12,404 research outputs found

    Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

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    The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

    Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

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    This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

    Computationally efficient characterization of standard cells for statistical static timing analysis

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    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Includes bibliographical references (p. 44-45).We propose a computationally efficient statistical static timing analysis (SSTA) technique that addresses intra-die variations at near-threshold to sub-threshold supply voltage, simulated on a scaled 32nm CMOS standard cell library. This technique would characterize the propagation delay and output slew of an individual cell for subsequent timing path analyses. Its efficiency stems from the fact that it only needs to find the delay or output slew in the vicinity of the ?- sigma operating point (where ? = 0 to 3) rather than the entire probability density function of the delay or output slew, as in conventional Monte-Carlo simulations. The algorithm is simulated on combinational logic gates that include inverters, NANDs, and NORs of different sizes. The delay and output slew estimates in most cases differ from the Monte-Carlo results by less than 5%. Higher supply voltage, larger transistor widths, and slower input slews tend to improve delay and output slew estimates. Transistor stacking is found to be the only major source of under-prediction by the SSTA technique. Overall, the cell characterization approach has a substantial computational advantage compared to SPICE-based Monte-Carlo analysis.by Sharon H. Chou.M.Eng

    Equivalent Waveform Propagation for Static Timing Analysis

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    The developmental dynamics of terrorist organizations

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    We identify robust statistical patterns in the frequency and severity of violent attacks by terrorist organizations as they grow and age. Using group-level static and dynamic analyses of terrorist events worldwide from 1968-2008 and a simulation model of organizational dynamics, we show that the production of violent events tends to accelerate with increasing size and experience. This coupling of frequency, experience and size arises from a fundamental positive feedback loop in which attacks lead to growth which leads to increased production of new attacks. In contrast, event severity is independent of both size and experience. Thus larger, more experienced organizations are more deadly because they attack more frequently, not because their attacks are more deadly, and large events are equally likely to come from large and small organizations. These results hold across political ideologies and time, suggesting that the frequency and severity of terrorism may be constrained by fundamental processes.Comment: 28 pages, 8 figures, 4 tables, supplementary materia

    6T-SRAM 1Mb Design with Test Structures and Post Silicon Validation

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    abstract: Static random-access memories (SRAM) are integral part of design systems as caches and data memories that and occupy one-third of design space. The work presents an embedded low power SRAM on a triple well process that allows body-biasing control. In addition to the normal mode operation, the design is embedded with Physical Unclonable Function (PUF) [Suh07] and Sense Amplifier Test (SA Test) mode. With PUF mode structures, the fabrication and environmental mismatches in bit cells are used to generate unique identification bits. These bits are fixed and known as preferred state of an SRAM bit cell. The direct access test structure is a measurement unit for offset voltage analysis of sense amplifiers. These designs are manufactured using a foundry bulk CMOS 55 nm low-power (LP) process. The details about SRAM bit-cell and peripheral circuit design is discussed in detail, for certain cases the circuit simulation analysis is performed with random variations embedded in SPICE models. Further, post-silicon testing results are discussed for normal operation of SRAMs and the special test modes. The silicon and circuit simulation results for various tests are presented.Dissertation/ThesisMasters Thesis Electrical Engineering 201

    Computation of cross-talk alignment by mixed integer linear programming

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    Noise analysis has been an important and difficult part of design flow of very large-scale integrated (VLSI) systems in many years. In this thesis, the problem of signal alignment resulting in possible maximum peak interconnect coupling noise and propose a variation aware technique for computing combined noise pulse taking into account timing constraints on signal transitions has been discussed. This work shows that the worst noise alignment algorithm can be formulated as mixed integer programming (MLIP) problem both in deterministic window cases and variational window cases. For deterministic window cases, it is assumed that timing windows are given for each aggressor inputs and the victim net is quite. It compares the results from proposed method with the most known and widely used method for computing the worst aggressor alignment - sweeping line algorithm, to verify its correctness and efficiency. For variation window cases, as variations of process and environmental parameters result in variation of start and end points of timing windows, linear approximation is used for approximating effect of process and environmental variations. One of the biggest advantages of MILP formulation of aggressor alignment problem has also been discussed, which is the ability to be easily extended to more complex cases such as non-triangle noise pulses, victim sensitivity window and discontinuous timing windows, this work shows that such extension can be solved by algorithm and does not require development of new algorithms. Therefore, this novel technique can handle noise alignment problem both in deterministic and variational cases and can be easily extended for more complex cases --Abstract, page iii

    The Dynamics of Retail Oligopolies

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    Dynamic Models, Retail Indusry, Markov perfect equilibrium, Oligopoly

    Product assurance technology for procuring reliable, radiation-hard, custom LSI/VLSI electronics

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    Advanced measurement methods using microelectronic test chips are described. These chips are intended to be used in acquiring the data needed to qualify Application Specific Integrated Circuits (ASIC's) for space use. Efforts were focused on developing the technology for obtaining custom IC's from CMOS/bulk silicon foundries. A series of test chips were developed: a parametric test strip, a fault chip, a set of reliability chips, and the CRRES (Combined Release and Radiation Effects Satellite) chip, a test circuit for monitoring space radiation effects. The technical accomplishments of the effort include: (1) development of a fault chip that contains a set of test structures used to evaluate the density of various process-induced defects; (2) development of new test structures and testing techniques for measuring gate-oxide capacitance, gate-overlap capacitance, and propagation delay; (3) development of a set of reliability chips that are used to evaluate failure mechanisms in CMOS/bulk: interconnect and contact electromigration and time-dependent dielectric breakdown; (4) development of MOSFET parameter extraction procedures for evaluating subthreshold characteristics; (5) evaluation of test chips and test strips on the second CRRES wafer run; (6) two dedicated fabrication runs for the CRRES chip flight parts; and (7) publication of two papers: one on the split-cross bridge resistor and another on asymmetrical SRAM (static random access memory) cells for single-event upset analysis
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