Form Factor Improvement of Smart-Pixels for Vision Sensors through 3-D Vertically- Integrated Technologies

While conventional CMOS active pixel sensors embed only the circuitry required for photo-detection, pixel addressing and voltage buffering, smart pixels incorporate also circuitry for data processing, data storage and control of data interchange. This additional circuitry enables data processing be realized concurrently with the acquisition of images which is instrumental to reduce the number of data needed to carry to information contained into images. This way, more efficient vision systems can be built at the cost of larger pixel pitch. Vertically-integrated 3D technologies enable to keep the advnatges of smart pixels while improving the form factor of smart pixels.Office of Naval Research N000141110312Ministerio de Ciencia e Innovación IPT-2011-1625-43000

CMOS Vision Sensors: Embedding Computer Vision at Imaging Front-Ends

CMOS Image Sensors (CIS) are key for imaging technol-ogies. These chips are conceived for capturing opticalscenes focused on their surface, and for delivering elec-trical images, commonly in digital format. CISs may incor-porate intelligence; however, their smartness basicallyconcerns calibration, error correction and other similartasks. The term CVISs (CMOS VIsion Sensors) definesother class of sensor front-ends which are aimed at per-forming vision tasks right at the focal plane. They havebeen running under names such as computational imagesensors, vision sensors and silicon retinas, among others. CVIS and CISs are similar regarding physical imple-mentation. However, while inputs of both CIS and CVISare images captured by photo-sensors placed at thefocal-plane, CVISs primary outputs may not be imagesbut either image features or even decisions based on thespatial-temporal analysis of the scenes. We may hencestate that CVISs are more “intelligent” than CISs as theyfocus on information instead of on raw data. Actually,CVIS architectures capable of extracting and interpretingthe information contained in images, and prompting reac-tion commands thereof, have been explored for years inacademia, and industrial applications are recently ramp-ing up.One of the challenges of CVISs architects is incorporat-ing computer vision concepts into the design flow. Theendeavor is ambitious because imaging and computervision communities are rather disjoint groups talking dif-ferent languages. The Cellular Nonlinear Network Univer-sal Machine (CNNUM) paradigm, proposed by Profs.Chua and Roska, defined an adequate framework forsuch conciliation as it is particularly well suited for hard-ware-software co-design [1]-[4]. This paper overviewsCVISs chips that were conceived and prototyped at IMSEVision Lab over the past twenty years. Some of them fitthe CNNUM paradigm while others are tangential to it. Allthem employ per-pixel mixed-signal processing circuitryto achieve sensor-processing concurrency in the quest offast operation with reduced energy budget.Junta de Andalucía TIC 2012-2338Ministerio de Economía y Competitividad TEC 2015-66878-C3-1-R y TEC 2015-66878-C3-3-

A versatile sensor interface for programmable vision systems-on-chip

This paper describes an optical sensor interface designed for a programmable mixed-signal vision chip. This chip has been designed and manufactured in a standard 0.35μm n-well CMOS technology with one poly layer and five metal layers. It contains a digital shell for control and data interchange, and a central array of 128 × 128 identical cells, each cell corresponding to a pixel. Die size is 11.885 × 12.230mm2 and cell size is 75.7μm × 73.3μm. Each cell contains 198 transistors dedicated to functions like processing, storage, and sensing. The system is oriented to real-time, single-chip image acquisition and processing. Since each pixel performs the basic functions of sensing, processing and storage, data transferences are fully parallel (image-wide). The programmability of the processing functions enables the realization of complex image processing functions based on the sequential application of simpler operations. This paper provides a general overview of the system architecture and functionality, with special emphasis on the optical interface.European Commission IST-1999-19007Office of Naval Research (USA) N00014021088

On evolution of CMOS image sensors

CMOS Image Sensors have become the principal technology in majority of digital cameras. They started replacing the film and Charge Coupled Devices in the last decade with the promise of lower cost, lower power requirement, higher integration and the potential of focal plane processing. However, the principal factor behind their success has been the ability to utilise the shrinkage in CMOS technology to make smaller pixels, and thereby have more resolution without increasing the cost. With the market of image sensors exploding courtesy their inte- gration with communication and computation devices, technology developers improved the CMOS processes to have better optical performance. Nevertheless, the promises of focal plane processing as well as on-chip integration have not been fulfilled. The market is still being pushed by the desire of having higher number of pixels and better image quality, however, differentiation is being difficult for any image sensor manufacturer. In the paper, we will explore potential disruptive growth directions for CMOS Image sensors and ways to achieve the same

Advances on CMOS image sensors

This paper offers an introduction to the technological advances of image sensors designed using complementary metal–oxide–semiconductor (CMOS) processes along the last decades. We review some of those technological advances and examine potential disruptive growth directions for CMOS image sensors and proposed ways to achieve them. Those advances include breakthroughs on image quality such as resolution, capture speed, light sensitivity and color detection and advances on the computational imaging. The current trend is to push the innovation efforts even further as the market requires higher resolution, higher speed, lower power consumption and, mainly, lower cost sensors. Although CMOS image sensors are currently used in several different applications from consumer to defense to medical diagnosis, product differentiation is becoming both a requirement and a difficult goal for any image sensor manufacturer. The unique properties of CMOS process allows the integration of several signal processing techniques and are driving the impressive advancement of the computational imaging. With this paper, we offer a very comprehensive review of methods, techniques, designs and fabrication of CMOS image sensors that have impacted or might will impact the images sensor applications and markets

A mixed-signal early vision chip with embedded image and programming memories and digital I/O

From a system level perspective, this paper presents a 128 × 128 flexible and reconfigurable Focal-Plane Analog Programmable Array Processor, which has been designed as a single chip in a 0.35μm standard digital 1P-5M CMOS technology. The core processing array has been designed to achieve high-speed of operation and large-enough accuracy (∼ 7bit) with low power consumption. The chip includes on-chip program memory to allow for the execution of complex, sequential and/or bifurcation flow image processing algorithms. It also includes the structures and circuits needed to guarantee its embedding into conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four million transistors, 90% of them working in analog mode. The chip features up to 330GOPs (Giga Operations per second), and uses the power supply (180GOP/Joule) and the silicon area (3.8 GOPS/mm2) efficiently, as it is able to maintain VGA processing throughputs of 100Frames/s with about 15 basic image processing tasks on each frame

ACE16K: The Third Generation of Mixed-Signal SIMD-CNN ACE Chips Toward VSoCs

Today, with 0.18-μm technologies mature and stable enough for mixed-signal design with a large variety of CMOS compatible optical sensors available and with 0.09-μm technologies knocking at the door of designers, we can face the design of integrated systems, instead of just integrated circuits. In fact, significant progress has been made in the last few years toward the realization of vision systems on chips (VSoCs). Such VSoCs are eventually targeted to integrate within a semiconductor substrate the functions of optical sensing, image processing in space and time, high-level processing, and the control of actuators. The consecutive generations of ACE chips define a roadmap toward flexible VSoCs. These chips consist of arrays of mixed-signal processing elements (PEs) which operate in accordance with single instruction multiple data (SIMD) computing architectures and exhibit the functional features of CNN Universal Machines. They have been conceived to cover the early stages of the visual processing path in a fully-parallel manner, and hence more efficiently than DSP-based systems. Across the different generations, different improvements and modifications have been made looking to converge with the newest discoveries of neurobiologists regarding the behavior of natural retinas. This paper presents considerations pertaining to the design of a member of the third generation of ACE chips, namely to the so-called ACE16k chip. This chip, designed in a 0.35-μm standard CMOS technology, contains about 3.75 million transistors and exhibits peak computing figures of 330 GOPS, 3.6 GOPS/mm2 and 82.5 GOPS/W. Each PE in the array contains a reconfigurable computing kernel capable of calculating linear convolutions on 3×3 neighborhoods in less than 1.5 μs, imagewise Boolean combinations in less than 200 ns, imagewise arithmetic operations in about 5 μs, and CNN-like temporal evolutions with a time constant of about 0.5 μs. Unfortunately, the many ideas underlying the design of this chip cannot be covered in a single paper; hence, this paper is focused on, first, placing the ACE16k in the ACE chip roadmap and, then, discussing the most significant modifications of ACE16K versus its predecessors in the family.LOCUST IST2001—38 097VISTA TIC2003—09 817 - C02—01Office of Naval Research N000 140 210 88

Pixels for focal-plane scale space generation and for high dynamic range imaging

Focal-plane processing allows for parallel processing throughout the entire pixel matrix, which can help increasing the speed of vision systems. The fabrication of circuits inside the pixel matrix increases the pixel pitch and reduces the fill factor, which leads to reduced image quality. To take advantage of the focal-plane processing capabilities and minimize image quality reduction, we first consider the inclusion of only two extra transistors in the pixel, allowing for scale space generation at the focal plane. We assess the conditions in which the proposed circuitry is advantageous. We perform a time and energy analysis of this approach in comparison to a digital solution. Considering that a SAR ADC per column is used and the clock frequency is equal to 5.6 MHz, the proposed analysis show that the focal-plane approach is 26 times faster if the digital solution uses 10 processing elements, and 49 times more energy-efficient. Another way of taking advantage of the focal-plane signal processing capability is by using focal-plane processing for increasing image quality itself, such as in the case of high dynamic range imaging pixels. This work also presents the design and study of a pixel that captures high dynamic range images by sensing the matrix average luminance, and then adjusting the integration time of each pixel according to the global average and to the local value of the pixel. This pixel was implemented considering small structural variations, such as different photodiode sizes for global average luminance measurement. Schematic and post-layout simulations were performed with the implemented pixel using an input image of 76 dB, presenting results with details in both dark and bright image areas.O processamento no plano focal de imageadores permite que a imagem capturada seja processada em paralelo por toda a matrix de pixels, característica que pode aumentar a velocidade de sistemas de visão. Ao fabricar circuitos dentro da matrix de pixels, o tamanho do pixel aumenta e a razão entre área fotossensível e a área total do pixel diminui, reduzindo a qualidade da imagem. Para utilizar as vantagens do processamento no plano focal e minimizar a redução da qualidade da imagem, a primeira parte da tese propõe a inclusão de dois transistores no pixel, o que permite que o espaço de escalas da imagem capturada seja gerado. Nós então avaliamos em quais condições o circuito proposto é vantajoso. Nós analisamos o tempo de processamento e o consumo de energia dessa proposta em comparação com uma solução digital. Utilizando um conversor de aproximações sucessivas com frequência de 5.6 MHz, a análise proposta mostra que a abordagem no plano focal é 26 vezes mais rápida que o circuito digital com 10 elementos de processamento, e consome 49 vezes menos energia. Outra maneira de utilizar processamento no plano focal consiste em aplicá-lo para melhorar a qualidade da imagem, como na captura de imagens em alta faixa dinâmica. Esta tese também apresenta o estudo e projeto de um pixel que realiza a captura de imagens em alta faixa dinâmica através do ajuste do tempo de integração de cada pixel utilizando a iluminação média e o valor do próprio pixel. Esse pixel foi projetado considerando pequenas variações estruturais, como diferentes tamanhos do fotodiodo que realiza a captura do valor de iluminação médio. Simulações de esquemático e pós-layout foram realizadas com o pixel projetado utilizando uma imagem com faixa dinâmica de 76 dB, apresentando resultados com detalhes tanto na parte clara como na parte escura da imagem