637 research outputs found
Methods for electronic components reliability improvement
Katedra mikroelektronik
Dynamic Mechanical and Failure Properties of Solder Joints
Ph.DDOCTOR OF PHILOSOPH
Life Cycle Analysis of a SpaceCube Printed Circuit Board Assembly Using Physics of Failure Methodologies
In this reliability life cycle evaluation of the SpaceCube 2.0 processor card, a partially populated version of the card is being evaluated to determine its durability with respect to typical GSFC mission loads
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