Channel Characterization for Chip-scale Wireless Communications within Computing Packages

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses.Comment: To be presented 12th IEEE/ACM International Symposium on Networks-on-Chip (NOCS 2018); Torino, Italy; October 201

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

An Experimental Study of Reduced-Voltage Operation in Modern FPGAs for Neural Network Acceleration

We empirically evaluate an undervolting technique, i.e., underscaling the circuit supply voltage below the nominal level, to improve the power-efficiency of Convolutional Neural Network (CNN) accelerators mapped to Field Programmable Gate Arrays (FPGAs). Undervolting below a safe voltage level can lead to timing faults due to excessive circuit latency increase. We evaluate the reliability-power trade-off for such accelerators. Specifically, we experimentally study the reduced-voltage operation of multiple components of real FPGAs, characterize the corresponding reliability behavior of CNN accelerators, propose techniques to minimize the drawbacks of reduced-voltage operation, and combine undervolting with architectural CNN optimization techniques, i.e., quantization and pruning. We investigate the effect of environmental temperature on the reliability-power trade-off of such accelerators. We perform experiments on three identical samples of modern Xilinx ZCU102 FPGA platforms with five state-of-the-art image classification CNN benchmarks. This approach allows us to study the effects of our undervolting technique for both software and hardware variability. We achieve more than 3X power-efficiency (GOPs/W) gain via undervolting. 2.6X of this gain is the result of eliminating the voltage guardband region, i.e., the safe voltage region below the nominal level that is set by FPGA vendor to ensure correct functionality in worst-case environmental and circuit conditions. 43% of the power-efficiency gain is due to further undervolting below the guardband, which comes at the cost of accuracy loss in the CNN accelerator. We evaluate an effective frequency underscaling technique that prevents this accuracy loss, and find that it reduces the power-efficiency gain from 43% to 25%.Comment: To appear at the DSN 2020 conferenc

Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture

An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

Developing Efficient Discrete Simulations on Multicore and GPU Architectures

In this paper we show how to efficiently implement parallel discrete simulations on multicoreandGPUarchitecturesthrougharealexampleofanapplication: acellularautomatamodel of laser dynamics. We describe the techniques employed to build and optimize the implementations using OpenMP and CUDA frameworks. We have evaluated the performance on two different hardware platforms that represent different target market segments: high-end platforms for scientific computing, using an Intel Xeon Platinum 8259CL server with 48 cores, and also an NVIDIA Tesla V100GPU,bothrunningonAmazonWebServer(AWS)Cloud;and on a consumer-oriented platform, using an Intel Core i9 9900k CPU and an NVIDIA GeForce GTX 1050 TI GPU. Performance results were compared and analyzed in detail. We show that excellent performance and scalability can be obtained in both platforms, and we extract some important issues that imply a performance degradation for them. We also found that current multicore CPUs with large core numbers can bring a performance very near to that of GPUs, and even identical in some cases.Ministerio de Economía, Industria y Competitividad, Gobierno de España (MINECO), and the Agencia Estatal de Investigación (AEI) of Spain, cofinanced by FEDER funds (EU) TIN2017-89842

Thermal modeling and analysis of advanced 3D stacked structures

AbstractThe emerging three-dimensional integrated circuits (3D ICs) offer a promising solution to mitigate the barriers of interconnect scaling in modern systems. It also provides greater design flexibility by allowing heterogeneous integration. However, 3D technology exacerbates the on-chip thermal issues and increases packaging and cooling costs. In this work, a 3D thermal model of a stacked system is developed and thermal analysis is performed in order to analyze different workload conditions using finite element simulations. The steady-state heat transfer analysis on the 3D stacked structure has been performed in order to analyze the effect of variation of die power consumption, with and without hotspots, on temperature in different layers of the stack has been analyzed. We have also investigated the effect of the interaction of hotspots has on peak temperature

CATA: Criticality aware task acceleration for multicore processors

Managing criticality in task-based programming models opens a wide range of performance and power optimization opportunities in future manycore systems. Criticality aware task schedulers can benefit from these opportunities by scheduling tasks to the most appropriate cores. However, these schedulers may suffer from priority inversion and static binding problems that limit their expected improvements. Based on the observation that task criticality information can be exploited to drive hardware reconfigurations, we propose a Criticality Aware Task Acceleration (CATA) mechanism that dynamically adapts the computational power of a task depending on its criticality. As a result, CATA achieves significant improvements over a baseline static scheduler, reaching average improvements up to 18.4% in execution time and 30.1% in Energy-Delay Product (EDP) on a simulated 32-core system. The cost of reconfiguring hardware by means of a software-only solution rises with the number of cores due to lock contention and reconfiguration overhead. Therefore, novel architectural support is proposed to eliminate these overheads on future manycore systems. This architectural support minimally extends hardware structures already present in current processors, which allows further improvements in performance with negligible overhead. As a consequence, average improvements of up to 20.4% in execution time and 34.0% in EDP are obtained, outperforming state-of-the-art acceleration proposals not aware of task criticality.This work has been supported by the Spanish Government (grant SEV2015-0493, SEV-2011-00067 of the Severo Ochoa Program), by the Spanish Ministry of Science and Innovation (contracts TIN2015-65316, TIN2012-34557, TIN2013-46957-C2-2-P), by Generalitat de Catalunya (contracts 2014-SGR- 1051 and 2014-SGR-1272), by the RoMoL ERC Advanced Grant (GA 321253) and the European HiPEAC Network of Excellence. The Mont-Blanc project receives funding from the EU’s Seventh Framework Programme (FP7/2007-2013) under grant agreement no 610402 and from the EU’s H2020 Framework Programme (H2020/2014-2020) under grant agreement no 671697. M. Moret´o has been partially supported by the Ministry of Economy and Competitiveness under Juan de la Cierva postdoctoral fellowship number JCI-2012-15047. M. Casas is supported by the Secretary for Universities and Research of the Ministry of Economy and Knowledge of the Government of Catalonia and the Cofund programme of the Marie Curie Actions of the 7th R&D Framework Programme of the European Union (Contract 2013 BP B 00243). E. Castillo has been partially supported by the Spanish Ministry of Education, Culture and Sports under grant FPU2012/2254.Peer ReviewedPostprint (author's final draft

A Temperature and Reliability Oriented Simulation Framework for Multi-core Architectures

The increasing complexity of multi-core architectures demands for a comprehensive evaluation of different solutions and alternatives at every stage of the design process, considering different aspects at the same time. Simulation frameworks are attractive tools to fulfil this requirement, due to their flexibility. Nevertheless, state-of-the-art simulation frameworks lack a joint analysis of power, performance, temperature profile and reliability projection at system-level, focusing only on a specific aspect. This paper presents a comprehensive estimation framework that jointly exploits these design metrics at system-level, considering processing cores, interconnect design and storage elements. We describe the framework in details, and provide a set of experiments that highlight its capability and flexibility, focusing on temperature and reliability analysis of multi-core architectures supported by Network-on-Chip interconnect