Handling the complexity of routing problem in modern VLSI design

In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pins and ports of circuit gates and blocks. Traditionally, VLSI routing is an important design step in the sense that the quality of routing solution has great impact on various design metrics such as circuit timing, power consumption, chip reliability and manufacturability etc. As the advancing VLSI design enters the nanometer era, the routing success (routability issue) has been arising as one of the most critical problems in back-end design. In one aspect, the degree of design complexity is increasing dramatically as more and more modules are integrated into the chip. Much higher chip density leads to higher routing demands and potentially more risks in routing failure. In another aspect, with decreasing design feature size, there are more complex design rules imposed to ensure manufacturability. These design rules are hard to satisfy and they usually create more barriers for achieving routing closure (i.e., generate DRC free routing solution) and thus affect chip time to market (TTM) plan. In general, the behavior and performance of routing are affected by three consecutive phases: placement phase, global routing phase and detailed routing phase in a typical VLSI physical design flow. Traditional CAD tools handle each of the three phases independently and the global picture of the routability issue is neglected. Different from conventional approaches which propose tools and algorithms for one particular design phase, this thesis investigates the routability issue from all three phases and proposes a series of systematic solutions to build a more generic flow and improve quality of results (QoR). For the placement phase, we will introduce a mixed-sized placement refinement tool for alleviating congestion after placement. The tool shifts and relocates modules based on a global routing estimation. For the global routing phase, a very fast and effective global router is developed. Its performance surpasses many peer works as verified by ISPD 2008 global routing contest results. In the detailed routing phase, a tool is proposed to perform detailed routing using regular routing patterns based on a correct-by-construction methodology to improve routability as well as satisfy most design rules. Finally, the tool which integrates global routing and detailed routing is developed to remedy the inconsistency between global routing and detailed routing. To verify the algorithms we proposed, three sets of testcases derived from ISPD98 and ISPD05/06 placement benchmark suites are proposed. The results indicate that our proposed methods construct an integrated and systematic flow for routability improvement which is better than conventional methods

Hybrid FPGA: Architecture and Interface

Hybrid FPGAs (Field Programmable Gate Arrays) are composed of general-purpose logic resources with different granularities, together with domain-specific coarse-grained units. This thesis proposes a novel hybrid FPGA architecture with embedded coarse-grained Floating Point Units (FPUs) to improve the floating point capability of FPGAs. Based on the proposed hybrid FPGA architecture, we examine three aspects to optimise the speed and area for domain-specific applications. First, we examine the interface between large coarse-grained embedded blocks (EBs) and fine-grained elements in hybrid FPGAs. The interface includes parameters for varying: (1) aspect ratio of EBs, (2) position of the EBs in the FPGA, (3) I/O pins arrangement of EBs, (4) interconnect flexibility of EBs, and (5) location of additional embedded elements such as memory. Second, we examine the interconnect structure for hybrid FPGAs. We investigate how large and highdensity EBs affect the routing demand for hybrid FPGAs over a set of domain-specific applications. We then propose three routing optimisation methods to meet the additional routing demand introduced by large EBs: (1) identifying the best separation distance between EBs, (2) adding routing switches on EBs to increase routing flexibility, and (3) introducing wider channel width near the edge of EBs. We study and compare the trade-offs in delay, area and routability of these three optimisation methods. Finally, we employ common subgraph extraction to determine the number of floating point adders/subtractors, multipliers and wordblocks in the FPUs. The wordblocks include registers and can implement fixed point operations. We study the area, speed and utilisation trade-offs of the selected FPU subgraphs in a set of floating point benchmark circuits. We develop an optimised coarse-grained FPU, taking into account both architectural and system-level issues. Furthermore, we investigate the trade-offs between granularities and performance by composing small FPUs into a large FPU. The results of this thesis would help design a domain-specific hybrid FPGA to meet user requirements, by optimising for speed, area or a combination of speed and area

Algorithmic techniques for nanometer VLSI design and manufacturing closure

As Very Large Scale Integration (VLSI) technology moves to the nanoscale regime, design and manufacturing closure becomes very difficult to achieve due to increasing chip and power density. Imperfections due to process, voltage and temperature variations aggravate the problem. Uncertainty in electrical characteristic of individual device and wire may cause significant performance deviations or even functional failures. These impose tremendous challenges to the continuation of Moore's law as well as the growth of semiconductor industry. Efforts are needed in both deterministic design stage and variation-aware design stage. This research proposes various innovative algorithms to address both stages for obtaining a design with high frequency, low power and high robustness. For deterministic optimizations, new buffer insertion and gate sizing techniques are proposed. For variation-aware optimizations, new lithography-driven and post-silicon tuning-driven design techniques are proposed. For buffer insertion, a new slew buffering formulation is presented and is proved to be NP-hard. Despite this, a highly efficient algorithm which runs > 90x faster than the best alternatives is proposed. The algorithm is also extended to handle continuous buffer locations and blockages. For gate sizing, a new algorithm is proposed to handle discrete gate library in contrast to unrealistic continuous gate library assumed by most existing algorithms. Our approach is a continuous solution guided dynamic programming approach, which integrates the high solution quality of dynamic programming with the short runtime of rounding continuous solution. For lithography-driven optimization, the problem of cell placement considering manufacturability is studied. Three algorithms are proposed to handle cell flipping and relocation. They are based on dynamic programming and graph theoretic approaches, and can provide different tradeoff between variation reduction and wire- length increase. For post-silicon tuning-driven optimization, the problem of unified adaptivity optimization on logical and clock signal tuning is studied, which enables us to significantly save resources. The new algorithm is based on a novel linear programming formulation which is solved by an advanced robust linear programming technique. The continuous solution is then discretized using binary search accelerated dynamic programming, batch based optimization, and Latin Hypercube sampling based fast simulation

Floorplan-guided placement for large-scale mixed-size designs

In the nanometer scale era, placement has become an extremely challenging stage in modern Very-Large-Scale Integration (VLSI) designs. Millions of objects need to be placed legally within a chip region, while both the interconnection and object distribution have to be optimized simultaneously. Due to the extensive use of Intellectual Property (IP) and embedded memory blocks, a design usually contains tens or even hundreds of big macros. A design with big movable macros and numerous standard cells is known as mixed-size design. Due to the big size difference between big macros and standard cells, the placement of mixed-size designs is much more difficult than the standard-cell placement. This work presents an efficient and high-quality placement tool to handle modern large-scale mixed-size designs. This tool is developed based on a new placement algorithm flow. The main idea is to use the fixed-outline floorplanning algorithm to guide the state-of-the-art analytical placer. This new flow consists of four steps: 1) The objects in the original netlist are clustered into blocks; 2) Floorplanning is performed on the blocks; 3) The blocks are shifted within the chip region to further optimize the wirelength; 4) With big macro locations fixed, incremental placement is applied to place the remaining objects. Several key techniques are proposed to be used in the first two steps. These techniques are mainly focused on the following two aspects: 1) Hypergraph clustering algorithm that can cut down the original problem size without loss of placement Quality of Results (QoR); 2) Fixed-outline floorplanning algorithm that can provide a good guidance to the analytical placer at the global level. The effectiveness of each key technique is demonstrated by promising experimental results compared with the state-of-the-art algorithms. Moreover, using the industrial mixed-size designs, the new placement tool shows better performance than other existing approaches

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version

A framework for fine-grain synthesis optimization of operational amplifiers

This thesis presents a cell-level framework for Operational Amplifiers Synthesis (OASYN) coupling both circuit design and layout. For circuit design, the tool applies a corner-driven optimization, accounting for on-chip performance variations. By exploring the process, voltage, and temperature variations space, the tool extracts design worst case solution. The tool undergoes sensitivity analysis along with Pareto-optimality to achieve required specifications. For layout phase, OASYN generates a DRC proved automated layout based on a sized circuit-level description. Morata et al. (1996) introduced an elegant representation of block placement called sequence pair for general floorplans (SP). Like TCG and BSG, but unlike O-tree, B*tree, and CBL, SP is P-admissible. Unlike SP, TCG supports incremental update during operation and keeps the information of the boundary modules as well as their relative positions in the representation. Block placement algorithms that are based on SP use heuristic optimization algorithms, e.g., simulated annealing where generation of large number of sequence pairs are required. Therefore a fast algorithm is needed to generate sequence pairs after each solution perturbation. The thesis presents a new simple and efficient O(n) runtime algorithm for fast realization of incremental update for cost evaluation. The algorithm integrates sequence pair and transitive closure graph advantages into TCG-S* a superior topology update scheme which facilitates the search for optimum desired floorplan. Experiments show that TCG-S* is better than existing works in terms of area utilization and convergence speed. Routing-aware placement is implemented in OASYN, handling symmetry constraints, e.g., interdigitization, common centroid, along with congestion elimination and the enhancement of placement routability

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

DLWUC: Distance and Load Weight Updated Clustering-Based Clock Distribution for SOC Architecture

High-clock skew variations and degradation of driving ability of buffers lead to an additional power dissipation in Clock Distribution Network (CDN) that increases the dimensionality of buffers and coordination among flip-flops. The manual threshold level to predict the Region of Interest (ROI) is not applicable in clustering process due to the complexities of excessive wire length and critical delay. This paper proposes the Distance and Load Weight Updated Clustering (DLWUC) to determine the suitable position of logical components. Initially, the DLWUC utilizes the Hybrid Weighted Distance (HWD) to estimate the distance and construct the distance matrix. The weight value extracted from the sorted distance matrix facilitates the projection of buffers. The updated weight value serves as the base for clustering with labeled outputs. The placement of buffer at the suitable place from load weight updated clustering provides the necessary trade-off between clock provision and load balance. The DLWUC discussed in this paper reduces the size of buffers, skew, power and latency compared to the existing topologies

Lithography aware physical design and layout optimization for manufacturability

textAs technology continues to scale down, semiconductor manufacturing with 193nm lithography is greatly challenging because the required half pitch size is beyond the resolution limit. In order to bridge the gap between design requirements and manufacturing limitations, various resolution enhancement techniques have been proposed to avoid potentially problematic patterns and to improve product yield. In addition, co-optimization between design performance and manufacturability can further provide flexible and significant yield improvement, and it has become necessary for advanced technology nodes. This dissertation presents the methodologies to consider the lithography impact in different design stages to improve layout manufacturability. Double Patterning Lithography (DPL) has been a promising solution for sub-22nm node volume production. Among DPL techniques, self-aligned double patterning (SADP) provides good overlay controllability when two masks are not aligned perfectly. However, SADP process places several limitations on design flexibility and still exists many challenges in physical design stages. Starting from the early design stage, we analyze the standard cell designs and construct a set of SADP-aware cell placement candidates, and show that placement legalization based on this SADP awareness information can effectively resolve DPL conflicts. In the detailed routing stage, we propose a new routing cost formulation based on SADP-compliant routing guidelines, and achieve routing and layout decomposition simultaneously. In the case that limited routing perturbation is allowed, we propose a post-routing flow based on lithography simulation and lithography-aware design rules. Both routing methods, one in detailed routing stage and one in post routing stage, reduce DPL conflicts/violations significantly with negligible wire length impact. In the layout decomposition stage, layout modification is restricted and thus the manufacturability is even harder to guaranteed. By taking the advantage of complementary lithography, we present a new layout decomposition approach with e-beam cutting, which optimizes SADP overlay error and e-beam lithography throughput simultaneously. After the mask layout is defined, optical proximity correction (OPC) is one of the resolution enhancement techniques that is commonly required to compensate the image distortion from the lithography process. We propose an inverse lithography technique to solve the OPC problem considering design target and process window co-optimization. Our mask optimization is pixel based and thus can enable better contour fidelity. In the final physical verification stage, a complex and time-consuming lithography simulation needs to be performed to identify faulty patterns. We provide a classification method based on support vector machine and principle component analysis that detects lithographic hotspots efficiently and accurately.Electrical and Computer Engineerin

저전력 고성능 디지털 시스템을 위한 고신뢰도의 클럭 네트워크 설계 방법론

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2015. 8. 김태환.오늘날의 회로 설계에서 공정변이가 회로 클럭의 타이밍의 변이에 미치는 영향은 매우 커짐에 따라, 전통적으로 사용되던 클럭 트리 구조를 기반으로 한 클럭 네트워크를 사용하는 것은 한계에 부딪히게 되었고, 이를 극복하기 위한 여러가지 기술들이 제안되었다. 본 논문에서는 변이에 강한 클럭 네트워크를 설계하기 위해, 연구 및 사용되고 있는 세 가지 기술에 대해 소개하고, 이들을 개선한 연구들을 제안한다. 첫째로, 이 논문에서는 클럭의 타이밍 문제를 회로 제작 이후 단계에서 조정할 수 있는 포스트 실리콘 조정 클럭 버퍼를 배치하는 문제에 대해 서술한다. 포스트 실리콘 조정 버퍼는 클럭의 지연시간을 회로가 제작된 이후의 단계에서 조정하 여 클럭의 타이밍 문제를 해결할 수 있지만, 버퍼 자체의 크기 때문에 최소한의 개수만 가장 효율적인 위치에 배치해야 하는 문제가 있다. 본 논문에서는 이전의 연구가 회로의 수율을 계산할 때 시간이 많이 걸리는 몬테-카를로 시뮬레이션을 사용하기 때문에 탐색 가능한 포스트 실리콘 조정 버퍼의 배치가 제한되는 문제가 있음을 지적한 후, 기존에 제안되었던 그래프 기반 회로 수율 계산 기법을 사용하여 효율적인 포스트 실리콘 조정 버퍼 배치를 찾을 수 있는 점진적이고 체계적인 방법을 제시한다. 다음은 클럭 시차 스케쥴링 방법에 대한 연구를 서술한다. 최근의 연구에서 제안되었던, 플립-플롭의 클럭에서 출력까지의 딜레이가 클럭의 준비시간과 유지시간에 의존한다는 유연한 플립-플롭 타이밍 모델 연구는 기존의 플립-플롭의 타이밍 특성들이 고정된 값이라는 가정에 기반한 정적 타이밍 분석의 정확성 문제를 해결할 수 있는 중요한 연구이다. 본 논문에서는 새로운 모델을 고려하여, 이전에 고전적인 플립-플롭 타이밍 특성 모델을 기반으로 진행되었던 클럭 시차 스케쥴링의 최적화 문제를 유연한 플립-플롭 타이밍 모델을 고려하여 해결하였다. 본 연구에서는 주어진 회로의 준비시간과 유지시간의 여유시간을 반복적이고 체계적으로 최대화하여 문제를 해결하였다. 마지막으로 클럭 스파인 네트워크의 합성을 자동화하는 문제에 대해 서술한다. 전통적인 클럭 트리 구조가 공정변이 문제를 해결하지 못했기 때문에 클럭 메쉬를 포함하는 다양한 대안적 구조가 제안되었다. 클럭 메쉬의 경우 공정변이에 의한 클럭 시차를 줄일 수 있었지만 이를 위해 와이어나 버퍼 등의 자원을 많이 소모하는 문제를 가지고 있다. 두 구조의 중간적 구조에는 클럭 트리의 노드를 연결하는 크로스 링크를 삽입하는 구조와 클럭 스파인 구조가 있다. 클럭 트리에 점진적인 수정을 가하여 만드는 크로스 링크와 달리, 클럭 스파인 구조는 트리나 이후에 제안된 메쉬와는 완전히 별개의 구조로, 이를 합성하는 방법도 매우 다르다. 그렇기 때문에 클럭 스파인을 합성하는 알고리즘은 필수적이라고 할 수 있으나, 합성 방법론이나 이를 자동화하는 방법에 관한 연구는 아직 없다. 본 논문에서는 우선, 클럭-게이팅을 지원하는 클럭 스파인을 주어진 클럭 시차 및 클럭 슬루 조건을 만족하면서 자원 및 전력 소모량을 최소화하는 문제에 대해 서술한다. 그리고, 회로에서 주어진 플립-플롭들을 클럭-게이팅 조건에서의 연관성을 고려하고 조직화하여 클럭 스파인을 삽입한 후, 클럭 시차 및 슬루 조건을 고려하여 버퍼를 삽입하는 알고리즘을 제안한다. 요약하면, 본 논문에서는 클럭의 타이밍 문제를 해결하기 위해 포스트-실리콘 조정 클럭 버퍼를 사용하는 테크닉과 클럭 시차 스케쥴링을 유연한 플립-플롭 타이밍 모델에서 적용하는 테크닉을 제시하고, 클럭의 타이밍 문제와 전력 소모 문제를 한번에 해결하기 위한 새로운 클럭 스파인 네트워크를 합성하는 자동화 알고리즘을 제시한다.As the process variation is dominating to cause the clock timing variation among chips to be much large, conventional clock tree based clock network is not able to guarantee the timing constraint of a digital system. To overcome the limitations of traditional clock design techniques, various techniques have been studied. This dissertation addresses three techniques that have been widely used for designing robust clock network and proposes developed methods. First, it is widely accepted that post-silicon tunable (PST) clock buffers can effectively resolve the clock timing violation. Since PST buffers, which can reset the clock delay to flip-flops after the chip is manufactured, impose a non-trivial implementation area and control circuitry, it is very important to minimally allocate PST buffers while satisfying the chip yield constraint. In this dissertation, we (1) develop a graph-based chip yield computation technique which can update yields very efficiently and accurately for incremental PST buffer allocation, based on which we (2) propose a systematic (bottom-up and top-down with refinement) PST buffer allocation algorithm that is able to fully explore the design space of PST buffer allocation. Second, clock skew scheduling is one of the essential steps that must be carefully performed during the design process. This dissertation addresses the clock skew optimization problem integrated with the consideration of the interdependent relation between the setup and hold skews, and clk-to-Q delay of flip-flops, so that the time margin is more accurately and reliably set aside over that of the previous methods, which have never taken the integrated problem into account. Precisely, based on an accurate flexible model of setup skew, hold skew, and clk-to-Q delay, we propose a stepwise clock skew scheduling technique in which at each iteration, the worst slack of setup and hold skews is systematically and incrementally relaxed to maximally extend the time margin. Lastly, clock tree with cross links and clock spine have an intermediate characteristics for skew tolerance and power consumption, compared to clock tree and clock mesh which are two extreme structures of clock network. Unlike the clock tree with links between clock nodes, which is a sort of an incremental modification of the structure of clock tree, clock spine network is a completely separated structure from the structures of tree and mesh. Consequently, it is necessary and essential to develop a synthesis algorithm for clock spines, which will be compatible to the existing synthesis algorithms of clock trees and clock meshes. To this end, this dissertation first addresses the problem of automating the synthesis of clock-gated clock spines with the objective of minimizing total clock power while meeting the clock skew and slew constraints. The key idea of our proposed synthesis algorithm is to identify and group the flip-flops with tight correlation of clock-gating operations together to form a spine while accurately predicting and maintaining clock skew and slew variations through the buffer insertion and stub allocation. In summary, this dissertation presents clock tuning techniques with consideration of post-silicon tuning, flexible flip-flop timing model, and clock-gated clock spine synthesis algorithm.Abstract i Chapter 1 INTRODUCTION 1 1.1 Clock Distribution Network . . . . . . . . . . . . . . . . . . . . . 1 1.2 Process Variation . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.3 Flexible Flip-flop Timing Model . . . . . . . . . . . . . . . . . . . 3 1.4 Clock Spine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 Contributions of This Dissertation . . . . . . . . . . . . . . . . . 6 Chapter 2 POST-SILICON TUNABLE CLOCK BUFFER ALLOCATION BASED ON FAST CHIP YIELD COMPUTATION 8 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Systematic Exploration of PST Buffer Allocation . . . . . . . . . 10 2.2.1 Observations . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2.2 Problem Definition . . . . . . . . . . . . . . . . . . . . . . 15 2.2.3 Allocation Algorithm . . . . . . . . . . . . . . . . . . . . . 16 2.3 Fast Timing Yield Computation . . . . . . . . . . . . . . . . . . 17 2.3.1 Preliminaries . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.2 Incremental Yield Computation . . . . . . . . . . . . . . . 22 2.4 Experimental Result . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.5 PST Buffer Configuration Techniques . . . . . . . . . . . . . . . 31 2.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Chapter 3 POST-SILICON TUNING BASED ON FLEXIBLE FLIP-FLOP TIMING 34 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.2 Preliminary and Definitions . . . . . . . . . . . . . . . . . . . . . 40 3.2.1 Flexible Flip-Flop Timing Model . . . . . . . . . . . . . . 40 3.2.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.3 Motivational Examples . . . . . . . . . . . . . . . . . . . . . . . . 42 3.4 Clock Skew Scheduling for Slack Relaxation Based on Flexible Flip-Flop Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.4.1 Overall Flow . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.4.2 Finding Local Clock Skew Schedule . . . . . . . . . . . . 48 3.5 Experimental Results . . . . . . . . . . . . . . . . . . . . . . . . . 51 3.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Chapter 4 SYNTHESIS FOR POWER-AWARE CLOCK SPINES 61 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 4.2 Preliminaries and Motivation . . . . . . . . . . . . . . . . . . . . 64 4.2.1 Clock Spine . . . . . . . . . . . . . . . . . . . . . . . . . . 64 4.2.2 Activity Patterns . . . . . . . . . . . . . . . . . . . . . . . 67 4.2.3 Power Computation . . . . . . . . . . . . . . . . . . . . . 67 4.3 Algorithm for Clock Spine Synthesis . . . . . . . . . . . . . . . . 68 4.3.1 Problem Definition . . . . . . . . . . . . . . . . . . . . . . 68 4.3.2 Power-Aware Sink Clustering . . . . . . . . . . . . . . . . 70 4.3.3 Spine Relaxation . . . . . . . . . . . . . . . . . . . . . . . 77 4.3.4 Spine Buffer Allocation . . . . . . . . . . . . . . . . . . . 80 4.3.5 Top-Level Tree Construction . . . . . . . . . . . . . . . . 86 4.4 Experimental Results . . . . . . . . . . . . . . . . . . . . . . . . . 86 4.5 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Chapter 5 CONCLUSION 95 5.1 Chapter 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.2 Chapter 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.3 Chapter 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Bibliography 97 초록 106Docto