Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Fail-in-Place Network Design: Interaction Between Topology, Routing Algorithm and Failures

Abstract—The growing system size of high performance com-puters results in a steady decrease of the mean time between failures. Exchanging network components often requires whole system downtime which increases the cost of failures. In this work, we study a fail-in-place strategy where broken network elements remain untouched. We show, that a fail-in-place strategy is feasible for todays networks and the degradation is manageable, and provide guidelines for the design. Our network failure simulation toolchain allows system designers to extrapolate the performance degradation based on expected failure rates, and it can be used to evaluate the current state of a system. In a case study of real-world HPC systems, we will analyze the performance degradation throughout the systems lifetime under the assumption that faulty network components are not repaired, which results in a recommendation to change the used routing algorithm to improve the network performance as well as the fail-in-place characteristic. Keywords—Network design, network simulations, network man-agement, fail-in-place, routing protocols, fault tolerance, availability I

Automating Topology Aware Mapping for Supercomputers

Petascale machines with hundreds of thousands of cores are being built. These machines have varying interconnect topologies and large network diameters. Computation is cheap and communication on the network is becoming the bottleneck for scaling of parallel applications. Network contention, specifically, is becoming an increasingly important factor affecting overall performance. The broad goal of this dissertation is performance optimization of parallel applications through reduction of network contention. Most parallel applications have a certain communication topology. Mapping of tasks in a parallel application based on their communication graph, to the physical processors on a machine can potentially lead to performance improvements. Mapping of the communication graph for an application on to the interconnect topology of a machine while trying to localize communication is the research problem under consideration. The farther different messages travel on the network, greater is the chance of resource sharing between messages. This can create contention on the network for networks commonly used today. Evaluative studies in this dissertation show that on IBM Blue Gene and Cray XT machines, message latencies can be severely affected under contention. Realizing this fact, application developers have started paying attention to the mapping of tasks to physical processors to minimize contention. Placement of communicating tasks on nearby physical processors can minimize the distance traveled by messages and reduce the chances of contention. Performance improvements through topology aware placement for applications such as NAMD and OpenAtom are used to motivate this work. Building on these ideas, the dissertation proposes algorithms and techniques for automatic mapping of parallel applications to relieve the application developers of this burden. The effect of contention on message latencies is studied in depth to guide the design of mapping algorithms. The hop-bytes metric is proposed for the evaluation of mapping algorithms as a better metric than the previously used maximum dilation metric. The main focus of this dissertation is on developing topology aware mapping algorithms for parallel applications with regular and irregular communication patterns. The automatic mapping framework is a suite of such algorithms with capabilities to choose the best mapping for a problem with a given communication graph. The dissertation also briefly discusses completely distributed mapping techniques which will be imperative for machines of the future.published or submitted for publicationnot peer reviewe

Software-based and regionally-oriented traffic management in Networks-on-Chip

Since the introduction of chip-multiprocessor systems, the number of integrated cores has been steady growing and workload applications have been adapted to exploit the increasing parallelism. This changed the importance of efficient on-chip communication significantly and the infrastructure has to keep step with these new requirements. The work at hand makes significant contributions to the state-of-the-art of the latest generation of such solutions, called Networks-on-Chip, to improve the performance, reliability, and flexible management of these on-chip infrastructures