Device and Circuit Level EMI Induced Vulnerability: Modeling and Experiments

Electro-magnetic interference (EMI) commonly exists in electronic equipment containing semiconductor-based integrated circuits (ICs). Metal-oxide-semiconductor field-effect-transistors (MOSFETs) in the ICs may be disrupted under EMI conditions due to transient voltage-current surges, and their internal states may change undesirably. In this work, the vulnerabilities of silicon MOSFETs under EMI are studied at the device and the circuit levels, categorized as non-permanent upsets (``Soft Errors'') and permanent damages (``Hard Failures''). The Soft Errors, such as temporary bit errors and waveform distortions, may happen or be intensified under EMI, as the transient disruptions activate unwanted and highly non-linear changes inside MOSFETs, such as Impact Ionization and Snapback. The system may be corrected from the erroneous state when the EMI condition is removed. We simulate planar silicon n-type MOSFETs at the device level to study the physical mechanisms leading to or complicate the short-term, signal-level Soft Errors. We experimentally tested commercially available MOSFET devices. Not included in regular MOSFET models, exponential-like current increases as the terminal voltage increases are observed and explained using the device-level knowledge. We develop a compact Soft Error model, compatible with circuit simulators using lumped (or compact-model) components and closed-form expressions, such as SPICE, and calibrate it with our in-house experimental data using an in-house extraction technique based on the Genetic Algorithm. Example circuits are simulated using the extracted device model and under EMI-induced transient disruptions. The EMI voltage-current disruptions may also lead to permanent Hard Failures that cannot be repaired without replacement. One type of Hard Failures, the MOSFET gate dielectric (or ``oxide'') breakdown, can result in input-output relation changes and additional thermal runaway. We have fabricated individual MOSFET devices at the FabLab at the University of Maryland NanoCenter. We experimentally stress-test the fabricated devices and observe the rapid, permanent oxide breakdown. Then, we simulate a nano-scale FinFET device with ultra-thin gate oxide at the device level. Then, we apply the knowledge from our experiments to the simulated FinFET, producing a gate oxide breakdown Hard Failure circuit model. The proposed workflow enables the evaluation of EMI-induced vulnerabilities in circuit simulations before actual fabrication and experiments, which can help the early-stage prototyping process and reduce the development time

A Flexible, Highly Integrated, Low Power pH Readout

Medical devices are widely employed in everyday life as wearable and implantable technologies make more and more technological breakthroughs. Implantable biosensors can be implanted into the human body for monitoring of relevant physiological parameters, such as pH value, glucose, lactate, CO2 [carbon dioxide], etc. For these applications the implantable unit needs a whole functional set of blocks such as micro- or nano-sensors, sensor signal processing and data generation units, wireless data transmitters etc., which require a well-designed implantable unit.Microelectronics technology with biosensors has caused more and more interest from both academic and industrial areas. With the advancement of microelectronics and microfabrication, it makes possible to fabricate a complete solution on an integrated chip with miniaturized size and low power consumption.This work presents a monolithic pH measurement system with power conditioning system for supply power derived from harvested energy. The proposed system includes a low-power, high linearity pH readout circuits with wide pH values (0-14) and a power conditioning unit based on low drop-out (LDO) voltage regulator. The readout circuit provides square-wave output with frequency being highly linear corresponding to the input pH values. To overcome the process variations, a simple calibration method is employed in the design which makes the output frequency stay constant over process, supply voltage and temperature variations. The prototype circuit is designed and fabricated in a standard 0.13-μm [micro-meter] CMOS process and shows good linearity to cover the entire pH value range from 0-14 while the voltage regulator provides a stable supply voltage for the system

Phase Noise Analyses and Measurements in the Hybrid Memristor-CMOS Phase-Locked Loop Design and Devices Beyond Bulk CMOS

Phase-locked loop (PLLs) has been widely used in analog or mixed-signal integrated circuits. Since there is an increasing market for low noise and high speed devices, PLLs are being employed in communications. In this dissertation, we investigated phase noise, tuning range, jitter, and power performances in different architectures of PLL designs. More energy efficient devices such as memristor, graphene, transition metal di-chalcogenide (TMDC) materials and their respective transistors are introduced in the design phase-locked loop. Subsequently, we modeled phase noise of a CMOS phase-locked loop from the superposition of noises from its building blocks which comprises of a voltage-controlled oscillator, loop filter, frequency divider, phase-frequency detector, and the auxiliary input reference clock. Similarly, a linear time-invariant model that has additive noise sources in frequency domain is used to analyze the phase noise. The modeled phase noise results are further compared with the corresponding phase-locked loop designs in different n-well CMOS processes. With the scaling of CMOS technology and the increase of the electrical field, the problem of short channel effects (SCE) has become dominant, which causes decay in subthreshold slope (SS) and positive and negative shifts in the threshold voltages of nMOS and pMOS transistors, respectively. Various devices are proposed to continue extending Moore\u27s law and the roadmap in semiconductor industry. We employed tunnel field effect transistor owing to its better performance in terms of SS, leakage current, power consumption etc. Applying an appropriate bias voltage to the gate-source region of TFET causes the valence band to align with the conduction band and injecting the charge carriers. Similarly, under reverse bias, the two bands are misaligned and there is no injection of carriers. We implemented graphene TFET and MoS2 in PLL design and the results show improvements in phase noise, jitter, tuning range, and frequency of operation. In addition, the power consumption is greatly reduced due to the low supply voltage of tunnel field effect transistor

Energy-Efficient Wireless Connectivity and Wireless Charging For Internet-of-Things (IoT) Applications

During the recent years, the Internet-of-Things (IoT) has been rapidly evolving. It is indeed the future of communication that has transformed Things of the real world into smarter devices. To date, the world has deployed billions of “smart” connected things. Predictions say there will be 10’s of billions of connected devices by 2025 and in our lifetime we will experience life with a trillion-node network. However, battery lifespan exhibits a critical barrier to scaling IoT devices. Replacing batteries on a trillion-sensor scale is a logistically prohibitive feat. Self-powered IoT devices seems to be the right direction to stand up to that challenge. The main objective of this thesis is to develop solutions to achieve energy-efficient wireless-connectivity and wireless-charging for IoT applications. In the first part of the thesis, I introduce ultra-low power radios that are compatible with the Bluetooth Low-Energy (BLE) standard. BLE is considered as the preeminent protocol for short-range communications that support transmission ranges up to 10’s of meters. Number of low power BLE transmitter (TX) and receiver (RX) architectures have been designed, fabricated and tested in different planar CMOS and FinFET technologies. The low power operation is achieved by combining low power techniques in both the network and physical layers, namely: backchannel communication, duty-cycling, open-loop transmission/reception, PLL-less architectures, and mixer-first architectures. Further novel techniques have been proposed to further reduce the power the consumption of the radio design, including: a fast startup time and low startup energy crystal oscillators, an antenna-chip co-design approach for quadrature generation in the RF path, an ultra-low power discrete-time differentiator-based Gaussian Frequency Shift Keying (GFSK) demodulation scheme, an oversampling GFSK modulation/demodulation scheme for open loop transmission/reception and packet synchronization, and a cell-based design approach that allows automation in the design of BLE digital architectures. The implemented BLE TXs transmit fully-compliant BLE advertising packet that can be received by commercial smartphone. In the second part of the thesis, I introduce passive nonlinear resonant circuits to achieve wide-band RF energy harvesting and robust wireless power transfer circuits. Nonlinear resonant circuits modeled by the Duffing nonlinear differential equation exhibit interesting hysteresis characteristics in their frequency and amplitude responses that are exploited in designing self-adaptive wireless charging systems. In the magnetic-resonance wireless power transfer scenario, coupled nonlinear resonators are proposed to maintain the power transfer level and efficiency over a range of coupling factors without active feedback control circuitry. Coupling factor depends on the transmission distance, lateral, and angular misalignments between the charging pad and the device. Therefore, nonlinear resonance extends the efficient charging zones of a wireless charger without the requirement for a precise alignment.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/169842/1/omaratty_1.pd

Integrated Circuits/Microchips

With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

Ultra-Wideband Secure Communications and Direct RF Sampling Transceivers

Larger wireless device bandwidth results in new capabilities in terms of higher data rates and security. The 5G evolution is focus on exploiting larger bandwidths for higher though-puts. Interference and co-existence issues can also be addressed by the larger bandwidth in the 5G and 6G evolution. This dissertation introduces of a novel Ultra-wideband (UWB) Code Division Multiple Access (CDMA) technique to exploit the largest bandwidth available in the upcoming wireless connectivity scenarios. The dissertation addresses interference immunity, secure communication at the physical layer and longer distance communication due to increased receiver sensitivity. The dissertation presents the design, workflow, simulations, hardware prototypes and experimental measurements to demonstrate the benefits of wideband Code-Division-Multiple-Access. Specifically, a description of each of the hardware and software stages is presented along with simulations of different scenarios using a test-bench and open-field measurements. The measurements provided experimental validation carried out to demonstrate the interference mitigation capabilities. In addition, Direct RF sampling techniques are employed to handle the larger bandwidth and avoid analog components. Additionally, a transmit and receive chain is designed and implemented at 28 GHz to provide a proof-of-concept for future 5G applications. The proposed wideband transceiver is also used to demonstrate higher accuracy direction finding, as much as 10 times improvement

Disseny microelectrnic de circuits discriminadors de polsos pel detector LHCb

The aim of this thesis is to present a solution for implementing the front end system of the Scintillator Pad Detector (SPD) of the calorimeter system of the LHCb experiment that will start in 2008 at the Large Hadron Collider (LHC) at CERN. The requirements of this specific system are discussed and an integrated solution is presented, both at system and circuit level. We also report some methodological achievements. In first place, a method to study the PSRR (and any transfer function) in fully differential circuits taking into account the effect of parameter mismatch is proposed. Concerning noise analysis, a method to study time variant circuits in the frequency domain is presented and justified. This would open the possibility to study the effect of 1/f noise in time variants circuits. In addition, it will be shown that the architecture developed for this system is a general solution for front ends in high luminosity experiments that must be operated with no dead time and must be robust against ballistic deficit

Digital-Based Analog Processing in Nanoscale CMOS ICs for IoT Applications

L'abstract è presente nell'allegato / the abstract is in the attachmen

Intelligent Circuits and Systems

ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.　 This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering