Dynamic Partial Reconfiguration for Dependable Systems

Moore’s law has served as goal and motivation for consumer electronics manufacturers in the last decades. The results in terms of processing power increase in the consumer electronics devices have been mainly achieved due to cost reduction and technology shrinking. However, reducing physical geometries mainly affects the electronic devices’ dependability, making them more sensitive to soft-errors like Single Event Transient (SET) of Single Event Upset (SEU) and hard (permanent) faults, e.g. due to aging effects. Accordingly, safety critical systems often rely on the adoption of old technology nodes, even if they introduce longer design time w.r.t. consumer electronics. In fact, functional safety requirements are increasingly pushing industry in developing innovative methodologies to design high-dependable systems with the required diagnostic coverage. On the other hand commercial off-the-shelf (COTS) devices adoption began to be considered for safety-related systems due to real-time requirements, the need for the implementation of computationally hungry algorithms and lower design costs. In this field FPGA market share is constantly increased, thanks to their flexibility and low non-recurrent engineering costs, making them suitable for a set of safety critical applications with low production volumes. The works presented in this thesis tries to face new dependability issues in modern reconfigurable systems, exploiting their special features to take proper counteractions with low impacton performances, namely Dynamic Partial Reconfiguration

Virtual Runtime Application Partitions for Resource Management in Massively Parallel Architectures

This thesis presents a novel design paradigm, called Virtual Runtime Application Partitions (VRAP), to judiciously utilize the on-chip resources. As the dark silicon era approaches, where the power considerations will allow only a fraction chip to be powered on, judicious resource management will become a key consideration in future designs. Most of the works on resource management treat only the physical components (i.e. computation, communication, and memory blocks) as resources and manipulate the component to application mapping to optimize various parameters (e.g. energy efficiency). To further enhance the optimization potential, in addition to the physical resources we propose to manipulate abstract resources (i.e. voltage/frequency operating point, the fault-tolerance strength, the degree of parallelism, and the configuration architecture). The proposed framework (i.e. VRAP) encapsulates methods, algorithms, and hardware blocks to provide each application with the abstract resources tailored to its needs. To test the efficacy of this concept, we have developed three distinct self adaptive environments: (i) Private Operating Environment (POE), (ii) Private Reliability Environment (PRE), and (iii) Private Configuration Environment (PCE) that collectively ensure that each application meets its deadlines using minimal platform resources. In this work several novel architectural enhancements, algorithms and policies are presented to realize the virtual runtime application partitions efficiently. Considering the future design trends, we have chosen Coarse Grained Reconfigurable Architectures (CGRAs) and Network on Chips (NoCs) to test the feasibility of our approach. Specifically, we have chosen Dynamically Reconfigurable Resource Array (DRRA) and McNoC as the representative CGRA and NoC platforms. The proposed techniques are compared and evaluated using a variety of quantitative experiments. Synthesis and simulation results demonstrate VRAP significantly enhances the energy and power efficiency compared to state of the art.Siirretty Doriast

3D-SoftChip: A novel 3D vertically integrated adaptive computing system [thesis]

At present, as we enter the nano and giga-scaled integrated-circuit era, there are many system design challenges which must be overcome to resolve problems in current systems. The incredibly increased nonrecurring engineering (NRE) cost, abruptly shortened Time-to- Market (ITA) period and ever widening design productive gaps are good examples illustrating the problems in current systems. To cope with these problems, the concept of an Adaptive Computing System is becoming a critical technology for next generation computing systems. The other big problem is an explosion in the interconnection wire requirements in standard planar technology resulting from the very high data-bandwidth requirements demanded for real-time communications and multimedia signal processing. The concept of 3D-vertical integration of 2D planar chips becomes an attractive solution to combat the ever increasing interconnect wire requirements. As a result, this research proposes the concept of a novel 3D integrated adaptive computing system, which we term 3D-ACSoC. The architecture and advanced system design methodology of the proposed 3D-SoftChip as a forthcoming giga-scaled integrated circuit computing system has been introduced, along with high-level system modeling and functional verification in the early design stage using SystemC

A survey of system level power management schemes in the dark-silicon era for many-core architectures

Power consumption in Complementary Metal Oxide Semiconductor (CMOS) technology has escalated to a point that only a fractional part of many-core chips can be powered-on at a time. Fortunately, this fraction can be increased at the expense of performance through the dark-silicon solution. However, with many-core integration set to be heading towards its thousands, power consumption and temperature increases per time, meaning the number of active nodes must be reduced drastically. Therefore, optimized techniques are demanded for continuous advancement in technology. Existing efforts try to overcome this challenge by activating nodes from different parts of the chip at the expense of communication latency. Other efforts on the other hand employ run-time power management techniques to manage the power performance of the cores trading-off performance for power. We found out that, for a significant amount of power to saved and high temperature to be avoided, focus should be on reducing the power consumption of all the on-chip components. Especially, the memory hierarchy and the interconnect. Power consumption can be minimized by, reducing the size of high leakage power dissipating elements, turning-off idle resources and integrating power saving materials

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

FPGA structures for high speed and low overhead dynamic circuit specialization

A Field Programmable Gate Array (FPGA) is a programmable digital electronic chip. The FPGA does not come with a predefined function from the manufacturer; instead, the developer has to define its function through implementing a digital circuit on the FPGA resources. The functionality of the FPGA can be reprogrammed as desired and hence the name “field programmable”. FPGAs are useful in small volume digital electronic products as the design of a digital custom chip is expensive. Changing the FPGA (also called configuring it) is done by changing the configuration data (in the form of bitstreams) that defines the FPGA functionality. These bitstreams are stored in a memory of the FPGA called configuration memory. The SRAM cells of LookUp Tables (LUTs), Block Random Access Memories (BRAMs) and DSP blocks together form the configuration memory of an FPGA. The configuration data can be modified according to the user’s needs to implement the user-defined hardware. The simplest way to program the configuration memory is to download the bitstreams using a JTAG interface. However, modern techniques such as Partial Reconfiguration (PR) enable us to configure a part in the configuration memory with partial bitstreams during run-time. The reconfiguration is achieved by swapping in partial bitstreams into the configuration memory via a configuration interface called Internal Configuration Access Port (ICAP). The ICAP is a hardware primitive (macro) present in the FPGA used to access the configuration memory internally by an embedded processor. The reconfiguration technique adds flexibility to use specialized ci rcuits that are more compact and more efficient t han t heir b ulky c ounterparts. An example of such an implementation is the use of specialized multipliers instead of big generic multipliers in an FIR implementation with constant coefficients. To specialize these circuits and reconfigure during the run-time, researchers at the HES group proposed the novel technique called parameterized reconfiguration that can be used to efficiently and automatically implement Dynamic Circuit Specialization (DCS) that is built on top of the Partial Reconfiguration method. It uses the run-time reconfiguration technique that is tailored to implement a parameterized design. An application is said to be parameterized if some of its input values change much less frequently than the rest. These inputs are called parameters. Instead of implementing these parameters as regular inputs, in DCS these inputs are implemented as constants, and the application is optimized for the constants. For every change in parameter values, the design is re-optimized (specialized) during run-time and implemented by reconfiguring the optimized design for a new set of parameters. In DCS, the bitstreams of the parameterized design are expressed as Boolean functions of the parameters. For every infrequent change in parameters, a specialized FPGA configuration is generated by evaluating the corresponding Boolean functions, and the FPGA is reconfigured with the specialized configuration. A detailed study of overheads of DCS and providing suitable solutions with appropriate custom FPGA structures is the primary goal of the dissertation. I also suggest different improvements to the FPGA configuration memory architecture. After offering the custom FPGA structures, I investigated the role of DCS on FPGA overlays and the use of custom FPGA structures that help to reduce the overheads of DCS on FPGA overlays. By doing so, I hope I can convince the developer to use DCS (which now comes with minimal costs) in real-world applications. I start the investigations of overheads of DCS by implementing an adaptive FIR filter (using the DCS technique) on three different Xilinx FPGA platforms: Virtex-II Pro, Virtex-5, and Zynq-SoC. The study of how DCS behaves and what is its overhead in the evolution of the three FPGA platforms is the non-trivial basis to discover the costs of DCS. After that, I propose custom FPGA structures (reconfiguration controllers and reconfiguration drivers) to reduce the main overhead (reconfiguration time) of DCS. These structures not only reduce the reconfiguration time but also help curbing the power hungry part of the DCS system. After these chapters, I study the role of DCS on FPGA overlays. I investigate the effect of the proposed FPGA structures on Virtual-Coarse-Grained Reconfigurable Arrays (VCGRAs). I classify the VCGRA implementations into three types: the conventional VCGRA, partially parameterized VCGRA and fully parameterized VCGRA depending upon the level of parameterization. I have designed two variants of VCGRA grids for HPC image processing applications, namely, the MAC grid and Pixie. Finally, I try to tackle the reconfiguration time overhead at the hardware level of the FPGA by customizing the FPGA configuration memory architecture. In this part of my research, I propose to use a parallel memory structure to improve the reconfiguration time of DCS drastically. However, this improvement comes with a significant overhead of hardware resources which will need to be solved in future research on commercial FPGA configuration memory architectures

Optimization-based power and thermal management for dark silicon aware 3D chip multiprocessors using heterogeneous cache hierarchy

Management of a problem recently known as “dark silicon” is a new challenge in multicore designs. Prior innovative studies have addressed the dark silicon problem in the fields of power-efficient core design. However, addressing dark silicon challenges in uncore component designs such as cache hierarchy, on-chip interconnect etc. that consume significant portion of the on-chip power consumption is largely unexplored. In this paper, for the first time, we propose an integrated approach which considers the impact of power consumption of core and uncore components simultaneously to improve multi/many-core performance in the dark silicon era. The proposed approach dynamically (1) predicts the changing program behavior on each core; (2) re-determines frequency/voltage, cache capacity and technology in each level of the cache hierarchy based on the program's scalability in order to satisfy the power and temperature constraints. In the proposed architecture, for future chip-multiprocessors (CMPs), we exploit emerging technologies such as non-volatile memories (NVMs) and 3D techniques to combat dark silicon. Also, for the first time, we propose a detailed power model which is useful for future dark silicon CMPs power modeling. Experimental results on SPEC 2000/2006 benchmarks show that the proposed method improves throughput by about 54.3% and energy-delay product by about 61% on average, respectively, in comparison with the conventional CMP architecture with homogenous cache system. (A preliminary short version of this work was presented in the 18th Euromicro Conference on Digital System Design (DSD), 2015.) © 2017 Elsevier B.V