154 research outputs found

    Planar Electrostatically Doped Reconfigurable Schottky Barrier FDSOI Field-Effect Transistor Structures

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    In the last 50 years, our economy and society have obviously been influenced and shaped to a great extent by electronic devices. This substantial impact of electronics is the result of a continuous performance improvement based on the scaling, i.e. shrinking, of MOSFET devices in complementary integrated circuits, following Moore's law. As the MOSFET feature sizes are approaching atomistic dimensions, the scaling trend slowed down considerably and is even threatened for sub-10 nm technology nodes. Further, additional advancements are increasingly difficult to realize both from the technological and especially the economical perspective. Therefore, technologies that have the potential to supersede the CMOS technology in the future are the topic of intensive investigation by both researchers and the industry. An attractive solution is the leveraging of existing semiconductor technologies based on emerging research devices (ERD) offering novel characteristics, which enable new circuit architectures in future nanoscale logic circuits. A possible ERD contender are polarity controllable or reconfigurable MOSFET (RFET) concepts. Generally, RFET devices are able to switch between n- and p-type conduction by the application of an electrical signal. Therefore, RFET promise increased complex systems with a lower device count decreasing the costs per basic logic function based on their higher logic expressiveness. The focus of this work lies in the successful transfer of a predecessor silicon nanowire (NW) RFET technology into a planar RFET device, while simultaneously optimizing the resulting RFET for reconfigurable as well as conventional CMOS circuits. As for the predecessor NW RFET, the planar approach features a doping-less CMOS compatible fabrication process on a conventional SOI substrate and obtains its reconfigurability by electrostatic doping. The device can be regarded as a entanglement of two MOSFET in one structure, i.e. a depletion mode FET centered on top of a backside enhancement mode Schottky barrier FET (SBFET). The backside SBFET establishes the conductive channel consisting of the desired charge carrier type via an appropriate potential on its gate electrode. The topside FET controls the charge carrier flow between source and drain by locally depleting this channel given an opposite potential on its gate electrode with respect to the backside gate electrode. Two generations of devices have been successfully processed, while different gate electrode materials, i.e. nickel, aluminum and reactively sputtered tungsten-titanium-nitride, have been introduced to the device structure. As n- and p-type symmetry of the very same device is essential for RFET circuit design, tungsten-titanium-nitride is experimentally identified as a possible mid-gap metal gate electrode for RFET devices. Also, a Schottky barrier adjustment process for ideal n- and p-type symmetry based on silicide induced dopant segregation is experimentally demonstrated. Extensive electrical characterizations supported by calibrated TCAD simulations are presented, demonstrating experimental sub-threshold slopes of 65 mV/dec and on-to-off current ratios of over 9 decades. Based on TCAD simulations and supported by experimental results, the design space of the device concept is explored in order to gather predictive results for future scaled device optimization. Further, the high temperature (HT) performance is evaluated and compared to the predecessor NW RFET devices as well as to a state-of-the-art industrial high reliability HT MOSFET clearly illustrating the on par performance of the planar RFET concept with respect to off-state leakage current

    Novel Electrostatically Doped Planar Field-Effect Transistor for High Temperature Applications

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    In this paper, we present experimental results and simulation data of an electrostatically doped and therefore voltage-programmable, planar, CMOS-compatible field-effect transistor (FET) structure. This planar device is based on our previously published Si-nanowire (SiNW) technology. Schottky barrier source/drain (S/D) contacts and a silicon-on-insulator (SOI) technology platform are the key features of this dual-gated but single channel universal FET. The combination of two electrically independent gates, one back-gate for S/D Schottky barrier modulation as well as channel formation to establish Schottky barrier FET (SBFET) operation and one front-gate forming a junctionless FET (JLFET) for actual current control, significantly increases the temperature robustness of the device.Comment: 18 pages, 11 figure

    Multiple-Independent-Gate Field-Effect Transistors for High Computational Density and Low Power Consumption

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    Transistors are the fundamental elements in Integrated Circuits (IC). The development of transistors significantly improves the circuit performance. Numerous technology innovations have been adopted to maintain the continuous scaling down of transistors. With all these innovations and efforts, the transistor size is approaching the natural limitations of materials in the near future. The circuits are expected to compute in a more efficient way. From this perspective, new device concepts are desirable to exploit additional functionality. On the other hand, with the continuously increased device density on the chips, reducing the power consumption has become a key concern in IC design. To overcome the limitations of Complementary Metal-Oxide-Semiconductor (CMOS) technology in computing efficiency and power reduction, this thesis introduces the multiple- independent-gate Field-Effect Transistors (FETs) with silicon nanowires and FinFET structures. The device not only has the capability of polarity control, but also provides dual-threshold- voltage and steep-subthreshold-slope operations for power reduction in circuit design. By independently modulating the Schottky junctions between metallic source/drain and semiconductor channel, the dual-threshold-voltage characteristics with controllable polarity are achieved in a single device. This property is demonstrated in both experiments and simulations. Thanks to the compact implementation of logic functions, circuit-level benchmarking shows promising performance with a configurable dual-threshold-voltage physical design, which is suitable for low-power applications. This thesis also experimentally demonstrates the steep-subthreshold-slope operation in the multiple-independent-gate FETs. Based on a positive feedback induced by weak impact ionization, the measured characteristics of the device achieve a steep subthreshold slope of 6 mV/dec over 5 decades of current. High Ion/Ioff ratio and low leakage current are also simultaneously obtained with a good reliability. Based on a physical analysis of the device operation, feasible improvements are suggested to further enhance the performance. A physics-based surface potential and drain current model is also derived for the polarity-controllable Silicon Nanowire FETs (SiNWFETs). By solving the carrier transport at Schottky junctions and in the channel, the core model captures the operation with independent gate control. It can serve as the core framework for developing a complete compact model by integrating advanced physical effects. To summarize, multiple-independent-gate SiNWFETs and FinFETs are extensively studied in terms of fabrication, modeling, and simulation. The proposed device concept expands the family of polarity-controllable FETs. In addition to the enhanced logic functionality, the polarity-controllable SiNWFETs and FinFETs with the dual-threshold-voltage and steep-subthreshold-slope operation can be promising candidates for future IC design towards low-power applications

    Vertical III-V Nanowire Transistors for Low-Power Logic and Reconfigurable Applications

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    With rapid increase in energy consumption of electronics used in our daily life, the building blocks — transistors — need to work in a way that has high energy efficiency and functional density to meet the demand of further scaling. III-V channel combined with vertical nanowire gate-all-around (GAA) device architecture is a promising alternative to conventional Si transistors due to its excellent electrical properties in the channel and electrostatic control across the gate oxide in addition to reduced footprint. Based on this platform, two major objectives of this thesis are included: 1) to improve the performance of III-V p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) and tunnel FETs (TFETs) for low-power digital applications; 2) to integrate HfO2-based ferroelectric gate onto III-V FETs (FeFETs) and TFETs (ferro-TFETs) to enable reconfigurable operation for high functional density.The key bottleneck for all-III-V CMOS is its p-type MOSFETs (p-FETs) which are mainly made of GaSb or InGaSb. Rich surface states of III-Sb materials not only lead to decreased effective channel mobility due to more scattering, but also deteriorate the electrostatics. In this thesis, several approaches to improve p-FET performance have been explored. One strategy is to enhance the hole mobility by introducing compressive strain into III-Sb channel. For the first time, a high and uniform compressive strain near 1% along the transport direction has been achieved in downscaled GaSb nanowires by growing and engineering GaSb-GaAsSb core-shell structure, aiming for potential hole mobility enhancement. In addition, surface passivation using digital etch has been developed to improve the electrostatics with subthreshold swing (SS) down to 107 mV/dec. Moreover, the on-state performance including on-current (Ion) and transconductance (gm) have been enhanced by ∼50% using annealing with H2-based forming gas. Lastly, a novel p-FET structure with (In)GaAsSb channel has been developed and further improved off-state performance with SS = 71 mV/dec, which is the lowest value among all reported III-V p-FETs.Despite subthermionic operation, TFETs usually suffer from low drive current as well as the current operating below 60 mV/dec (I60). The second focus of this thesis is to fine-tune the InAs/(In)GaAsSb heterostructure tunnel junction and the doping in the source segment during epitaxy. As a result, a substantially increased I60 (>1 µA/µm) and Ion up to 40 µA/µm at source-drain bias of 0.5 V have been achieved, reaching a record compared to other reported TFETs.Finally, emerging ferroelectric oxide based on Zr-doped HfO2 (HZO) has been successfully integrated onto III-V vertical nanowire transistors to form FeFETs and ferro-TFETs with GAA architecture. The corresponding electrical performance and reliability have been carefully characterized with both DC and pulsed I-V measurements. The unique band-to-band tunneling in InAs/(In)GaAsSb/GaSb heterostructure TFET creates an ultrashort effective channel, leading to detection of localized potential variation induced by single domains and defects in nanoscale ferroelectric HZO without physical gate-length scaling. By introducing gate/source overlap structure in the ferro-TFET, non-volatile reconfigurable signal modulation with multiple modes including signal transmission, phase shift, frequency doubling, and mixing has been achieved in a single device with low drive voltage and only ∼0.01 µm2 footprint, thus increasing both functional density andenergy efficiency

    Analysis of performance variation in 16nm FinFET FPGA devices

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    Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

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    This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

    Design Automation and Application for Emerging Reconfigurable Nanotechnologies

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    In the last few decades, two major phenomena have revolutionized the electronic industry – the ever-increasing dependence on electronic circuits and the Complementary Metal Oxide Semiconductor (CMOS) downscaling. These two phenomena have been complementing each other in a way that while electronics, in general, have demanded more computations per functional unit, CMOS downscaling has aptly supported such needs. However, while the computational demand is still rising exponentially, CMOS downscaling is reaching its physical limits. Hence, the need to explore viable emerging nanotechnologies is more imperative than ever. This thesis focuses on streamlining the existing design automation techniques for a class of emerging reconfigurable nanotechnologies. Transistors based on this technology exhibit duality in conduction, i.e. they can be configured dynamically either as a p-type or an n-type device on the application of an external bias. Owing to this dynamic reconfiguration, these transistors are also referred to as Reconfigurable Field-Effect Transistors (RFETs). Exploring and developing new technologies just like CMOS, require tackling two main challenges – first, design automation flow has to be modified to enable tailor- made circuit designs. Second, possible application opportunities should be explored where such technologies can outsmart the existing CMOS technologies. This thesis targets the above two objectives for emerging reconfigurable nanotechnologies by proposing approaches for enabling an Electronic Design Automation (EDA) flow for circuits based on RFETs and exploring hardware security as an application that exploits the transistor-level dynamic reconfiguration offered by this technology. This thesis explains the bottom-up approach adopted to propose a logic synthesis flow by identifying new logic gates and circuit design paradigms that can particularly exploit the dynamic reconfiguration offered by these novel nanotechnologies. This led to the subsequent need of finding natural Boolean logic abstraction for emerging reconfigurable nanotechnologies as it is shown that the existing abstraction of negative unate logic for CMOS technologies is sub-optimal for RFETs-based circuits. In this direction, it has been shown that duality in Boolean logic is a natural abstraction for this technology and can truly represent the duality in conduction offered by individual transistors. Finding this abstraction paved the way for defining suitable primitives and proposing various algorithms for logic synthesis and technology mapping. The following step is to explore compatible physical synthesis flow for emerging reconfigurable nanotechnologies. Using silicon nanowire-based RFETs, .lef and .lib files have been provided which can provide an end-to-end flow to generate .GDSII file for circuits exclusively based on RFETs. Additionally, new approaches have been explored to improve placement and routing for circuits based on reconfigurable nanotechnologies. It has been demonstrated how these approaches led to superior results as compared to the native flow meant for CMOS. Lastly, the unique property of transistor-level reconfiguration offered by RFETs is utilized to implement efficient Intellectual Property (IP) protection schemes against adversarial attacks. The ability to control the conduction of individual transistors can be argued as one of the impactful features of this technology and suitably fits into the paradigm of security measures. Prior security schemes based on CMOS technology often come with large overheads in terms of area, power, and delay. In contrast, RFETs-based hardware security measures such as logic locking, split manufacturing, etc. proposed in this thesis, demonstrate affordable security solutions with low overheads. Overall, this thesis lays a strong foundation for the two main objectives – design automation, and hardware security as an application, to push emerging reconfigurable nanotechnologies for commercial integration. Additionally, contributions done in this thesis are made available under open-source licenses so as to foster new research directions and collaborations.:Abstract List of Figures List of Tables 1 Introduction 1.1 What are emerging reconfigurable nanotechnologies? 1.2 Why does this technology look so promising? 1.3 Electronics Design Automation 1.4 The game of see-saw: key challenges vs benefits for emerging reconfigurable nanotechnologies 1.4.1 Abstracting ambipolarity in logic gate designs 1.4.2 Enabling electronic design automation for RFETs 1.4.3 Enhanced functionality: a suitable fit for hardware security applications 1.5 Research questions 1.6 Entire RFET-centric EDA Flow 1.7 Key Contributions and Thesis Organization 2 Preliminaries 2.1 Reconfigurable Nanotechnology 2.1.1 1D devices 2.1.2 2D devices 2.1.3 Factors favoring circuit-flexibility 2.2 Feasibility aspects of RFET technology 2.3 Logic Synthesis Preliminaries 2.3.1 Circuit Model 2.3.2 Boolean Algebra 2.3.3 Monotone Function and the property of Unateness 2.3.4 Logic Representations 3 Exploring Circuit Design Topologies for RFETs 3.1 Contributions 3.2 Organization 3.3 Related Works 3.4 Exploring design topologies for combinational circuits: functionality-enhanced logic gates 3.4.1 List of Combinational Functionality-Enhanced Logic Gates based on RFETs 3.4.2 Estimation of gate delay using the logical effort theory 3.5 Invariable design of Inverters 3.6 Sequential Circuits 3.6.1 Dual edge-triggered TSPC-based D-flip flop 3.6.2 Exploiting RFET’s ambipolarity for metastability 3.7 Evaluations 3.7.1 Evaluation of combinational logic gates 3.7.2 Novel design of 1-bit ALU 3.7.3 Comparison of the sequential circuit with an equivalent CMOS-based design 3.8 Concluding remarks 4 Standard Cells and Technology Mapping 4.1 Contributions 4.2 Organization 4.3 Related Work 4.4 Standard cells based on RFETs 4.4.1 Interchangeable Pull-Up and Pull-Down Networks 4.4.2 Reconfigurable Truth-Table 4.5 Distilling standard cells 4.6 HOF-based Technology Mapping Flow for RFETs-based circuits 4.6.1 Area adjustments through inverter sharings 4.6.2 Technology Mapping Flow 4.6.3 Realizing Parameters For The Generic Library 4.6.4 Defining RFETs-based Genlib for HOF-based mapping 4.7 Experiments 4.7.1 Experiment 1: Distilling standard-cells from a benchmark suite 4.7.2 Experiment 2A: HOF-based mapping . 4.7.3 Experiment 2B: Using the distilled standard-cells during mapping 4.8 Concluding Remarks 5 Logic Synthesis with XOR-Majority Graphs 5.1 Contributions 5.2 Organization 5.3 Motivation 5.4 Background and Preliminaries 5.4.1 Terminologies 5.4.2 Self-duality in NPN classes 5.4.3 Majority logic synthesis 5.4.4 Earlier work on XMG 5.4.5 Classification of Boolean functions 5.5 Preserving Self-Duality 5.5.1 During logic synthesis 5.5.2 During versatile technology mapping 5.6 Advanced Logic synthesis techniques 5.6.1 XMG resubstitution 5.6.2 Exact XMG rewriting 5.7 Logic representation-agnostic Mapping 5.7.1 Versatile Mapper 5.7.2 Support of supergates 5.8 Creating Self-dual Benchmarks 5.9 Experiments 5.9.1 XMG-based Flow 5.9.2 Experimental Setup 5.9.3 Synthetic self-dual benchmarks 5.9.4 Cryptographic benchmark suite 5.10 Concluding remarks and future research directions 6 Physical synthesis flow and liberty generation 6.1 Contributions 6.2 Organization 6.3 Background and Related Work 6.3.1 Related Works 6.3.2 Motivation 6.4 Silicon Nanowire Reconfigurable Transistors 6.5 Layouts for Logic Gates 6.5.1 Layouts for Static Functional Logic Gates 6.5.2 Layout for Reconfigurable Logic Gate 6.6 Table Model for Silicon Nanowire RFETs 6.7 Exploring Approaches for Physical Synthesis 6.7.1 Using the Standard Place & Route Flow 6.7.2 Open-source Flow 6.7.3 Concept of Driver Cells 6.7.4 Native Approach 6.7.5 Island-based Approach 6.7.6 Utilization Factor 6.7.7 Placement of the Island on the Chip 6.8 Experiments 6.8.1 Preliminary comparison with CMOS technology 6.8.2 Evaluating different physical synthesis approaches 6.9 Results and discussions 6.9.1 Parameters Which Affect The Area 6.9.2 Use of Germanium Nanowires Channels 6.10 Concluding Remarks 7 Polymporphic Primitives for Hardware Security 7.1 Contributions 7.2 Organization 7.3 The Shift To Explore Emerging Technologies For Security 7.4 Background 7.4.1 IP protection schemes 7.4.2 Preliminaries 7.5 Security Promises 7.5.1 RFETs for logic locking (transistor-level locking) 7.5.2 RFETs for split manufacturing 7.6 Security Vulnerabilities 7.6.1 Realization of short-circuit and open-circuit scenarios in an RFET-based inverter 7.6.2 Circuit evaluation on sub-circuits 7.6.3 Reliability concerns: A consequence of short-circuit scenario 7.6.4 Implication of the proposed security vulnerability 7.7 Analytical Evaluation 7.7.1 Investigating the security promises 7.7.2 Investigating the security vulnerabilities 7.8 Concluding remarks and future research directions 8 Conclusion 8.1 Concluding Remarks 8.2 Directions for Future Work Appendices A Distilling standard-cells B RFETs-based Genlib C Layout Extraction File (.lef) for Silicon Nanowire-based RFET D Liberty (.lib) file for Silicon Nanowire-based RFET

    Gate-based sensing of silicon quantum dot devices towards 2D scaling

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    This thesis focuses on using the radio-frequency reflectometry technique for dispersive gate sensing of foundry fabricated silicon nanowire quantum dot devices. I will attempt to answer three questions relating to the scalability of these devices. How do electron and hole spin qubits perform in silicon quantum dots? How do we implement and distribute the placement of dispersive gate sensors in scaled-up quantum dot arrays? And how does a single dopant in the silicon channel affect the gate-defined quantum dot? First, I investigate the difference between electron and hole quantum dots in an ambipolar nanowire device which successfully demonstrated reconfigurable single and double electron and hole quantum dots in the same crystalline environment. I further investigate the effective bath temperature of two-dimensional electron gas and two-dimensional hole gas by performing the thermometry experiment on the same type of device. Secondly, I demonstrate a two-dimensional quantum dot array enabled by a floating gate architecture between silicon nanowires. An analytical model is developed to study the capacitive coupling between remote quantum dots over different distances. Coupling strength under different qubit encodings is also discussed to show the best implementation for neighbour silicon nanowires. Finally, the in-situ dispersive gate sensing allows the measurement of the inter-dot transition between the bismuth donor-dot system. The novel implementation with bismuth donor can open up the possibility of a hybrid singlet-triplet qubit or transferring a coherent spin state between the quantum dot and the donor
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