3,945 research outputs found

    Thermal Analysis of VLSI System: A Simulation Study

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    Smaller size of Very Large Scale Integrated (VLSI) System nowadays increases the on chip power densities causing the rise of temperature in the system. The high temperature produced will eventually affects the clock frequency of the system and changes the timing setup of the component. These lead to lowering the performance and reliability of the system. Due to the negative effects of the high temperature, designers have to determine the thermal profile of the systems in order to understand the temperature distribution, the leakage reduction and estimate the power distribution of the system. This research focuses on analyzing the thermal profile of a VLSI system under steady state condition using numerical techniques and simulation. For the numerical techniques, the governing heat equation for a two-dimensional (2D) model was solved using Finite Difference Method (FDM), Gauss-Seidel (GS) and Successive Over Relaxation (SOR) methods. Simulation based on ANSYS simulator has been conducted for validation purpose. Most commonly material used in VLSI system which is Silicon (Si) is tested under adiabatic condition. The results for numerical techniques and the simulation are compared. SOR method shows better results in terms of number of iterations and the computational time compared to GS method in solving the governing heat equation. Both methods have the same maximum temperature and these temperatures are comparable with the result obtained by using ANSYS

    Integrated Application of Active Controls (IAAC) technology to an advanced subsonic transport project: Current and advanced act control system definition study. Volume 2: Appendices

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    The current status of the Active Controls Technology (ACT) for the advanced subsonic transport project is investigated through analysis of the systems technical data. Control systems technologies under examination include computerized reliability analysis, pitch axis fly by wire actuator, flaperon actuation system design trade study, control law synthesis and analysis, flutter mode control and gust load alleviation analysis, and implementation of alternative ACT systems. Extensive analysis of the computer techniques involved in each system is included

    Metodologia Per la Caratterizzazione di amplificatori a basso rumore per UMTS

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    In questo lavoro si presenta una metodologia di progettazione elettronica a livello di sistema, affrontando il problema della caratterizzazione dello spazio di progetto dell' amplificatore a basso rumore costituente il primo stadio di un front end a conversione diretta per UMTS realizzato in tecnologia CMOS con lunghezza di canale .18u. La metodologia ĆØ sviluppata al fine di valutare in modo quantititativo le specifiche ottime di sistema per il front-end stesso e si basa sul concetto di Piattaforma Analogica, che prevede la costruzione di un modello di prestazioni per il blocco analogico basato su campionamento statistico di indici di prestazioni del blocco stesso, misurati tramite simulazione di dimensionamenti dei componenti attivi e passivi soddisfacenti un set di equazioni specifico della topologia circuitale. Gli indici di prestazioni vengono successivamente ulizzati per parametrizzare modelli comportamentali utilizzati nelle fasi di ottimizzazione a livello di sistema. Modelli comportamentali atti a rappresentare i sistemi RF sono stati pertanto studiati per ottimizzare la scelta delle metriche di prestazioni. L'ottimizzazione dei set di equazioni atti a selezionare le configurazione di interesse per il campionamento ha al tempo stesso richiesto l'approfondimento dei modelli di dispositivi attivi validi in tutte le regioni di funzionamento, e lo studio dettagliato della progettazione degli amplificatori a basso rumore basati su degenerazione induttiva. Inoltre, il problema della modellizzazione a livello di sistema degli effetti della comunicazione tra LNA e Mixer ĆØ stato affrontato proponendo e analizzando diverse soluzioni. Il lavoro ha permesso di condurre un'ottimizzazione del front-end UMTS, giungendo a specifiche ottime a livello di sistema per l'amplificatore stesso

    Continuum Mechanics

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    Continuum Mechanics is the foundation for Applied Mechanics. There are numerous books on Continuum Mechanics with the main focus on the macroscale mechanical behavior of materials. Unlike classical Continuum Mechanics books, this book summarizes the advances of Continuum Mechanics in several defined areas. Emphasis is placed on the application aspect. The applications described in the book cover energy materials and systems (fuel cell materials and electrodes), materials removal, and mechanical response/deformation of structural components including plates, pipelines etc. Researchers from different fields should be benefited from reading the mechanics approached to real engineering problems

    Thermal Analysis of VLSI System: A Simulation Study

    Get PDF
    Smaller size of Very Large Scale Integrated (VLSI) System nowadays increases the on chip power densities causing the rise of temperature in the system. The high temperature produced will eventually affects the clock frequency of the system and changes the timing setup of the component. These lead to lowering the performance and reliability of the system. Due to the negative effects of the high temperature, designers have to determine the thermal profile of the systems in order to understand the temperature distribution, the leakage reduction and estimate the power distribution of the system. This research focuses on analyzing the thermal profile of a VLSI system under steady state condition using numerical techniques and simulation. For the numerical techniques, the governing heat equation for a two-dimensional (2D) model was solved using Finite Difference Method (FDM), Gauss-Seidel (GS) and Successive Over Relaxation (SOR) methods. Simulation based on ANSYS simulator has been conducted for validation purpose. Most commonly material used in VLSI system which is Silicon (Si) is tested under adiabatic condition. The results for numerical techniques and the simulation are compared. SOR method shows better results in terms of number of iterations and the computational time compared to GS method in solving the governing heat equation. Both methods have the same maximum temperature and these temperatures are comparable with the result obtained by using ANSYS

    34th Midwest Symposium on Circuits and Systems-Final Program

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    Organized by the Naval Postgraduate School Monterey California. Cosponsored by the IEEE Circuits and Systems Society. Symposium Organizing Committee: General Chairman-Sherif Michael, Technical Program-Roberto Cristi, Publications-Michael Soderstrand, Special Sessions- Charles W. Therrien, Publicity: Jeffrey Burl, Finance: Ralph Hippenstiel, and Local Arrangements: Barbara Cristi

    Dynamic element matching techniques for data converters

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    Analog to digital converter (ADC) circuit component errors create nonuniform quantization code widths and create harmonic distortion in an ADC\u27s output. In this dissertation, two techniques for estimating an ADC\u27s output spectrum from the ADC\u27s transfer function are determined. These methods are compared to a symmetric power function and asymmetric power function approximations. Standard ADC performance metrics, such as SDR, SNDR, SNR, and SFDR, are also determined as a function of the ADC\u27s transfer function approximations. New dynamic element matching (DEM) flash ADCs are developed. An analysis of these DEM flash ADCs is developed and shows that these DEM algorithms improve an ADC\u27s performance. The analysis is also used to analyze several existing DEM ADC architectures; Digital to analog converter (DAC) circuit component errors create nonuniform quantization code widths and create harmonic distortion in a DAC\u27s output. In this dissertation, an exact relationship between a DAC\u27s integral nonlinearity (INL) and its output spectrum is determined. Using this relationship, standard DAC performance metrics, such as SDR, SNDR, SNR, and SFDR, are calculated from the DAC\u27s transfer function. Furthermore, an iterative method is developed which determines an arbitrary DAC\u27s transfer function from observed output magnitude spectra. An analysis of DEM techniques for DACs, including the determination of several suitable metrics by which DEM techniques can be compared, is derived. The performance of a given DEM technique is related to standard DAC performance metrics, such as SDR, SNDR, and SFDR. Conditions under which DEM techniques can guarantee zero average INL and render the distortion due to mismatched components as white noise are developed. Several DEM circuits proposed in the literature are shown to be equivalent and have hardware efficient implementations based on multistage interconnection networks. Example DEM circuit topologies and their hardware efficient VLSI implementations are also presented
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