ToF) de una onda acústica que se propaga en el interior de una pieza de madera. Para ello, se utilizan dos sondas piezoeléctricas clavadas en la madera y separadas longitudinalmente una distancia conocida. De la velocidad de propagación de la onda longitudinal se puede derivar el MOE, previo conocimiento de la densidad del material. Por ello, este dispositivo cuenta con la posibilidad de conectarle una célula de carga y pesar trozas o tablas para estimar su densidad. También tiene un puerto de expansión reservado para funcionalidad futura. Se ha seguido una metodología basada en el Proceso de Diseño de Ingeniería (Engineering Design Process, EDP), abarcando todos los aspectos del desarrollo de un producto electrónico de principio a fin: conceptualización, especificación de requisitos, diseño, fabricación y verificación. Un proyecto de este alcance requiere de planificación, conocimientos avanzados de análisis de señales, de electrónica, de diseño y fabricación de Placas de Circuito Impreso (PCB) y de diseño de producto, así como el desarrollo de un firmware para el sistema empotrado, basado en un RTOS. Previo al diseño de la electrónica, se realiza un proceso de Ingeniería Inversa (Reverse Engineering) de algunos productos similares de la competencia; al igual que un exhaustivo análisis de las señales provenientes de los sensores piezoeléctricos que van a utilizarse y la caracterización en frecuencia de las propias sondas piezoeléctricas. Este proyecto tiene como fin último la demostración de los conocimientos multidisciplinares propios de la ingeniería y la capacidad de análisis, diseño y fabricación por parte del autor; su habilidad y profesionalidad en el software CAD y EDA requerido para estas tareas, así como en la documentación de todo el proceso.Unión Europe

    Pixel design and characterization of high-performance tandem OLED microdisplays

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    Organic Light-Emitting Diode (OLED) microdisplays - miniature Electronic Displays comprising a sandwich of organic light emitting diode over a substrate containing CMOS circuits designed to function as an active matrix backplane – were first reported in the 1990s and, since then, have advanced to the mainstream. The smaller dimensions and higher performance of CMOS circuit elements compared to that of equivalent thin film transistors implemented in technologies for large OLED display panels offer a distinct advantage for ultra-miniature display screens. Conventional OLED has suffered from lifetime degradation at high brightness and high current density. Recently, tandem-structure OLED devices have been developed using charge generation layers to implement two or more OLED units in a single stack. They can achieve higher brightness at a given current density. The combination of emissive-nature, fast response, medium to high luminance, low power consumption and appropriate lifetime makes OLED a favoured candidate for near-to-eye systems. However, it is also challenging to evaluate the pixel level optical response of OLED microdisplays as the pixel pitch is extremely small and relative low light output per pixel. Advanced CMOS Single Photon Avalanche Diode (SPAD) technology is progressing rapidly and is being deployed in a wide range of applications. It is also suggested as a replacement for photomultiplier tube (PMT) for photonic experiments that require high sensitivity. CMOS SPAD is a potential tool for better and cheaper display optical characterizations. In order to incorporate the novel tandem structure OLED within the computer aided design (CAD) flow of microdisplays, we have developed an equivalent circuit model that accurately describes the tandem OLED electrical characteristics. Specifically, new analogue pulse width modulation (PWM) pixel circuit designs have been implemented and fabricated in small arrays for test and characterization purposes. We report on the design and characterization of these novel pixel drive circuits for OLED microdisplays. Our drive circuits are designed to allow a state-of-the-art sub-pixel pitch of around 5 μm and implemented in 130 nm CMOS. A performance comparison with a previous published analogue PWM pixel is reported. Moreover, we have employed CMOS SPAD sensors to perform detailed optical measurements on the OLED microdisplay pixels at very high sampling rate (50 kHz, 10 μs exposure), very low light level (2×10-4 cd/m2) and over a very wide dynamic range (83 dB) of luminance. This offers a clear demonstration of the potential of the CMOS SPAD technology to reveal hitherto obscure details of the optical characteristics of individual and groups of OLED pixels and thereby in display metrology in general. In summary, there are three key contributions to knowledge reported in this thesis. The first is a new equivalent circuit model specifically for tandem structure OLED. The model is verified to provide accurately illustrate the electrical response of the tandem OLED with different materials. The second is the novel analogue PWM pixel achieve a 5μm sub-pixel pitch with 2.4 % pixel-to-pixel variation. The third is the new application and successful characterization experiment of OLED microdisplay pixels with SPAD sensors. It revealed the OLED pixel overshoot behaviour with a QIS SPAD sensor

    A Physics of Failure Based Qualification Process for Flexible Display Interconnect Materials

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    The next paradigm shift in display technology involves making them flexible, bringing with it many challenges with respect to product reliability. To compound the problem, industry is continuously introducing novel materials and experimenting with device geometries to improve flexibility and optical performance. Hence, a method to rapidly qualify these new designs for high reliability applications is imperative. This dissertation involves the development of a qualification process for gate line interconnects used in flexible displays. The process starts with the observed failure mode of permanent horizontal lines in the displays, followed by the identification of the underlying failure mechanism. Finite element analyses are developed to determine the relationship between the physical flexing and the mechanical stress imposed on the traces. The design of an accelerated life test is performed based on the known agent of failure being cyclic bending that induces a tensile strain. A versatile dedicated test system is designed and integrated in order to rapidly capture changes in resistance of multiple traces during test. Dedicated test structures are also designed and fabricated to facilitate in-situ electrical measurements and direct observations. Since the test structures were consumed during the integration of the test system, random failure times are used in the process of determining a life-stress model. Different models are compared with respect to their applicability to the underlying failure mechanism as well as parameter estimation techniques. This methodology may be applied towards the rapid qualification of other novel materials, process conditions, and device geometries prior to their widespread use in future display systems
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