365 research outputs found

    component of this work in other works. Area-Efficient Synthesis of Fault-Secure NoC Switches

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    Evaluation of advanced techniques for structural FPGA self-test

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    This thesis presents a comprehensive test generation framework for FPGA logic elements and interconnects. It is based on and extends the current state-of-the-art. The purpose of FPGA testing in this work is to achieve reliable reconfiguration for a FPGA-based runtime reconfigurable system. A pre-configuration test is performed on a portion of the FPGA before it is reconfigured as part of the system to ensure that the FPGA fabric is fault-free. The implementation platform is the Xilinx Virtex-5 FPGA family. Existing literature in FPGA testing is evaluated and reviewed thoroughly. The various approaches are compared against one another qualitatively and the approach most suitable to the target platform is chosen. The array testing method is employed in testing the FPGA logic for its low hardware overhead and optimal test time. All tests are additionally pipelined to reduce test application time and use a high test clock frequency. A hybrid fault model including both structural and functional faults is assumed. An algorithm for the optimization of the number of required FPGA test configurations is developed and implemented in Java using a pseudo-random set-covering heuristic. Optimal solutions are obtained for Virtex-5 logic slices. The algorithm effort is parameterizable with the number of loop iterations each of which take approximately one second for a Virtex-5 sliceL circuit. A flexible test architecture for interconnects is developed. Arbitrary wire types can be tested in the same test configuration with no hardware overhead. Furthermore, a routing algorithm is integrated with the test template generation to select the wires under test and route them appropriately. Nine test configurations are required to achieve full test coverage for the FPGA logic. For interconnect testing, a local router-based on depth-first graph traversal is implemented in Java as the basis for creating systematic interconnect test templates. Pent wire testing is additionally implemented as a proof of concept. The test clock frequency for all tests exceeds 170 MHz and the hardware overhead is always lower than seven CLBs. All implemented tests are parameterizable such that they can be applied to any portion of the FPGA regardless of size or position

    Balance testing and balance-testable design of logic circuits

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    We propose a low-cost method for testing logic circuits, termed balance testing, which is particularly suited to built-in self testing. Conceptually related to ones counting and syndrome testing, it detects faults by checking the difference between the number of ones and the number of zeros in the test response sequence. A key advantage of balance testing is that the testability of various fault types can be easily analyzed. We present a novel analysis technique which leads to necessary and sufficient conditions for the balance testability of the standard single stuck-line (SSL) faults. This analysis can be easily extended to multiple stuck-line and bridging faults. Balance testing also forms the basis for design for balance testability (DFBT), a systematic DFT technique that achieves full coverage of SSL faults. It places the unit under test in a low-cost framework circuit that guarantees complete balance testability. Unlike most existing DFT techniques, DFBT requires only one additional control input and no redesign of the underlying circuit is necessary. We present experimental results on applying balance testing to the ISCAS 85 benchmark circuits, which show that very high fault coverage is obtained for large circuits even with reduced deterministic test sets. This coverage can always be made 100% either by adding tests or applying DFBT.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/43016/1/10836_2004_Article_BF00136077.pd

    Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

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    Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

    CROSS-LAYER DESIGN, OPTIMIZATION AND PROTOTYPING OF NoCs FOR THE NEXT GENERATION OF HOMOGENEOUS MANY-CORE SYSTEMS

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    This thesis provides a whole set of design methods to enable and manage the runtime heterogeneity of features-rich industry-ready Tile-Based Networkon- Chips at different abstraction layers (Architecture Design, Network Assembling, Testing of NoC, Runtime Operation). The key idea is to maintain the functionalities of the original layers, and to improve the performance of architectures by allowing, joint optimization and layer coordinations. In general purpose systems, we address the microarchitectural challenges by codesigning and co-optimizing feature-rich architectures. In application-specific NoCs, we emphasize the event notification, so that the platform is continuously under control. At the network assembly level, this thesis proposes a Hold Time Robustness technique, to tackle the hold time issue in synchronous NoCs. At the network architectural level, the choice of a suitable synchronization paradigm requires a boost of synthesis flow as well as the coexistence with the DVFS. On one hand this implies the coexistence of mesochronous synchronizers in the network with dual-clock FIFOs at network boundaries. On the other hand, dual-clock FIFOs may be placed across inter-switch links hence removing the need for mesochronous synchronizers. This thesis will study the implications of the above approaches both on the design flow and on the performance and power quality metrics of the network. Once the manycore system is composed together, the issue of testing it arises. This thesis takes on this challenge and engineers various testing infrastructures. At the upper abstraction layer, the thesis addresses the issue of managing the fully operational system and proposes a congestion management technique named HACS. Moreover, some of the ideas of this thesis will undergo an FPGA prototyping. Finally, we provide some features for emerging technology by characterizing the power consumption of Optical NoC Interfaces

    Machine learning based anomaly detection for industry 4.0 systems.

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    223 p.This thesis studies anomaly detection in industrial systems using technologies from the Fourth Industrial Revolution (4IR), such as the Internet of Things, Artificial Intelligence, 3D Printing, and Augmented Reality. The goal is to provide tools that can be used in real-world scenarios to detect system anomalies, intending to improve production and maintenance processes. The thesis investigates the applicability and implementation of 4IR technology architectures, AI-driven machine learning systems, and advanced visualization tools to support decision-making based on the detection of anomalies. The work covers a range of topics, including the conception of a 4IR system based on a generic architecture, the design of a data acquisition system for analysis and modelling, the creation of ensemble supervised and semi-supervised models for anomaly detection, the detection of anomalies through frequency analysis, and the visualization of associated data using Visual Analytics. The results show that the proposed methodology for integrating anomaly detection systems in new or existing industries is valid and that combining 4IR architectures, ensemble machine learning models, and Visual Analytics tools significantly enhances theanomaly detection processes for industrial systems. Furthermore, the thesis presents a guiding framework for data engineers and end-users

    Machine learning support for logic diagnosis

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    Resilience of an embedded architecture using hardware redundancy

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    In the last decade the dominance of the general computing systems market has being replaced by embedded systems with billions of units manufactured every year. Embedded systems appear in contexts where continuous operation is of utmost importance and failure can be profound. Nowadays, radiation poses a serious threat to the reliable operation of safety-critical systems. Fault avoidance techniques, such as radiation hardening, have been commonly used in space applications. However, these components are expensive, lag behind commercial components with regards to performance and do not provide 100% fault elimination. Without fault tolerant mechanisms, many of these faults can become errors at the application or system level, which in turn, can result in catastrophic failures. In this work we study the concepts of fault tolerance and dependability and extend these concepts providing our own definition of resilience. We analyse the physics of radiation-induced faults, the damage mechanisms of particles and the process that leads to computing failures. We provide extensive taxonomies of 1) existing fault tolerant techniques and of 2) the effects of radiation in state-of-the-art electronics, analysing and comparing their characteristics. We propose a detailed model of faults and provide a classification of the different types of faults at various levels. We introduce an algorithm of fault tolerance and define the system states and actions necessary to implement it. We introduce novel hardware and system software techniques that provide a more efficient combination of reliability, performance and power consumption than existing techniques. We propose a new element of the system called syndrome that is the core of a resilient architecture whose software and hardware can adapt to reliable and unreliable environments. We implement a software simulator and disassembler and introduce a testing framework in combination with ERA’s assembler and commercial hardware simulators

    University of Vermont graduate theses on Vermont topics, 1975-1992

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    Occasional paper (University of Vermont, Center for Research on Vermont) ; no. 15 Includes bibliographical references and index
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