318 research outputs found

    Cantilever beam microactuators with electrothermal and electrostatic drive

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    Microfabrication provides a powerful tool for batch processing and miniaturization of mechanical systems into dimensional domain not accessible easily by conventional machining. CMOS IC process compatible design is definitely a big plus because of tremendous know-how in IC technologies, commercially available standard IC processes for a reasonable price, and future integration of microma-chined mechanical systems and integrated circuits. Magnetically, electrostatically and thermally driven microactuators have been reported previously. These actuators have applications in many fields from optics to robotics and biomedical engineering. At NJIT cleanroom, mono or multimorph microactuators have been fabricated using CMOS compatible process. In design and fabrication of these microactuators, internal stress due to thermal expansion coefficient mismatch and residual stress have been considered, and the microactuators are driven with electro-thermal power combined with electrostatical excitation. They can provide large force, and in- or out-of-plane actuation. In this work, an analytical model is proposed to describe the thermal actuation of in-plane (inchworm) actuators. Stress gradient throughout the thickness of monomorph layers is modeled as linearly temperature dependent Δσ. The nonlinear behaviour of out-of-plane actuators under electrothermal and electrostatic excitations is investigated. The analytical results are compared with the numerical results based on Finite Element Analysis. ANSYS, a general purpose FEM package, and IntelliCAD, a FEA CAD tool specifically designed for MEMS have been used extensively. The experimental results accompany each analytical and numerical work. Micromechanical world is three dimensional and 2D world of IC processes sets a limit to it. A new micromachining technology, reshaping, has been introduced to realize 3D structures and actuators. This new 3D fabrication technology makes use of the advantages of IC fabrication technologies and combines them with the third dimension of the mechanical world. Polycrystalline silicon microactuators have been reshaped by Joule heating. The first systematic investigation of reshaping has been presented. A micromirror utilizing two reshaped actuators have been designed, fabricated and characterized

    Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices Using Raman Spectroscopy

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    Due to the small scale of MEMS devices, the inherent residual stresses during the deposition processes can affect the functionality and reliability of the fabricated devices. Residual stress often causes device failure due to curling, buckling, or fracture. Currently, few techniques are available to measure the residual stress in MEMS devices. In this dissertation, Raman spectroscopy is used to measure and monitor the residual and induced stresses in MUMPs polysilicon MEMS devices. Raman spectroscopy was selected since it is nondestructive, fast, and provides potential in situ stress monitoring. Raman spectroscopy scans on unreleased and released MEMS fixed-fixed beams, cantilevers, and micromirror flexures were performed to obtain residual stress profiles. The profiles are compared to analytical models to assess the accuracy of Raman spectroscopy. I performed post-processing thermal anneals, phosphorous diffusions and phosphorous ion implantations to characterize the residual stress changes within MEMS devices. From post-processing experiments, the Raman residual stress profiles on MUMPs structures indicate a stress reduction by over 90%, which is verified with on-chip test structures. The reduced residual stress levels can improve the performance, reliability, and yield of the MEMS devices as they become smaller. In addition, I present the first Raman stress measurements in III-V MEMS

    A microgripper for single cell manipulation

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    This thesis presents the development of an electrothermally actuated microgripper for the manipulation of cells and other biological particles. The microgripper has been fabricated using a combination of surface and bulk micromachining techniques in a three mask process. All of the fabrication details have been chosen to enable a tri-layer, polymer (SU8) - metal (Au) - polymer (SU8), membrane to be released from the substrate stress free and without the need for sacrificial layers. An actuator design, which completely eliminates the parasitic resistance of the cold arm, is presented. When compared to standard U-shaped actuators, it improves the thermal efficiency threefold. This enables larger displacements at lower voltages and temperatures. The microgripper is demonstrated in three different configurations: normally open mode, normally closed mode, and normally open/closed mode. It has-been modelled using two coupled analytical models - electrothermal and thermomechanical - which have been custom developed for this application. Unlike previously reported models, the electrothermal model presented here includes the heat exchange between hot and cold arms of the actuators that are separated by a small air gap. A detailed electrothermomechanical characterisation of selected devices has permitted the validation of the models (also performed using finite element analysis) and the assessment of device performance. The device testing includes electrical, deflection, and temperature measurements using infrared (IR) thermography, its use in polymeric actuators reported here for the first time. Successful manipulation experiments have been conducted in both air and liquid environments. Manipulation of live cells (mice oocytes) in a standard biomanipulation station has validated the microgripper as a complementary and unique tool for the single cell experiments that are to be conducted by future generations of biologists in the areas of human reproduction and stem cell research

    Intracortical Neural Probes with Post-Implant Self-Deployed Electrodes for Improved Chronic Stability.

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    This thesis presents a new class of implantable intracortical neural probe with small recording electrodes that deploy away from a larger main shank after insertion. This concept is hypothesized to enhance the performance of the electrodes in chronic applications. Today, electrodes that can be implanted into the brain for months or years, are an irreplaceable tool for brain machine interfaces and neuroscience studies. However, these chronically implanted neural probes suffer from continuous loss of signal quality, limiting their utility. Histological studies found a sheath of scar tissue with decreased neural density forming around probe shanks as part of an ongoing chronic inflammation. This was hypothesized to contribute to the deterioration of recorded signals. The neural probes developed in this thesis are designed to deploy electrodes outside this sheath such that they interface with healthier neurons. To achieve this, an actuation mechanism based on starch-hydrogel coated microsprings was integrated into the shank of neural probes. Recording electrodes were positioned at the tip of micrometer fine and flexible needles that were attached to the springs. Before insertion, the hydrogel dehydrates, retracting the springs. After insertion, the gel rehydrates, releasing the springs, which then deploy the electrodes. The actuation mechanism functions in a one-time release fashion, triggered by contact with biological fluids at body temperature. The deployment of the electrodes occurred over the course of two hours and can be divided into three stages: For the first 20 s, the electrodes did not deploy. Within the first three minutes they deployed by roughly 100 µm (0.5 µm/s). Tor the following two hours they deployed an additional 20 µm (0.17 µm/min). The employed design supported six deploying electrodes, each at the end of a 5 µm wide and thick, and 100 µm long needle. These were attached to a shank with 290 µm width, 12 µm thickness and 3 mm length. The shanks could be inserted into the cortex of rats through an opening in the pia without breaking. The acquired waveforms indicate that some of the deployed electrodes were able to record neural action potentials.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/113317/1/egertd_1.pd

    A Thermally actuated microelectromechanical (MEMS) device for measuring viscosity

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    A thermally actuated non-cantilever-beam micro-electro-mechanical viscosity sensor is presented. The proposed device is based on thermally induced vibrations of a silicon-based membrane and its damping due to the surrounding fluid. This vibration viscometer device utilizes thermal actuation through an in-situ resistive heater and piezoresistive sensing, both of which utilize CMOS compatible materials leading to an inexpensive and reliable system. Due to the nature of the actuation, thermal analysis was performed utilizing PN diodes embedded in the silicon membrane to monitor its temperature. This analysis determined the minimum heater voltage pulse amplitude and time in order to prevent heat loss to the oil under test that would lead to local viscosity changes. In order to study the natural vibration behavior of the complex multilayer membrane that is needed for the proposed sensor, a designed experiment was carried out. In this experiment, the effects of the material composition of the membrane and the size of the actuation heater were studied in detail with respect to their effects on the natural frequency of vibration. To confirm the validity of these measurements, Finite Element Analysis and white-light interferometry were utilized. Further characterization of the natural frequency of vibration of the membranes was carried out at elevated temperatures to explore the effects of temperature. Complex interactions take place among the different layers that compose the membrane structures. Finally, viscosity measurements were performed and compared to standard calibrated oils as well as to motor oils measured on a commercial cone-and-plate viscometer. The experimentally obtained data is compared to theoretical predictions and an empirically-derived model to predict viscosity from vibration measurements is proposed. Frequency correlation to viscosity was shown to be the best indicator for the range of viscosities tested with lower error (+/- 5%), than that of quality factor (+/- 20%). Further viscosity measurements were taken at elevated temperatures and over long periods of time to explore the device reliability and drift. Finally, further size reduction of the device was explored

    A survey of Mechanical failure and design for Reliability of MEMS

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    In this paper, several experimental mechanical investigation techniques are presented to evaluate the reliability of micro-electro-mechanical systems (MEMS). Microsystems in recent years have spread in many everyday devices. We find micro-scale sensors and actuators in automotive, biomedical and aerospace applications where are demanded very strict performance requirements. Electromechanical non-linear coupling is often a crucial problem both in design and also for the reliability of the system. Mechanism of failure and failure modes has to be taken into account in order to evaluate the reliability of the final system. Focusing on device failure, it emerges that mechanical damage is the most significant source. In this paper a survey of recent advance in mechanical testing of MEMS is presented including: Mechanical fatigue, mechanical strength and plasticity, surface and contact failure and creep. Different design of testing specimens is discussed to identify the material properties and failure modes behavior in order to obtain design rules and strategies

    Novel Applications of a Thermally Tunable Bistable Buckling Silicon-on-Insulator (SOI) Microfabricated Membrane

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    Buckled membranes are commonly used microelectromechanical systems (MEMS) structures. Recent work has demonstrated that the deflection and stiffness of these membranes can be tuned through localized joule heating. These devices were implemented into the design and fabrication of two novel device applications, a tunable pressure sensor and a steerable micromirror. A differential pressure across the membrane causes de reflection, up or down, which can be measured and related to a specific pressure. By tuning the stiffness of the membrane, its pressure response is varied providing a wider range of application for the pressure sensor. A 2.0mm by 2.0mm square membrane demonstrated a 60 percent decrease in pressure sensitivity from 1.433m/psi to 0.55m/psi. A steerable micromirror was realized by selectively heating a single quadrant of a buckled membrane, localized heating results in membrane de deflection constrained to that quadrant

    Stress Analysis of Silicon Carbide Microeletromechanical Systems Using Raman Spectroscopy

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    During the fabrication of Micro-Electro-Mechanical Systems (MEMS), residual stress is often induced in the thin films that are deposited to create these systems. These stresses can cause the device to fail due to buckling, curling, or fracture. Government and industry are looking for ways to characterize the stress during the deposition of thin films in order to reduce or eliminate device failure. Micro-Raman spectroscopy has been successfully used to analyze poly-silicon MEMS devices made with the Multi-User MEMS Process (MUMPS trade name). Micro-Raman spectroscopy was selected because it is nondestructive, fast and has the potential for in situ stress monitoring. This research attempts to validate the use of Raman spectroscopy to analyze the stress in MEMS made of silicon carbide (SiC) using the Multi-User Silicon Carbide surface micromachining (MUSiCsm) process. Surface interferometry of fixed-fixed beam arrays and comb drive resonance test are employed to determine stress and compare it to the Raman values. Research also includes baseline spectra of 6H, 4H, and 15R poly-types of bulk SiC. Raman spectra of 1- to 2-micrometers thick 3C-SiC thin films deposited on silicon, silicon nitride, and silicon oxide substrates are presented as an attempt to establish a baseline spectra for 3C-SiC, the poly-type of SiC found in MEMS made with the MUSiCsm process

    Comb-drive actuators for large displacements

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    The design, fabrication and experimental results of lateral-comb-drive actuators for large displacements at low driving voltages is presented. A comparison of several suspension designs is given, and the lateral large deflection behaviour of clamped - clamped beams and a folded flexure design is modelled. An expression for the axial spring constant of folded flexure designs including bending effects from lateral displacements, which reduce the axial stiffness, is also derived. The maximum deflection that can be obtained by comb-drive actuators is bounded by electromechanical side instability. Expressions for the side-instability voltage and the resulting displacement at side instability are given. The electromechanical behaviour around the resonance frequency is described by an equivalent electric circuit. Devices are fabricated by polysilicon surface micromachining techniques using a one-mask fabrication process. Static and dynamic properties are determined experimentally and are compared with theory. Static properties are determined by displacement-to-voltage, capacitance-to-voltage and pull-in voltage measurements. Using a one-port approach, dynamic properties are extracted from measured admittance plots. Typical actuator characteristics are deflections of about at driving voltages around 20 V, a resonance frequency around 1.6 kHz and a quality factor of approximately 3

    Micro-electro-thermo-magnetic Actuators for MEMS Applications

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    This research focuses on developing new techniques and designs for highly con- trollable microactuating systems with large force-stroke outputs. A fixed-fixed mi- crobeam is the actuating element in the introduced techniques. Either buckling of a microbridge by thermal stress, lateral deflection of a microbridge by electro- magnetic force, or combined effects of both can be employed for microactuation. The proposed method here is MicroElectroThermoMagnetic Actuation (METMA), which uses the combined techniques of electrical or electro-thermal driving of a mi- crobridge in the presence of a magnetic field. The electrically controllable magnetic field actuates and controls the electrically or electrothermally driven microstruc- tures. METMA provides control with two electrical inputs, the currents driving the microbridge and the current driving the external magnetic field. This method enables a more controllable actuating system. Different designs of microactuators have been implemented by using MEMS Pro as the design software and MUMPs as the standard MEMS fabrication technology. In these designs, a variety of out-of- plane buckling or displacement of fixed-fixed microbeams have been developed and employed as the actuating elements. This paper also introduces a novel actuating technique for larger displacements that uses a two-layer buckling microbridge actu- ated by METMA. Heat transfer principles are applied to investigate temperature distribution in a microbeam, electrothermal heating, and the resulting thermoelas- tic effects. Furthermore, a method for driving microactuators by applying powerful electrical pulses is proposed. The integrated electromagnetic and electrothermal microactuation technique is also studied. A clamped-clamped microbeam carry- ing electrical current has been modeled and simulated in ANSYS. The simulations include electrothermal, thermoelastic, electromagnetic, and electrothermomagnetic effects. The contributions are highlighted, the results are discussed, the research and design limitations are reported, and future works are proposed
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