Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

A comprehensive comparison between design for testability techniques for total dose testing of flash-based FPGAs

Radiation sources exist in different kinds of environments where electronic devices often operate. Correct device operation is usually affected negatively by radiation. The radiation resultant effect manifests in several forms depending on the operating environment of the device like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). CMOS circuits and Floating gate MOS circuits suffer from an increase in the delay and the leakage current due to TID effect. This may damage the proper operation of the integrated circuit. Exhaustive testing is needed for devices operating in harsh conditions like space and military applications to ensure correct operations in the worst circumstances. The use of worst case test vectors (WCTVs) for testing is strongly recommended by MIL-STD-883, method 1019, which is the standard describing the procedure for testing electronic devices under radiation. However, the difficulty of generating these test vectors hinders their use in radiation testing. Testing digital circuits in the industry is usually done nowadays using design for testability (DFT) techniques as they are very mature and can be relied on. DFT techniques include, but not limited to, ad-hoc technique, built-in self test (BIST), muxed D scan, clocked scan and enhanced scan. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Despite all these recommendations for DFT, radiation testing has not benefited from this reliable technology yet. Also, with the big variation in the DFT techniques, choosing the right technique is the bottleneck to achieve the best results for TID testing. In this thesis, a comprehensive comparison between different DFT techniques for TID testing of flash-based FPGAs is made to help designers choose the best suitable DFT technique depending on their application. The comparison includes muxed D scan technique, clocked scan technique and enhanced scan technique. The comparison is done using ISCAS-89 benchmarks circuits. Points of comparisons include FPGA resources utilization, difficulty of designs bring-up, added delay by DFT logic and robust testable paths in each technique

Identifying worst case test vectors for FPGA exposed to total ionization dose using design for testability techniques

Electronic devices often operate in harsh environments which contain a variation of radiation sources. Radiation may cause different kinds of damage to proper operation of the devices. Their sources can be found in terrestrial environments, or in extra-terrestrial environments like in space, or in man-made radiation sources like nuclear reactors, biomedical devices and high energy particles physics experiments equipment. Depending on the operation environment of the device, the radiation resultant effect manifests in several forms like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). TID effect causes an increase in the delay and the leakage current of CMOS circuits which may damage the proper operation of the integrated circuit. To ensure proper operation of these devices under radiation, thorough testing must be made especially in critical applications like space and military applications. Although the standard which describes the procedure for testing electronic devices under radiation emphasizes the use of worst case test vectors (WCTVs), they are never used in radiation testing due to the difficulty of generating these vectors for circuits under test. For decades, design for testability (DFT) has been the best choice for test engineers to test digital circuits in industry. It has become a very mature technology that can be relied on. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Surprisingly, however, radiation testing has not yet made use of this reliable technology. In this thesis, a novel methodology is proposed to extend the usage of DFT to generate WCTVs for delay failure in Flash based field programmable gate arrays (FPGAs) exposed to total ionizing dose (TID). The methodology is validated using MicroSemi ProASIC3 FPGA and cobalt 60 facility

Testing of Asynchronous NULL Conventional Logic (NCL) Circuits

Due to the absence of a global clock and presence of more state holding elements that synchronize the control and data paths, conventional automatic test pattern generation (ATPG) algorithms would fail when applied to asynchronous circuits, leading to poor fault coverage. This paper focuses on design for test (DFT) techniques aimed at making asynchronous NCL designs testable using existing DFT CAD tools with reasonable gate overhead, by enhancing controllability of feedback nets and observability for fault sites that are flagged unobservable. The proposed approach performs scan and test points insertion on NCL designs using custom ATPG library. The approach has been automated, which is essential for large systems; and are fully compatible with industry standard tools

ASIC Technology Migrations: A Design Guide for First Pass Success

This thesis presents a study of Application Specific Integrated Circuit (ASIC) technology migrations. An overview of the design flow methodology used for completing a ASIC design from concept to silicon is presented. The design flow is then augmented with special considerations specifically for ASIC technology migrations. An ASIC technology migration design example, using the special considerations, is preseted. Finally, a summary is presented with considerations regarding future work

Exploring the Mysteries of System-Level Test

System-level test, or SLT, is an increasingly important process step in today's integrated circuit testing flows. Broadly speaking, SLT aims at executing functional workloads in operational modes. In this paper, we consolidate available knowledge about what SLT is precisely and why it is used despite its considerable costs and complexities. We discuss the types or failures covered by SLT, and outline approaches to quality assessment, test generation and root-cause diagnosis in the context of SLT. Observing that the theoretical understanding for all these questions has not yet reached the level of maturity of the more conventional structural and functional test methods, we outline new and promising directions for methodical developments leveraging on recent findings from software engineering.Comment: 7 pages, 2 figure

Design for testability method at register transfer level

The testing of sequential circuit is more complex compared to combinational circuit because it needs a sequence of vectors to detect a fault. Its test cost increases with the complexity of the sequential circuit-under-test (CUT). Thus, design for testability (DFT) concept has been introduced to reduce testing complexity, as well as to improve testing effectiveness and efficiency. Scan technique is one of the mostly used DFT method. However, it has cost overhead in terms of area due to the number of added multiplexers for each flip-flop, and test application time due to shifting of test patterns. This research is motivated to introduce non-scan DFT method at register transfer level (RTL) in order to reduce test cost. DFT at RTL level is done based on functional information of the CUT and the connectivity of CUT registers. The process of chaining a register to another register is more effective in terms of area overhead and test application time. The first contribution of this work is the introduction of a non-scan DFT method at the RTL level that considers the information of controllability and observability of CUT that can be extracted from RTL description. It has been proven through simulation that the proposed method has higher fault coverage of around 90%, shorter test application time, shorter test generation time and 10% reduction in area overhead compared to other methods in literature for most benchmark circuits. The second contribution of this work is the introduction of built-in self-test (BIST) method at the RTL level which uses multiple input signature registers (MISRs) as BIST components instead of concurrent built-in logic block observers (CBILBOs). The selection of MISR as test register is based on extended minimum feedback vertex set algorithm. This new BIST method results in lower area overhead by about 32.9% and achieves similar higher fault coverage compared to concurrent BIST method. The introduction of non-scan DFT at the RTL level is done before logic synthesis process. Thus, the testability violations can be fixed without repeating the logic synthesis process during DFT insertion at the RTL level

Secure Split Test for Preventing IC Piracy by Un-Trusted Foundry and Assembly

In the era of globalization, integrated circuit design and manufacturing is spread across different continents. This has posed several hardware intrinsic security issues. The issues are related to overproduction of chips without knowledge of designer or OEM, insertion of hardware Trojans at design and fabrication phase, faulty chips getting into markets from test centers, etc. In this thesis work, we have addressed the problem of counterfeit IC‟s getting into the market through test centers. The problem of counterfeit IC has different dimensions. Each problem related to counterfeiting has different solutions. Overbuilding of chips at overseas foundry can be addressed using passive or active metering. The solution to avoid faulty chips getting into open markets from overseas test centers is secure split test (SST). The further improvement to SST is also proposed by other researchers and is known as Connecticut Secure Split Test (CSST). In this work, we focus on improvements to CSST techniques in terms of security, test time and area. In this direction, we have designed all the required sub-blocks required for CSST architecture, namely, RSA, TRNG, Scrambler block, study of benchmark circuits like S38417, adding scan chains to benchmarks is done. Further, as a security measure, we add, XOR gate at the output of the scan chains to obfuscate the signal coming out of the scan chains. Further, we have improved the security of the design by using the PUF circuit instead of TRNG and avoid the use of the memory circuits. This use of PUF not only eliminates the use of memory circuits, but also it provides the way for functional testing also. We have carried out the hamming distance analysis for introduced security measure and results show that security design is reasonably good.Further, as a future work we can focus on: • Developing the circuit which is secuered for the whole semiconductor supply chain with reasonable hamming distance and less area overhead

Towards Open Scan for the Open-source Hardware

The open-source hardware IP model has recently started gaining popularity in the developer community. This model offers the integrated circuit (IC) developers wider standardization, faster time-to-market and richer platform for research. In addition, open-source hardware conforms to the Kerckhoff’s principle of a publicly-known algorithm and thus helps to enhance security. However, when security comes into consideration, source transparency is only one part of the solution. A complex global IC supply chain stands between the source and the final product. Hence, even if the source is known, the finished product is not guaranteed to match it. In this article, we propose the Open Scan model, in which, in addition to the source code, the IC vendor contributes a library-independent information on scan insertion. With scan information available, the user or a certification lab can perform partial reverse engineering of the IC to verify conformance to the advertised source. Compliance lists of open-source programs, such as of the OpenTitan cryptographic IC, can be amended to include this requirement. The Open Scan model addresses accidental and dishonest deviations from the golden model and partially addresses malicious modifications, known as hardware Trojans. We verify the efficiency of the proposed method in simulation with the Trust-Hub Trojan benchmarks and with several open-source benchmarks, in which we randomly insert modifications