NC-G-SIM: A Parameterized Generic Simulator for 2D-Mesh, 3D-Mesh

As chip density keeps doubling during each course of generation, the use of NoC has become an integral part of modern microprocessors and a very prevalent architectural feature of all types of SoCs. To meet the ever expanding communication challenges, diverse and novel NoC solutions are being developed which rely on accurate modeling and simulations to evaluate the impact and analyze their performances. Consequently, this aggravates the need to rely on simulation tools to probe and optimize these NoC architectures. In this work, we present NC-G-SIM (Network on Chip-Generic-SIMulator), a highly flexible, modular, cycle-accurate, configurable simulator for NoCs. To make NC-G-SIM suitable for advanced NoC exploration, it is made highly generic that supports extensive range of cores in any kind of topology whether 2D, 3D or irregular. Simulation results have been evaluated in terms of latencies, throughput and the amount of energy consumed during the simulation period at different levels

A performance model of communication in the quarc NoC

Networks on-chip (NoC) emerged as a promising communication medium for future MPSoC development. To serve this purpose, the NoCs have to be able to efficiently exchange all types of traffic including the collective communications at a reasonable cost. The Quarc NoC is introduced as a NOC which is highly efficient in performing collective communication operations such as broadcast and multicast. This paper presents an introduction to the Quarc scheme and an analytical model to compute the average message latency in the architecture. To validate the model we compare the model latency prediction against the results obtained from discrete-event simulations

Design of TSV-sharing topologies for cost-effective 3D networks-on-chip

The Through-Silicon Via (TSV) technology has led to major breakthroughs in 3D stacking by providing higher speed and bandwidth, as well as lower power dissipation for the inter-layer communication. However, the current TSV fabrication suffers from a considerable area footprint and yield loss. Thus, it is necessary to restrict the number of TSVs in order to design cost-effective 3D on-chip networks. This critical issue can be addressed by clustering the network such that all of the routers within each cluster share a single TSV pillar for the vertical packet transmission. In some of the existing topologies, additional cluster routers are augmented into the mesh structure to handle the shared TSVs. However, they impose either performance degradation or power/area overhead to the system. Furthermore, the resulting architecture is no longer a mesh. In this paper, we redefine the clusters by replacing some routers in the mesh with the cluster routers, such that the mesh structure is preserved. The simulation results demonstrate a better equilibrium between performance and cost, using the proposed models

Quarc: a novel network-on-chip architecture

This paper introduces the Quarc NoC, a novel NoC architecture inspired by the Spidergon NoC. The Quarc scheme significantly outperforms the Spidergon NoC through balancing the traffic which is the result of the modifications applied to the topology and the routing elements.The proposed architecture is highly efficient in performing collective communication operations including broadcast and multicast. We present the topology, routing discipline and switch architecture for the Quarc NoC and demonstrate the performance with the results obtained from discrete event simulations