Innovation in manufacturing through digital technologies and applications: Thoughts and Reflections on Industry 4.0

The rapid pace of developments in digital technologies offers many opportunities to increase the efficiency, flexibility and sophistication of manufacturing processes; including the potential for easier customisation, lower volumes and rapid changeover of products within the same manufacturing cell or line. A number of initiatives on this theme have been proposed around the world to support national industries under names such as Industry 4.0 (Industrie 4.0 in Germany, Made-in-China in China and Made Smarter in the UK). This book presents an overview of the state of art and upcoming developments in digital technologies pertaining to manufacturing. The starting point is an introduction on Industry 4.0 and its potential for enhancing the manufacturing process. Later on moving to the design of smart (that is digitally driven) business processes which are going to rely on sensing of all relevant parameters, gathering, storing and processing the data from these sensors, using computing power and intelligence at the most appropriate points in the digital workflow including application of edge computing and parallel processing. A key component of this workflow is the application of Artificial Intelligence and particularly techniques in Machine Learning to derive actionable information from this data; be it real-time automated responses such as actuating transducers or informing human operators to follow specified standard operating procedures or providing management data for operational and strategic planning. Further consideration also needs to be given to the properties and behaviours of particular machines that are controlled and materials that are transformed during the manufacturing process and this is sometimes referred to as Operational Technology (OT) as opposed to IT. The digital capture of these properties and behaviours can then be used to define so-called Cyber Physical Systems. Given the power of these digital technologies it is of paramount importance that they operate safely and are not vulnerable to malicious interference. Industry 4.0 brings unprecedented cybersecurity challenges to manufacturing and the overall industrial sector and the case is made here that new codes of practice are needed for the combined Information Technology and Operational Technology worlds, but with a framework that should be native to Industry 4.0. Current computing technologies are also able to go in other directions than supporting the digital ‘sense to action’ process described above. One of these is to use digital technologies to enhance the ability of the human operators who are still essential within the manufacturing process. One such technology, that has recently become accessible for widespread adoption, is Augmented Reality, providing operators with real-time additional information in situ with the machines that they interact with in their workspace in a hands-free mode. Finally, two linked chapters discuss the specific application of digital technologies to High Pressure Die Casting (HDPC) of Magnesium components. Optimizing the HPDC process is a key task for increasing productivity and reducing defective parts and the first chapter provides an overview of the HPDC process with attention to the most common defects and their sources. It does this by first looking at real-time process control mechanisms, understanding the various process variables and assessing their impact on the end product quality. This understanding drives the choice of sensing methods and the associated smart digital workflow to allow real-time control and mitigation of variation in the identified variables. Also, data from this workflow can be captured and used for the design of optimised dies and associated processes

ToSHI - Towards Secure Heterogeneous Integration: Security Risks, Threat Assessment, and Assurance

The semiconductor industry is entering a new age in which device scaling and cost reduction will no longer follow the decades-long pattern. Packing more transistors on a monolithic IC at each node becomes more difficult and expensive. Companies in the semiconductor industry are increasingly seeking technological solutions to close the gap and enhance cost-performance while providing more functionality through integration. Putting all of the operations on a single chip (known as a system on a chip, or SoC) presents several issues, including increased prices and greater design complexity. Heterogeneous integration (HI), which uses advanced packaging technology to merge components that might be designed and manufactured independently using the best process technology, is an attractive alternative. However, although the industry is motivated to move towards HI, many design and security challenges must be addressed. This paper presents a three-tier security approach for secure heterogeneous integration by investigating supply chain security risks, threats, and vulnerabilities at the chiplet, interposer, and system-in-package levels. Furthermore, various possible trust validation methods and attack mitigation were proposed for every level of heterogeneous integration. Finally, we shared our vision as a roadmap toward developing security solutions for a secure heterogeneous integration

Automotive Intelligence Embedded in Electric Connected Autonomous and Shared Vehicles Technology for Sustainable Green Mobility

The automotive sector digitalization accelerates the technology convergence of perception, computing processing, connectivity, propulsion, and data fusion for electric connected autonomous and shared (ECAS) vehicles. This brings cutting-edge computing paradigms with embedded cognitive capabilities into vehicle domains and data infrastructure to provide holistic intrinsic and extrinsic intelligence for new mobility applications. Digital technologies are a significant enabler in achieving the sustainability goals of the green transformation of the mobility and transportation sectors. Innovation occurs predominantly in ECAS vehicles’ architecture, operations, intelligent functions, and automotive digital infrastructure. The traditional ownership model is moving toward multimodal and shared mobility services. The ECAS vehicle’s technology allows for the development of virtual automotive functions that run on shared hardware platforms with data unlocking value, and for introducing new, shared computing-based automotive features. Facilitating vehicle automation, vehicle electrification, vehicle-to-everything (V2X) communication is accomplished by the convergence of artificial intelligence (AI), cellular/wireless connectivity, edge computing, the Internet of things (IoT), the Internet of intelligent things (IoIT), digital twins (DTs), virtual/augmented reality (VR/AR) and distributed ledger technologies (DLTs). Vehicles become more intelligent, connected, functioning as edge micro servers on wheels, powered by sensors/actuators, hardware (HW), software (SW) and smart virtual functions that are integrated into the digital infrastructure. Electrification, automation, connectivity, digitalization, decarbonization, decentralization, and standardization are the main drivers that unlock intelligent vehicles' potential for sustainable green mobility applications. ECAS vehicles act as autonomous agents using swarm intelligence to communicate and exchange information, either directly or indirectly, with each other and the infrastructure, accessing independent services such as energy, high-definition maps, routes, infrastructure information, traffic lights, tolls, parking (micropayments), and finding emergent/intelligent solutions. The article gives an overview of the advances in AI technologies and applications to realize intelligent functions and optimize vehicle performance, control, and decision-making for future ECAS vehicles to support the acceleration of deployment in various mobility scenarios. ECAS vehicles, systems, sub-systems, and components are subjected to stringent regulatory frameworks, which set rigorous requirements for autonomous vehicles. An in-depth assessment of existing standards, regulations, and laws, including a thorough gap analysis, is required. Global guidelines must be provided on how to fulfill the requirements. ECAS vehicle technology trustworthiness, including AI-based HW/SW and algorithms, is necessary for developing ECAS systems across the entire automotive ecosystem. The safety and transparency of AI-based technology and the explainability of the purpose, use, benefits, and limitations of AI systems are critical for fulfilling trustworthiness requirements. The article presents ECAS vehicles’ evolution toward domain controller, zonal vehicle, and federated vehicle/edge/cloud-centric based on distributed intelligence in the vehicle and infrastructure level architectures and the role of AI techniques and methods to implement the different autonomous driving and optimization functions for sustainable green mobility.publishedVersio

Secured information dissemination and misbehavior detection in VANETs

In a connected vehicle environment, the vehicles in a region can form a distributed network (Vehicular Ad-hoc Network or VANETs) where they can share traffic-related information such as congestion or no-congestion with other vehicles within its proximity, or with a centralized entity via. the roadside units (RSUs). However, false or fabricated information injected by an attacker (or a malicious vehicle) within the network can disrupt the decision-making process of surrounding vehicles or any traffic-monitoring system. Since in VANETs the size of the distributed network constituting the vehicles can be small, it is not difficult for an attacker to propagate an attack across multiple vehicles within the network. Under such circumstances, it is difficult for any traffic monitoring organization to recognize the traffic scenario of the region of interest (ROI). Furthermore, even if we are able to establish a secured connected vehicle environment, an attacker can leverage the connectivity of individual vehicles to the outside world to detect vulnerabilities, and disrupt the normal functioning of the in-vehicle networks of individual vehicles formed by the different sensors and actuators through remote injection attacks (such as Denial of Service (DoS)). Along this direction, the core contribution of our research is directed towards secured data dissemination, detection of malicious vehicles as well as false and fabricated information within the network. as well as securing the in-vehicle networks through improvisation of the existing arbitration mechanism which otherwise leads to Denial of Service (DoS) attacks (preventing legitimate components from exchanging messages in a timely manner). --Abstract, page iv

Applying Hypervisor-Based Fault Tolerance Techniques to Safety-Critical Embedded Systems

This document details the work conducted through the development of this thesis, and it is structured as follows: • Chapter 1, Introduction, has briefly presented the motivation, objectives, and contributions of this thesis. • Chapter 2, Fundamentals, exposes a series of concepts that are necessary to correctly understand the information presented in the rest of the thesis, such as the concepts of virtualization, hypervisors, or software-based fault tolerance. In addition, this chapter includes an exhaustive review and comparison between the different hypervisors used in scientific studies dealing with safety-critical systems, and a brief review of some works that try to improve fault tolerance in the hypervisor itself, an area of research that is outside the scope of this work, but that complements the mechanism presented and could be established as a line of future work. • Chapter 3, Problem Statement and Related Work, explains the main reasons why the concept of Hypervisor-Based Fault Tolerance was born and reviews the main articles and research papers on the subject. This review includes both papers related to safety-critical embedded systems (such as the research carried out in this thesis) and papers related to cloud servers and cluster computing that, although not directly applicable to embedded systems, may raise useful concepts that make our solution more complete or allow us to establish future lines of work. • Chapter 4, Proposed Solution, begins with a brief comparison of the work presented in Chapter 3 to establish the requirements that our solution must meet in order to be as complete and innovative as possible. It then sets out the architecture of the proposed solution and explains in detail the two main elements of the solution: the Voter and the Health Monitoring partition. • Chapter 5, Prototype, explains in detail the prototyping of the proposed solution, including the choice of the hypervisor, the processing board, and the critical functionality to be redundant. With respect to the voter, it includes prototypes for both the software version (the voter is implemented in a virtual machine) and the hardware version (the voter is implemented as IP cores on the FPGA). • Chapter 6, Evaluation, includes the evaluation of the prototype developed in Chapter 5. As a preliminary step and given that there is no evidence in this regard, an exercise is carried out to measure the overhead involved in using the XtratuM hypervisor versus not using it. Subsequently, qualitative tests are carried out to check that Health Monitoring is working as expected and a fault injection campaign is carried out to check the error detection and correction rate of our solution. Finally, a comparison is made between the performance of the hardware and software versions of Voter. • Chapter 7, Conclusions and Future Work, is dedicated to collect the conclusions obtained and the contributions made during the research (in the form of articles in journals, conferences and contributions to projects and proposals in the industry). In addition, it establishes some lines of future work that could complete and extend the research carried out during this doctoral thesis.Programa de Doctorado en Ciencia y Tecnología Informática por la Universidad Carlos III de MadridPresidente: Katzalin Olcoz Herrero.- Secretario: Félix García Carballeira.- Vocal: Santiago Rodríguez de la Fuent

SHARKS: Smart Hacking Approaches for RisK Scanning in Internet-of-Things and Cyber-Physical Systems based on Machine Learning

Cyber-physical systems (CPS) and Internet-of-Things (IoT) devices are increasingly being deployed across multiple functionalities, ranging from healthcare devices and wearables to critical infrastructures, e.g., nuclear power plants, autonomous vehicles, smart cities, and smart homes. These devices are inherently not secure across their comprehensive software, hardware, and network stacks, thus presenting a large attack surface that can be exploited by hackers. In this article, we present an innovative technique for detecting unknown system vulnerabilities, managing these vulnerabilities, and improving incident response when such vulnerabilities are exploited. The novelty of this approach lies in extracting intelligence from known real-world CPS/IoT attacks, representing them in the form of regular expressions, and employing machine learning (ML) techniques on this ensemble of regular expressions to generate new attack vectors and security vulnerabilities. Our results show that 10 new attack vectors and 122 new vulnerability exploits can be successfully generated that have the potential to exploit a CPS or an IoT ecosystem. The ML methodology achieves an accuracy of 97.4% and enables us to predict these attacks efficiently with an 87.2% reduction in the search space. We demonstrate the application of our method to the hacking of the in-vehicle network of a connected car. To defend against the known attacks and possible novel exploits, we discuss a defense-in-depth mechanism for various classes of attacks and the classification of data targeted by such attacks. This defense mechanism optimizes the cost of security measures based on the sensitivity of the protected resource, thus incentivizing its adoption in real-world CPS/IoT by cybersecurity practitioners.Comment: This article has been accepted in IEEE Transactions on Emerging Topics in Computing. 17 pages, 12 figures, IEEE copyrigh