Resource-aware scheduling for 2D/3D multi-/many-core processor-memory systems

This dissertation addresses the complexities of 2D/3D multi-/many-core processor-memory systems, focusing on two key areas: enhancing timing predictability in real-time multi-core processors and optimizing performance within thermal constraints. The integration of an increasing number of transistors into compact chip designs, while boosting computational capacity, presents challenges in resource contention and thermal management. The first part of the thesis improves timing predictability. We enhance shared cache interference analysis for set-associative caches, advancing the calculation of Worst-Case Execution Time (WCET). This development enables accurate assessment of cache interference and the effectiveness of partitioned schedulers in real-world scenarios. We introduce TCPS, a novel task and cache-aware partitioned scheduler that optimizes cache partitioning based on task-specific WCET sensitivity, leading to improved schedulability and predictability. Our research explores various cache and scheduling configurations, providing insights into their performance trade-offs. The second part focuses on thermal management in 2D/3D many-core systems. Recognizing the limitations of Dynamic Voltage and Frequency Scaling (DVFS) in S-NUCA many-core processors, we propose synchronous thread migrations as a thermal management strategy. This approach culminates in the HotPotato scheduler, which balances performance and thermal safety. We also introduce 3D-TTP, a transient temperature-aware power budgeting strategy for 3D-stacked systems, reducing the need for Dynamic Thermal Management (DTM) activation. Finally, we present 3QUTM, a novel method for 3D-stacked systems that combines core DVFS and memory bank Low Power Modes with a learning algorithm, optimizing response times within thermal limits. This research contributes significantly to enhancing performance and thermal management in advanced processor-memory systems

Understanding the impact of 3D stacked layouts on ILP

Journal Article3D die-stacked chips can alleviate the penalties imposed by long wires within micro-processor circuits. Many recent studies have attempted to partition each microprocessor structure across three dimensions to reduce their access times. In this paper, we implement each microprocessor structure on a single 2D die and leverage 3D to reduce the lengths of wires that communicate data between microprocessor structures within a single core. We begin with a criticality analysis of inter-structure wire delays and show that for most tra- ditional simple superscalar cores, 2D floorplans are already very efficient at minimizing critical wire delays. For an aggressive wire-constrained clustered superscalar architecture, an exploration of the design space reveals that 3D can yield higher benefit. However, this benefit may be negated by the higher power density and temperature entailed by 3D integration. Overall, we report a negative result and argue against leveraging 3D for higher ILP

Modeling and optimization of high-performance many-core systems for energy-efficient and reliable computing

Thesis (Ph.D.)--Boston UniversityMany-core systems, ranging from small-scale many-core processors to large-scale high performance computing (HPC) data centers, have become the main trend in computing system design owing to their potential to deliver higher throughput per watt. However, power densities and temperatures increase following the growth in the performance capacity, and bring major challenges in energy efficiency, cooling costs, and reliability. These challenges require a joint assessment of performance, power, and temperature tradeoffs as well as the design of runtime optimization techniques that monitor and manage the interplay among them. This thesis proposes novel modeling and runtime management techniques that evaluate and optimize the performance, energy, and reliability of many-core systems. We first address the energy and thermal challenges in 3D-stacked many-core processors. 3D processors with stacked DRAM have the potential to dramatically improve performance owing to lower memory access latency and higher bandwidth. However, the performance increase may cause 3D systems to exceed the power budgets or create thermal hot spots. In order to provide an accurate analysis and enable the design of efficient management policies, this thesis introduces a simulation framework to jointly analyze performance, power, and temperature for 3D systems. We then propose a runtime optimization policy that maximizes the system performance by characterizing the application behavior and predicting the operating points that satisfy the power and thermal constraints. Our policy reduces the energy-delay product (EDP) by up to 61.9% compared to existing strategies. Performance, cooling energy, and reliability are also critical aspects in HPC data centers. In addition to causing reliability degradation, high temperatures increase the required cooling energy. Communication cost, on the other hand, has a significant impact on system performance in HPC data centers. This thesis proposes a topology-aware technique that maximizes system reliability by selecting between workload clustering and balancing. Our policy improves the system reliability by up to 123.3% compared to existing temperature balancing approaches. We also introduce a job allocation methodology to simultaneously optimize the communication cost and the cooling energy in a data center. Our policy reduces the cooling cost by 40% compared to cooling-aware and performance-aware policies, while achieving comparable performance to performance-aware policy

Leveraging 3D technology for improved reliability

Journal ArticleAggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower supply voltages have increased the vulnerability of computer systems towards transient faults. An increase in within-die and die-to-die parameter variations has also led to a greater number of dynamic timing errors. A potential solution to mitigate the impact of such errors is redundancy via an in-order checker processor. Emerging 3D performance as well as reduced power consumption because of shorter on-chip wires. In this paper, we leverage the "snap-on" functionality provided by 3D integration and propose implementing the redundant checker processor on a second die. This allows manufacturers to easily create a family of "reliable processors" without significantly impacting the cost or performance for customers that care less about reliability. We comprehensively evaluate design choices for this second die, including the effects of L2 cache organization, deep pipelining, and frequency. An interesting feature made possible by 3D integration is the incorporation of heterogeneous process technologies within a single chip

Optimizing communication and capacity in a 3D stacked reconfigurable cache hierarchy

Journal ArticleCache hierarchies in future many-core processors are expected to grow in size and contribute a large fraction of overall processor power and performance. In this paper, we postulate a 3D chip design that stacks SRAM and DRAM upon processing cores and employs OS-based page coloring to minimize horizontal communication of cache data. We then propose a heterogeneous reconfigurable cache design that takes advantage of the high density of DRAM and the superior power/delay characteristics of SRAM to efficiently meet the working set demands of each individual core. Finally, we analyze the communication patterns for such a processor and show that a tree topology is an ideal fit that significantly reduces the power and latency requirements of the on-chip network. The above proposals are synergistic: each proposal is made more compelling because of its combination with the other innovations described in this paper. The proposed reconfigurable cache model improves performance by up to 19% along with 48% savings in network power

Physically Dense Server Architectures.

Distributed, in-memory key-value stores have emerged as one of today's most important data center workloads. Being critical for the scalability of modern web services, vast resources are dedicated to key-value stores in order to ensure that quality of service guarantees are met. These resources include: many server racks to store terabytes of key-value data, the power necessary to run all of the machines, networking equipment and bandwidth, and the data center warehouses used to house the racks. There is, however, a mismatch between the key-value store software and the commodity servers on which it is run, leading to inefficient use of resources. The primary cause of inefficiency is the overhead incurred from processing individual network packets, which typically carry small payloads, and require minimal compute resources. Thus, one of the key challenges as we enter the exascale era is how to best adjust to the paradigm shift from compute-centric to storage-centric data centers. This dissertation presents a hardware/software solution that addresses the inefficiency issues present in the modern data centers on which key-value stores are currently deployed. First, it proposes two physical server designs, both of which use 3D-stacking technology and low-power CPUs to improve density and efficiency. The first 3D architecture---Mercury---consists of stacks of low-power CPUs with 3D-stacked DRAM. The second architecture---Iridium---replaces DRAM with 3D NAND Flash to improve density. The second portion of this dissertation proposes and enhanced version of the Mercury server design---called KeyVault---that incorporates integrated, zero-copy network interfaces along with an integrated switching fabric. In order to utilize the integrated networking hardware, as well as reduce the response time of requests, a custom networking protocol is proposed. Unlike prior works on accelerating key-value stores---e.g., by completely bypassing the CPU and OS when processing requests---this work only bypasses the CPU and OS when placing network payloads into a process' memory. The insight behind this is that because most of the overhead comes from processing packets in the OS kernel---and not the request processing itself---direct placement of packet's payload is sufficient to provide higher throughput and lower latency than prior approaches.PhDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111414/1/atgutier_1.pd

Performance Characterization of Multi-threaded Graph Processing Applications on Intel Many-Integrated-Core Architecture

Intel Xeon Phi many-integrated-core (MIC) architectures usher in a new era of terascale integration. Among emerging killer applications, parallel graph processing has been a critical technique to analyze connected data. In this paper, we empirically evaluate various computing platforms including an Intel Xeon E5 CPU, a Nvidia Geforce GTX1070 GPU and an Xeon Phi 7210 processor codenamed Knights Landing (KNL) in the domain of parallel graph processing. We show that the KNL gains encouraging performance when processing graphs, so that it can become a promising solution to accelerating multi-threaded graph applications. We further characterize the impact of KNL architectural enhancements on the performance of a state-of-the art graph framework.We have four key observations: 1 Different graph applications require distinctive numbers of threads to reach the peak performance. For the same application, various datasets need even different numbers of threads to achieve the best performance. 2 Only a few graph applications benefit from the high bandwidth MCDRAM, while others favor the low latency DDR4 DRAM. 3 Vector processing units executing AVX512 SIMD instructions on KNLs are underutilized when running the state-of-the-art graph framework. 4 The sub-NUMA cache clustering mode offering the lowest local memory access latency hurts the performance of graph benchmarks that are lack of NUMA awareness. At last, We suggest future works including system auto-tuning tools and graph framework optimizations to fully exploit the potential of KNL for parallel graph processing.Comment: published as L. Jiang, L. Chen and J. Qiu, "Performance Characterization of Multi-threaded Graph Processing Applications on Many-Integrated-Core Architecture," 2018 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS), Belfast, United Kingdom, 2018, pp. 199-20

DAMOV: A New Methodology and Benchmark Suite for Evaluating Data Movement Bottlenecks

Data movement between the CPU and main memory is a first-order obstacle against improving performance, scalability, and energy efficiency in modern systems. Computer systems employ a range of techniques to reduce overheads tied to data movement, spanning from traditional mechanisms (e.g., deep multi-level cache hierarchies, aggressive hardware prefetchers) to emerging techniques such as Near-Data Processing (NDP), where some computation is moved close to memory. Our goal is to methodically identify potential sources of data movement over a broad set of applications and to comprehensively compare traditional compute-centric data movement mitigation techniques to more memory-centric techniques, thereby developing a rigorous understanding of the best techniques to mitigate each source of data movement. With this goal in mind, we perform the first large-scale characterization of a wide variety of applications, across a wide range of application domains, to identify fundamental program properties that lead to data movement to/from main memory. We develop the first systematic methodology to classify applications based on the sources contributing to data movement bottlenecks. From our large-scale characterization of 77K functions across 345 applications, we select 144 functions to form the first open-source benchmark suite (DAMOV) for main memory data movement studies. We select a diverse range of functions that (1) represent different types of data movement bottlenecks, and (2) come from a wide range of application domains. Using NDP as a case study, we identify new insights about the different data movement bottlenecks and use these insights to determine the most suitable data movement mitigation mechanism for a particular application. We open-source DAMOV and the complete source code for our new characterization methodology at https://github.com/CMU-SAFARI/DAMOV.Comment: Our open source software is available at https://github.com/CMU-SAFARI/DAMO