Symbolic QED Pre-silicon Verification for Automotive Microcontroller Cores: Industrial Case Study

We present an industrial case study that demonstrates the practicality and effectiveness of Symbolic Quick Error Detection (Symbolic QED) in detecting logic design flaws (logic bugs) during pre-silicon verification. Our study focuses on several microcontroller core designs (~1,800 flip-flops, ~70,000 logic gates) that have been extensively verified using an industrial verification flow and used for various commercial automotive products. The results of our study are as follows: 1. Symbolic QED detected all logic bugs in the designs that were detected by the industrial verification flow (which includes various flavors of simulation-based verification and formal verification). 2. Symbolic QED detected additional logic bugs that were not recorded as detected by the industrial verification flow. (These additional bugs were also perhaps detected by the industrial verification flow.) 3. Symbolic QED enables significant design productivity improvements: (a) 8X improved (i.e., reduced) verification effort for a new design (8 person-weeks for Symbolic QED vs. 17 person-months using the industrial verification flow). (b) 60X improved verification effort for subsequent designs (2 person-days for Symbolic QED vs. 4-7 person-months using the industrial verification flow). (c) Quick bug detection (runtime of 20 seconds or less), together with short counterexamples (10 or fewer instructions) for quick debug, using Symbolic QED

Trojans in Early Design Steps—An Emerging Threat

Hardware Trojans inserted by malicious foundries during integrated circuit manufacturing have received substantial attention in recent years. In this paper, we focus on a different type of hardware Trojan threats: attacks in the early steps of design process. We show that third-party intellectual property cores and CAD tools constitute realistic attack surfaces and that even system specification can be targeted by adversaries. We discuss the devastating damage potential of such attacks, the applicable countermeasures against them and their deficiencies

A Benes Based NoC Switching Architecture for Mixed Criticality Embedded Systems

Multi-core, Mixed Criticality Embedded (MCE) real-time systems require high timing precision and predictability to guarantee there will be no interference between tasks. These guarantees are necessary in application areas such as avionics and automotive, where task interference or missed deadlines could be catastrophic, and safety requirements are strict. In modern multi-core systems, the interconnect becomes a potential point of uncertainty, introducing major challenges in proving behaviour is always within specified constraints, limiting the means of growing system performance to add more tasks, or provide more computational resources to existing tasks. We present MCENoC, a Network-on-Chip (NoC) switching architecture that provides innovations to overcome this with predictable, formally verifiable timing behaviour that is consistent across the whole NoC. We show how the fundamental properties of Benes networks benefit MCE applications and meet our architecture requirements. Using SystemVerilog Assertions (SVA), formal properties are defined that aid the refinement of the specification of the design as well as enabling the implementation to be exhaustively formally verified. We demonstrate the performance of the design in terms of size, throughput and predictability, and discuss the application level considerations needed to exploit this architecture

Platform Dependent Verification: On Engineering Verification Tools for 21st Century

The paper overviews recent developments in platform-dependent explicit-state LTL model checking.Comment: In Proceedings PDMC 2011, arXiv:1111.006

A Reuse-based framework for the design of analog and mixed-signal ICs

Despite the spectacular breakthroughs of the semiconductor industry, the ability to design integrated circuits (ICs) under stringent time-to-market (TTM) requirements is lagging behind integration capacity, so far keeping pace with still valid Moore's Law. The resulting gap is threatening with slowing down such a phenomenal growth. The design community believes that it is only by means of powerful CAD tools and design methodologies -and, possibly, a design paradigm shift-that this design gap can be bridged. In this sense, reuse-based design is seen as a promising solution, and concepts such as IP Block, Virtual Component, and Design Reuse have become commonplace thanks to the significant advances in the digital arena. Unfortunately, the very nature of analog and mixed-signal (AMS) design has hindered a similar level of consensus and development. This paper presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow that facilitates the incorporation of AMS reusable blocks, reduces the overall design time, and expedites the management of increasing AMS design complexity; (2) a complete, clear definition of the AMS reusable block, structured into three separate facets or views: the behavioral, structural, and layout facets, the two first for top-down electrical synthesis and bottom-up verification, the latter used during bottom-up physical synthesis; (3) the design for reusability set of tools, methods, and guidelines that, relying on intensive parameterization as well as on design knowledge capture and encapsulation, allows to produce fully reusable AMS blocks. A case study and a functional silicon prototype demonstrate the validity of the paper's proposals.Ministerio de Educación y Ciencia TEC2004-0175

Internationalisation of Innovation: Why Chip Design Moving to Asia

This paper will appear in International Journal of Innovation Management, special issue in honor of Keith Pavitt, (Peter Augsdoerfer, Jonathan Sapsed, and James Utterback, guest editors), forthcoming. Among Keith Pavitt's many contributions to the study of innovation is the proposition that physical proximity is advantageous for innovative activities that involve highly complex technological knowledge But chip design, a process that creates the greatest value in the electronics industry and that requires highly complex knowledge, is experiencing a massive dispersion to leading Asian electronics exporting countries. To explain why chip design is moving to Asia, the paper draws on interviews with 60 companies and 15 research institutions that are doing leading-edge chip design in Asia. I demonstrate that "pull" and "policy" factors explain what attracts design to particular locations. But to get to the root causes that shift the balance in favor of geographical decentralization, I examine "push" factors, i.e. changes in design methodology ("system-on-chip design") and organization ("vertical specialization" within global design networks). The resultant increase in knowledge mobility explains why chip design - that, in Pavitt's framework is not supposed to move - is moving from the traditional centers to a few new specialized design clusters in Asia. A completely revised and updated version has been published as: " Complexity and Internationalisation of Innovation: Why is Chip Design Moving to Asia?," in International Journal of Innovation Management, special issue in honour of Keith Pavitt, Vol. 9,1: 47-73.