Designs for increasing reliability while reducing energy and increasing lifetime

In the last decades, the computing technology experienced tremendous developments. For instance, transistors' feature size shrank to half at every two years as consistently from the first time Moore stated his law. Consequently, number of transistors and core count per chip doubles at each generation. Similarly, petascale systems that have the capability of processing more than one billion calculation per second have been developed. As a matter of fact, exascale systems are predicted to be available at year 2020. However, these developments in computer systems face a reliability wall. For instance, transistor feature sizes are getting so small that it becomes easier for high-energy particles to temporarily flip the state of a memory cell from 1-to-0 or 0-to-1. Also, even if we assume that fault-rate per transistor stays constant with scaling, the increase in total transistor and core count per chip will significantly increase the number of faults for future desktop and exascale systems. Moreover, circuit ageing is exacerbated due to increased manufacturing variability and thermal stresses, therefore, lifetime of processor structures are becoming shorter. On the other side, due to the limited power budget of the computer systems such that mobile devices, it is attractive to scale down the voltage. However, when the voltage level scales to beyond the safe margin especially to the ultra-low level, the error rate increases drastically. Nevertheless, new memory technologies such as NAND flashes present only limited amount of nominal lifetime, and when they exceed this lifetime, they can not guarantee storing of the data correctly leading to data retention problems. Due to these issues, reliability became a first-class design constraint for contemporary computing in addition to power and performance. Moreover, reliability even plays increasingly important role when computer systems process sensitive and life-critical information such as health records, financial information, power regulation, transportation, etc. In this thesis, we present several different reliability designs for detecting and correcting errors occurring in processor pipelines, L1 caches and non-volatile NAND flash memories due to various reasons. We design reliability solutions in order to serve three main purposes. Our first goal is to improve the reliability of computer systems by detecting and correcting random and non-predictable errors such as bit flips or ageing errors. Second, we aim to reduce the energy consumption of the computer systems by allowing them to operate reliably at ultra-low voltage level. Third, we target to increase the lifetime of new memory technologies by implementing efficient and low-cost reliability schemes

Flash Memory Devices

Flash memory devices have represented a breakthrough in storage since their inception in the mid-1980s, and innovation is still ongoing. The peculiarity of such technology is an inherent flexibility in terms of performance and integration density according to the architecture devised for integration. The NOR Flash technology is still the workhorse of many code storage applications in the embedded world, ranging from microcontrollers for automotive environment to IoT smart devices. Their usage is also forecasted to be fundamental in emerging AI edge scenario. On the contrary, when massive data storage is required, NAND Flash memories are necessary to have in a system. You can find NAND Flash in USB sticks, cards, but most of all in Solid-State Drives (SSDs). Since SSDs are extremely demanding in terms of storage capacity, they fueled a new wave of innovation, namely the 3D architecture. Today “3D” means that multiple layers of memory cells are manufactured within the same piece of silicon, easily reaching a terabit capacity. So far, Flash architectures have always been based on "floating gate," where the information is stored by injecting electrons in a piece of polysilicon surrounded by oxide. On the contrary, emerging concepts are based on "charge trap" cells. In summary, flash memory devices represent the largest landscape of storage devices, and we expect more advancements in the coming years. This will require a lot of innovation in process technology, materials, circuit design, flash management algorithms, Error Correction Code and, finally, system co-design for new applications such as AI and security enforcement

Architectural Techniques for Disturbance Mitigation in Future Memory Systems

With the recent advancements of CMOS technology, scaling down the feature size has improved memory capacity, power, performance and cost. However, such dramatic progress in memory technology has increasingly made the precise control of the manufacturing process below 22nm more difficult. In spite of all these virtues, the technology scaling road map predicts significant process variation from cell-to-cell. It also predicts electromagnetic disturbances among memory cells that easily deviate their circuit characterizations from design goals and pose threats to the reliability, energy efficiency and security. This dissertation proposes simple, energy-efficient and low-overhead techniques that combat the challenges resulting from technology scaling in future memory systems. Specifically, this dissertation investigates solutions tuned to particular types of disturbance challenges, such as inter-cell or intra-cell disturbance, that are energy efficient while guaranteeing memory reliability. The contribution of this dissertation will be threefold. First, it uses a deterministic counter-based approach to target the root of inter-cell disturbances in Dynamic random access memory (DRAM) and provide further benefits to overall energy consumption while deterministically mitigating inter-cell disturbances. Second, it uses Markov chains to reason about the reliability of Spin-Transfer Torque Magnetic Random-Access Memory (STT-RAM) that suffers from intra-cell disturbances and then investigates on-demand refresh policies to recover from the persistent effect of such disturbances. Third, It leverages an encoding technique integrated with a novel word level compression scheme to reduce the vulnerability of cells to inter-cell write disturbances in Phase Change Memory (PCM). However, mitigating inter-cell write disturbances and also minimizing the write energy may increase the number of updated PCM cells and result in degraded endurance. Hence, It uses multi-objective optimization to balance the write energy and endurance in PCM cells while mitigating intercell disturbances. The work in this dissertation provides important insights into how to tackle the critical reliability challenges that high-density memory systems confront in deep scaled technology nodes. It advocates for various memory technologies to guarantee reliability of future memory systems while incurring nominal costs in terms of energy, area and performance

Achieving Reliable and Sustainable Next-Generation Memories

Conventional memory technology scaling has introduced reliability challenges due to dysfunctional, improperly formed cells and crosstalk from increased cell proximity. Furthermore, as the manufacturing effort becomes increasingly complex due to these deeply scaled technologies, holistic sustainability is negatively impacted. The development of new memory technologies can help overcome the capacitor scaling limitations of DRAM. However, these technologies have their own reliability concerns, such as limited write endurance in the case of Phase Change Memories (PCM). Moreover, emerging system requirements, such as in-memory encryption to protect sensitive or private data and operation in harsh environments create additional challenges that must be addressed in the context of reliability and sustainability. This dissertation provides new multifactor and ultimately unified solutions to address many of these concerns in the same system. In particular, my contributions toward mitigating these issues are as follows. I present GreenChip and GreenAsic, which together provide the first tools to holistically evaluate new computer architecture, chip, and memory design concepts for sustainability. These tools provide detailed estimates of manufacturing and operational-phase metrics for different computing workloads and deployment scenarios. Using GreenChip, I examined existing DRAM reliability techniques in the context of their holistic sustainability impact, including my own technique to mitigate bitline crosstalk. For PCM, I provided a new reliability technique with no additional storage overhead that substantially increases the lifetime of an encrypted memory system. To provide bit-level error correction, I developed compact linked-list and Bloom-filter-based bit-level fault map structures, that provide unprecedented levels of error tabulation, combined with my own novel error correction and lifetime extension approaches based on these maps for less area than traditional ECC. In particular, FaME, can correct N faults using N bits when utilizing a bit-level fault map. For operation in harsh environments, I created a triple modular redundancy (TMR) pointer-based fault map, HOTH, which specifically protects cells shown to be weak to radiation. Finally, to combine the analyses of holistic sustainability and memory lifetime, I created the LARS technique, which adjusts the GreenChip indifference analysis to account for the additional sustainability benefit provided by increased reliability and lifetime

The design and analysis of novel integrated phase-change photonic memory and computing devices

The current massive growth in data generation and communication challenges traditional computing and storage paradigms. The integrated silicon photonic platform may alleviate the physical limitations resulting from the use of electrical interconnects and the conventional von Neuman computing architecture, due to its intrinsic energy and bandwidth advantages. This work focuses on the development of the phase-change all-photonic memory (PPCM), a device potentially enabling the transition from the electrical to the optical domain by providing the (previously unavailable) non-volatile all-photonic storage functionality. PPCM devices allow for all-optical encoding of the information on the crystal fraction of a waveguide-implemented phase-change material layer, here Ge2Sb2Te5, which in turn modulates the transmitted signal amplitude. This thesis reports novel developments of the numerical methods necessary to emulate the physics of PPCM device operation and performance characteristics, illustrating solutions enabling the realization of a simulation framework modelling the inherently three-dimensional and self-influencing optical, thermal and phase-switching behaviour of PPCM devices. This thesis also depicts an innovative, fast and cost-effective method to characterise the key optical properties of phase-change materials (upon which the performance of PPCM devices depend), exploiting the reflection pattern of a purposely built layer stack, combined with a smart fit algorithm adapting potential solutions drawn from the scientific literature. The simulation framework developed in the thesis is used to analyse reported PPCM experimental results. Numerous sources of uncertainty are underlined, whose systematic analysis reduced to the peculiar non-linear optical properties of Ge2Sb2Te5. Yet, the data fit process validates both the simulation tool and the remaining physical assumptions, as the model captures the key aspects of the PPCM at high optical intensity, and reliably and accurately predicts its behaviour at low intensity, enabling to investigate its underpinning physical mechanisms. Finally, a novel PPCM memory architecture, exploiting the interaction of a much-reduced Ge2Sb2Te5 volume with a plasmonic resonant nanoantenna, is proposed and numerically investigated. The architecture concept is described and the memory functionality is demonstrated, underlining its potential energy and speed improvement on the conventional device by up to two orders of magnitude.Engineering and Physical Sciences Research Council (EPSRC