Using Cross-Linked SU-8 to Flip-Chip Bond, Assemble, and Package MEMS Devices

This paper investigates using an SU-8 photoresist as an adhesive material for flip-chip bonding, assembling, and packaging microelectromechanical systems devices. An important factor, when using SU-8 as an adhesive material is to control ultraviolet (UV) exposure during fabrication to maximize bond strength due to material cross linking. This approach is much improved over previous efforts where SU-8 bake times and temperatures where changed to alter material cross-linking. In this paper, bake times and temperatures were maintained constant and total UV exposure energy was varied. Once fabricated, bond strength was systematically tested to determine the tensile loads needed to separate bonded structures. The resulting separation force was shown to increase with UV exposure and ranged from 0.25 (5-s exposure) to 1.25 N (15-s exposure). The separation test data were then analyzed to determine the statistical significance of varying UV exposure time and its effect on SU-8 cross-linking and bond strength. The data show that total UV exposure dose is directly correlated with the bond strength of SU-8 bonded structures. By varying only UV dose, the separation force data exhibited a statistically significant dependence on SU-8 cross linking with a 5% probability of error. Further, SU-8 etch resiliency increased by approximately 40%-60% as cross linking was increased with UV exposures ranging from 5 to 15 s

Implantable micromechanical parylene-based pressure sensors for unpowered intraocular pressure sensing

This paper presents the first implantable, unpowered, parylene-based microelectromechanical system (MEMS) pressure sensor for intraocular pressure (IOP) sensing. From in situ mechanical deformation of the compliant spiral-tube structures, this sensor registers pressure variations without electrical or powered signal transduction of any kind. Micromachined high-aspect-ratio polymeric hollow tubes with different geometric layouts are implemented to obtain high-sensitivity pressure responses. An integrated device packaging method has been developed toward enabling minimally invasive suture-less needle-based implantation of the device. Both in vitro and ex vivo device characterizations have successfully demonstrated mmHg resolution of the pressure responses. In vivo animal experiments have also been conducted to verify the biocompatibility and functionality of the implant fixation method inside the eye. Using the proposed implantation scheme, the pressure response of the implant can be directly observed from outside the eye under visible light, with the goal of realizing convenient, direct and faithful IOP monitoring in glaucoma patients

IC-integrated flexible shear-stress sensor skin

This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability

Field tests of a portable MEMS gravimeter

Gravimeters are used to measure density anomalies under the ground. They are applied in many different fields from volcanology to oil and gas exploration, but present commercial systems are costly and massive. A new type of gravity sensor has been developed that utilises the same fabrication methods as those used to make mobile phone accelerometers. In this study, we describe the first results of a field-portable microelectromechanical system (MEMS) gravimeter. The stability of the gravimeter is demonstrated through undertaking a multi-day measurement with a standard deviation of 5.58 × 10−6 ms−2 . It is then demonstrated that a change in gravitational acceleration of 4.5 × 10−5 ms−2 can be measured as the device is moved between the top and the bottom of a 20.7 m lift shaft with a signal-to-noise ratio (SNR) of 14.25. Finally, the device is demonstrated to be stable in a more harsh environment: a 4.5 × 10−4 ms−2 gravity variation is measured between the top and bottom of a 275-m hill with an SNR of 15.88. These initial field-tests are an important step towards a chip-sized gravity senso

Development and Packaging of Microsystems Using Foundry Services

Micro-electro-mechanical systems (MEMS) are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10(exp -3)/K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride (XeF2) was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid (HF) can be used

Packaging for a drug delivery microelectromechanical system

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2005.Includes bibliographical references (p. 52-55).Local drug delivery is a fast expanding field, and has been a center of attention for researchers in medicine in the last decade. Its advantages over systemic drug delivery are clear in cancer therapy, with localized tumors. A silicon microelectromechanical drug delivery device was fabricated for the purpose of delivering chemotherapeutic agents such-as carmustine, a potent brain cancer drug, directly to the site of the tumor. Limitations in the delivery capacity of the device led to the design of a new package. This package is made from thermally bonded Pyrex® 7740 frames that are anodically bonded to the drug delivery chip. It increases the capacity of the chip, is smaller than the previous package and possesses true hermeticity, because of the bonding processes involved. This work describes the fabrication steps of the new package and a problem with the thermal bonding of Pyrex® frames preventing the achievement of a package true to the original design. A temporary solution was devised and the completed package was tested with regards to its intended goals. It managed to increase the load capacity of the chip by a, factor of 10, with potential for more, while decreasing the overall size of the package. Short-term hermeticity was achieved for this package by using a UV-cured epoxy to bond some pieces, which was not in the original design. Future work will focus on finding a permanent solution to the aforementioned problem, and directions for it were suggested.by Hong Linh Ho Duc.S.M

Micromachined three-dimensional electrode arrays for in-vitro and in-vivo electrogenic cellular networks

This dissertation presents an investigation of micromachined three-dimensional microelectrode arrays (3-D MEAs) targeted toward in-vitro and in-vivo biomedical applications. Current 3-D MEAs are predominantly silicon-based, fabricated in a planar fashion, and are assembled to achieve a true 3-D form: a technique that cannot be extended to micro-manufacturing. The integrated 3-D MEAs developed in this work are polymer-based and thus offer potential for large-scale, high volume manufacturing. Two different techniques are developed for microfabrication of these MEAs - laser micromachining of a conformally deposited polymer on a non-planar surface to create 3-D molds for metal electrodeposition; and metal transfer micromolding, where functional metal layers are transferred from one polymer to another during the process of micromolding thus eliminating the need for complex and non-repeatable 3-D lithography processes. In-vitro and in-vivo 3-D MEAs are microfabricated using these techniques and are packaged utilizing Printed Circuit Boards (PCB) or other low-cost manufacturing techniques. To demonstrate in-vitro applications, growth of 3-D co-cultures of neurons/astrocytes and tissue-slice electrophysiology with brain tissue of rat pups were implemented. To demonstrate in-vivo application, measurements of nerve conduction were implemented. Microelectrode impedance models, noise models and various process models were evaluated. The results confirmed biocompatibility of the polymers involved, acceptable impedance range and noise of the microelectrodes, and potential to improve upon an archaic clinical diagnostic application utilizing these 3-D MEAs.Ph.D.Committee Chair: Mark G. Allen; Committee Member: Elliot L. Chaikof; Committee Member: Ionnis (John) Papapolymerou; Committee Member: Maysam Ghovanloo; Committee Member: Oliver Bran