Adjusting Laser Injections for Fully Controlled Faults

Hardware characterizations of integrated circuits have been evolving rapidly with the advent of more precise, sophisticated and cost-efficient tools. In this paper we describe how the fine tuning of a laser source has been used to characterize, set and reset the state of registers in a 90 nm chip. By adjusting the incident laser beam’s location, it is possible to choose to switch any register value from ‘ 0 ’ to ‘ 1 ’ or vice-versa by targeting the PMOS side or the NMOS side. Plus, we show how to clear a register by selecting a laser beam’s power. With the help of imaging techniques, we are able to explain the underlying phenomenon and provide a direct link between the laser mapping and the physical gate structure. Thus, we correlate the localization of laser fault injections with implementations of the PMOS and NMOS areas in the silicon substrate. This illustrates to what extent laser beams can be used to monitor the bits stored within registers, with adverse consequences in terms of security evaluation of integrated circuits

Error Detection and Diagnosis for System-on-Chip in Space Applications

Tesis por compendio de publicacionesLos componentes electrónicos comerciales, comúnmente llamados componentes Commercial-Off-The-Shelf (COTS) están presentes en multitud de dispositivos habituales en nuestro día a día. Particularmente, el uso de microprocesadores y sistemas en chip (SoC) altamente integrados ha favorecido la aparición de dispositivos electrónicos cada vez más inteligentes que sostienen el estilo de vida y el avance de la sociedad moderna. Su uso se ha generalizado incluso en aquellos sistemas que se consideran críticos para la seguridad, como vehículos, aviones, armamento, dispositivos médicos, implantes o centrales eléctricas. En cualquiera de ellos, un fallo podría tener graves consecuencias humanas o económicas. Sin embargo, todos los sistemas electrónicos conviven constantemente con factores internos y externos que pueden provocar fallos en su funcionamiento. La capacidad de un sistema para funcionar correctamente en presencia de fallos se denomina tolerancia a fallos, y es un requisito en el diseño y operación de sistemas críticos. Los vehículos espaciales como satélites o naves espaciales también hacen uso de microprocesadores para operar de forma autónoma o semi autónoma durante su vida útil, con la dificultad añadida de que no pueden ser reparados en órbita, por lo que se consideran sistemas críticos. Además, las duras condiciones existentes en el espacio, y en particular los efectos de la radiación, suponen un gran desafío para el correcto funcionamiento de los dispositivos electrónicos. Concretamente, los fallos transitorios provocados por radiación (conocidos como soft errors) tienen el potencial de ser una de las mayores amenazas para la fiabilidad de un sistema en el espacio. Las misiones espaciales de gran envergadura, típicamente financiadas públicamente como en el caso de la NASA o la Agencia Espacial Europea (ESA), han tenido históricamente como requisito evitar el riesgo a toda costa por encima de cualquier restricción de coste o plazo. Por ello, la selección de componentes resistentes a la radiación (rad-hard) específicamente diseñados para su uso en el espacio ha sido la metodología imperante en el paradigma que hoy podemos denominar industria espacial tradicional, u Old Space. Sin embargo, los componentes rad-hard tienen habitualmente un coste mucho más alto y unas prestaciones mucho menores que otros componentes COTS equivalentes. De hecho, los componentes COTS ya han sido utilizados satisfactoriamente en misiones de la NASA o la ESA cuando las prestaciones requeridas por la misión no podían ser cubiertas por ningún componente rad-hard existente. En los últimos años, el acceso al espacio se está facilitando debido en gran parte a la entrada de empresas privadas en la industria espacial. Estas empresas no siempre buscan evitar el riesgo a toda costa, sino que deben perseguir una rentabilidad económica, por lo que hacen un balance entre riesgo, coste y plazo mediante gestión del riesgo en un paradigma denominado Nuevo Espacio o New Space. Estas empresas a menudo están interesadas en entregar servicios basados en el espacio con las máximas prestaciones y el mayor beneficio posibles, para lo cual los componentes rad-hard son menos atractivos debido a su mayor coste y menores prestaciones que los componentes COTS existentes. Sin embargo, los componentes COTS no han sido específicamente diseñados para su uso en el espacio y típicamente no incluyen técnicas específicas para evitar que los efectos de la radiación afecten su funcionamiento. Los componentes COTS se comercializan tal cual son, y habitualmente no es posible modificarlos para mejorar su resistencia a la radiación. Además, los elevados niveles de integración de los sistemas en chip (SoC) complejos de altas prestaciones dificultan su observación y la aplicación de técnicas de tolerancia a fallos. Este problema es especialmente relevante en el caso de los microprocesadores. Por tanto, existe un gran interés en el desarrollo de técnicas que permitan conocer y mejorar el comportamiento de los microprocesadores COTS bajo radiación sin modificar su arquitectura y sin interferir en su funcionamiento para facilitar su uso en el espacio y con ello maximizar las prestaciones de las misiones espaciales presentes y futuras. En esta Tesis se han desarrollado técnicas novedosas para detectar, diagnosticar y mitigar los errores producidos por radiación en microprocesadores y sistemas en chip (SoC) comerciales, utilizando la interfaz de traza como punto de observación. La interfaz de traza es un recurso habitual en los microprocesadores modernos, principalmente enfocado a soportar las tareas de desarrollo y depuración del software durante la fase de diseño. Sin embargo, una vez el desarrollo ha concluido, la interfaz de traza típicamente no se utiliza durante la fase operativa del sistema, por lo que puede ser reutilizada sin coste. La interfaz de traza constituye un punto de conexión viable para observar el comportamiento de un microprocesador de forma no intrusiva y sin interferir en su funcionamiento. Como resultado de esta Tesis se ha desarrollado un módulo IP capaz de recabar y decodificar la información de traza de un microprocesador COTS moderno de altas prestaciones. El IP es altamente configurable y personalizable para adaptarse a diferentes aplicaciones y tipos de procesadores. Ha sido diseñado y validado utilizando el dispositivo Zynq-7000 de Xilinx como plataforma de desarrollo, que constituye un dispositivo COTS de interés en la industria espacial. Este dispositivo incluye un procesador ARM Cortex-A9 de doble núcleo, que es representativo del conjunto de microprocesadores hard-core modernos de altas prestaciones. El IP resultante es compatible con la tecnología ARM CoreSight, que proporciona acceso a información de traza en los microprocesadores ARM. El IP incorpora técnicas para detectar errores en el flujo de ejecución y en los datos de la aplicación ejecutada utilizando la información de traza, en tiempo real y con muy baja latencia. El IP se ha validado en campañas de inyección de fallos y también en radiación con protones y neutrones en instalaciones especializadas. También se ha combinado con otras técnicas de tolerancia a fallos para construir técnicas híbridas de mitigación de errores. Los resultados experimentales obtenidos demuestran su alta capacidad de detección y potencialidad en el diagnóstico de errores producidos por radiación. El resultado de esta Tesis, desarrollada en el marco de un Doctorado Industrial entre la Universidad Carlos III de Madrid (UC3M) y la empresa Arquimea, se ha transferido satisfactoriamente al entorno empresarial en forma de un proyecto financiado por la Agencia Espacial Europea para continuar su desarrollo y posterior explotación.Commercial electronic components, also known as Commercial-Off-The-Shelf (COTS), are present in a wide variety of devices commonly used in our daily life. Particularly, the use of microprocessors and highly integrated System-on-Chip (SoC) devices has fostered the advent of increasingly intelligent electronic devices which sustain the lifestyles and the progress of modern society. Microprocessors are present even in safety-critical systems, such as vehicles, planes, weapons, medical devices, implants, or power plants. In any of these cases, a fault could involve severe human or economic consequences. However, every electronic system deals continuously with internal and external factors that could provoke faults in its operation. The capacity of a system to operate correctly in presence of faults is known as fault-tolerance, and it becomes a requirement in the design and operation of critical systems. Space vehicles such as satellites or spacecraft also incorporate microprocessors to operate autonomously or semi-autonomously during their service life, with the additional difficulty that they cannot be repaired once in-orbit, so they are considered critical systems. In addition, the harsh conditions in space, and specifically radiation effects, involve a big challenge for the correct operation of electronic devices. In particular, radiation-induced soft errors have the potential to become one of the major risks for the reliability of systems in space. Large space missions, typically publicly funded as in the case of NASA or European Space Agency (ESA), have followed historically the requirement to avoid the risk at any expense, regardless of any cost or schedule restriction. Because of that, the selection of radiation-resistant components (known as rad-hard) specifically designed to be used in space has been the dominant methodology in the paradigm of traditional space industry, also known as “Old Space”. However, rad-hard components have commonly a much higher associated cost and much lower performance that other equivalent COTS devices. In fact, COTS components have already been used successfully by NASA and ESA in missions that requested such high performance that could not be satisfied by any available rad-hard component. In the recent years, the access to space is being facilitated in part due to the irruption of private companies in the space industry. Such companies do not always seek to avoid the risk at any cost, but they must pursue profitability, so they perform a trade-off between risk, cost, and schedule through risk management in a paradigm known as “New Space”. Private companies are often interested in deliver space-based services with the maximum performance and maximum benefit as possible. With such objective, rad-hard components are less attractive than COTS due to their higher cost and lower performance. However, COTS components have not been specifically designed to be used in space and typically they do not include specific techniques to avoid or mitigate the radiation effects in their operation. COTS components are commercialized “as is”, so it is not possible to modify them to improve their susceptibility to radiation effects. Moreover, the high levels of integration of complex, high-performance SoC devices hinder their observability and the application of fault-tolerance techniques. This problem is especially relevant in the case of microprocessors. Thus, there is a growing interest in the development of techniques allowing to understand and improve the behavior of COTS microprocessors under radiation without modifying their architecture and without interfering with their operation. Such techniques may facilitate the use of COTS components in space and maximize the performance of present and future space missions. In this Thesis, novel techniques have been developed to detect, diagnose, and mitigate radiation-induced errors in COTS microprocessors and SoCs using the trace interface as an observation point. The trace interface is a resource commonly found in modern microprocessors, mainly intended to support software development and debugging activities during the design phase. However, it is commonly left unused during the operational phase of the system, so it can be reused with no cost. The trace interface constitutes a feasible connection point to observe microprocessor behavior in a non-intrusive manner and without disturbing processor operation. As a result of this Thesis, an IP module has been developed capable to gather and decode the trace information of a modern, high-end, COTS microprocessor. The IP is highly configurable and customizable to support different applications and processor types. The IP has been designed and validated using the Xilinx Zynq-7000 device as a development platform, which is an interesting COTS device for the space industry. This device features a dual-core ARM Cortex-A9 processor, which is a good representative of modern, high-end, hard-core microprocessors. The resulting IP is compatible with the ARM CoreSight technology, which enables access to trace information in ARM microprocessors. The IP is able to detect errors in the execution flow of the microprocessor and in the application data using trace information, in real time and with very low latency. The IP has been validated in fault injection campaigns and also under proton and neutron irradiation campaigns in specialized facilities. It has also been combined with other fault-tolerance techniques to build hybrid error mitigation approaches. Experimental results demonstrate its high detection capabilities and high potential for the diagnosis of radiation-induced errors. The result of this Thesis, developed in the framework of an Industrial Ph.D. between the University Carlos III of Madrid (UC3M) and the company Arquimea, has been successfully transferred to the company business as a project sponsored by European Space Agency to continue its development and subsequent commercialization.Programa de Doctorado en Ingeniería Eléctrica, Electrónica y Automática por la Universidad Carlos III de MadridPresidenta: María Luisa López Vallejo.- Secretario: Enrique San Millán Heredia.- Vocal: Luigi Di Lill

Software countermeasures for control flow integrity of smart card C codes

International audienceFault attacks can target smart card programs in order to disrupt an execution and gain an advantage over the data or the embedded functionalities. Among all possible attacks, control flow attacks aim at disrupting the normal execution flow. Identifying harmful control flow attacks as well as designing countermeasures at software level are tedious and tricky for developers. In this paper, we propose a methodology to detect harmful intra-procedural jump attacks at source code level and to automatically inject formally-proven countermeasures. The proposed software countermeasures defeat 100% of attacks that jump over at least two C source code statements or beyond. Experiments show that the resulting code is also hardened against unexpected function calls and jump attacks at assembly level

Investigation of radiation-hardened design of electronic systems with applications to post-accident monitoring for nuclear power plants

This research aims at improving the robustness of electronic systems used-in high level radiation environments by combining with radiation-hardened (rad-hardened) design and fault-tolerant techniques based on commercial off-the-shelf (COTS) components. A specific of the research is to use such systems for wireless post-accident monitoring in nuclear power plants (NPPs). More specifically, the following methods and systems are developed and investigated to accomplish expected research objectives: analysis of radiation responses, design of a radiation-tolerant system, implementation of a wireless post-accident monitoring system for NPPs, performance evaluation without repeat physical tests, and experimental validation in a radiation environment. A method is developed to analyze ionizing radiation responses of COTS-based devices and circuits in various radiation conditions, which can be applied to design circuits robust to ionizing radiation effects without repeated destructive tests in a physical radiation environment. Some mathematical models of semiconductor devices for post-irradiation conditions are investigated, and their radiation responses are analyzed using Technology Computer Aided Design (TCAD) simulator. Those models are then used in the analysis of circuits and systems under radiation condition. Based on the simulation results, method of rapid power off may be effectively to protect electronic systems under ionizing radiation. It can be a potential solution to mitigate damages of electronic components caused by radiation. With simulation studies of photocurrent responses of semiconductor devices, two methods are presented to mitigate the damages of total ionizing dose: component selection and radiation shielding protection. According to the investigation of radiation-tolerance of regular COTS components, most COTS-based semiconductor components may experience performance degradation and radiation damages when the total dose is greater than 20 K Rad (Si). A principle of component selection is given to obtain the suitable components, as well as a method is proposed to assess the component reliability under radiation environments, which uses radiation degradation factors, instead of the usual failure rate data in the reliability model. Radiation degradation factor is as the input to describe the radiation response of a component under a total radiation dose. In addition, a number of typical semiconductor components are also selected as the candidate components for the application of wireless monitoring in nuclear power plants. On the other hand, a multi-layer shielding protection is used to reduce the total dose to be less than 20 K Rad (Si) for a given radiation condition; the selected semiconductor devices can then survive in the radiation condition with the reduced total dose. The calculation method of required shielding thickness is also proposed to achieve the design objectives. Several shielding solutions are also developed and compared for applications in wireless monitoring system in nuclear power plants. A radiation-tolerant architecture is proposed to allow COTS-based electronic systems to be used in high-level radiation environments without using rad-hardened components. Regular COTS components are used with some fault-tolerant techniques to mitigate damages of the system through redundancy, online fault detection, real-time preventive remedial actions, and rapid power off. The functions of measurement, processing, communication, and fault-tolerance are integrated locally within all channels without additional detection units. A hardware emulation bench with redundant channels is constructed to verify the effectiveness of the developed radiation-tolerant architecture. Experimental results have shown that the developed architecture works effectively and redundant channels can switch smoothly in 500 milliseconds or less when a single fault or multiple faults occur. An online mechanism is also investigated to timely detect and diagnose radiation damages in the developed redundant architecture for its radiation tolerance enhancement. This is implemented by the built-in-test technique. A number of tests by using fault injection techniques have been carried out in the developed hardware emulation bench to validate the proposed detection mechanism. The test results have shown that faults and errors can be effectively detected and diagnosed. For the developed redundant wireless devices under given radiation dose (20 K Rad (Si)), the fault detection coverage is about 62.11%. This level of protection could be improved further by putting more resources (CPU consumption, etc.) into the function of fault detection, but the cost will increase. To apply the above investigated techniques and systems, under a severe accident condition in a nuclear power plant, a prototype of wireless post-accident monitoring system (WPAMS) is designed and constructed. Specifically, the radiation-tolerant wireless device is implemented with redundant and diversified channels. The developed system operates effectively to measure up-to-date information from a specific area/process and to transmit that information to remote monitoring station wirelessly. Hence, the correctness of the proposed architecture and approaches in this research has been successfully validated. In the design phase, an assessment method without performing repeated destructive physical tests is investigated to evaluate the radiation-tolerance of electronic systems by combining the evaluation of radiation protection and the analysis of the system reliability under the given radiation conditions. The results of the assessment studies have shown that, under given radiation conditions, the reliability of the developed radiation-tolerant wireless system can be much higher than those of non-redundant channels; and it can work in high-level radiation environments with total dose up to 1 M Rad (Si). Finally, a number of total dose tests are performed to investigate radiation effects induced by gamma radiation on distinct modern wireless monitoring devices. An experimental setup is developed to monitor the performance of signal measurement online and transmission of the developed distinct wireless electronic devices directly under gamma radiator at The Ohio State University Nuclear Reactor Lab (OSU-NRL). The gamma irradiator generates dose rates of 20 K Rad/h and 200 Rad/h on the samples, respectively. It was found that both measurement and transmission functions of distinct wireless measurement and transmission devices work well under gamma radiation conditions before the devices permanently damage. The experimental results have also shown that the developed radiation-tolerant design can be applied to effectively extend the lifespan of COTS-based electronic systems in the high-level radiation environment, as well as to improve the performance of wireless communication systems. According to testing results, the developed radiation-tolerant wireless device with a shielding protection can work at least 21 hours under the highest dose rate (20 K Rad/h). In summary, this research has addressed important issues on the design of radiation-tolerant systems without using rad-hardened electronic components. The proposed methods and systems provide an effective and economical solution to implement monitoring systems for obtaining up-to-date information in high-level radiation environments. The reported contributions are of significance both academically and in practice

A Comprehensive Survey on Non-Invasive Fault Injection Attacks

Non-invasive fault injection attacks have emerged as significant threats to a spectrum of microelectronic systems ranging from commodity devices to high-end customized processors. Unlike their invasive counterparts, these attacks are more affordable and can exploit system vulnerabilities without altering the hardware physically. Furthermore, certain non-invasive fault injection strategies allow for remote vulnerability exploitation without the requirement of physical proximity. However, existing studies lack extensive investigation into these attacks across diverse target platforms, threat models, emerging attack strategies, assessment frameworks, and mitigation approaches. In this paper, we provide a comprehensive overview of contemporary research on non-invasive fault injection attacks. Our objective is to consolidate and scrutinize the various techniques, methodologies, target systems susceptible to the attacks, and existing mitigation mechanisms advanced by the research community. Besides, we categorize attack strategies based on several aspects, present a detailed comparison among the categories, and highlight research challenges with future direction. By underlining and discussing the landscape of cutting-edge, non-invasive fault injection, we hope more researchers, designers, and security professionals examine the attacks further and take such threats into consideration while developing effective countermeasures

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Earthquake Engineering

The book Earthquake Engineering - From Engineering Seismology to Optimal Seismic Design of Engineering Structures contains fifteen chapters written by researchers and experts in the fields of earthquake and structural engineering. This book provides the state-of-the-art on recent progress in the field of seimology, earthquake engineering and structural engineering. The book should be useful to graduate students, researchers and practicing structural engineers. It deals with seismicity, seismic hazard assessment and system oriented emergency response for abrupt earthquake disaster, the nature and the components of strong ground motions and several other interesting topics, such as dam-induced earthquakes, seismic stability of slopes and landslides. The book also tackles the dynamic response of underground pipes to blast loads, the optimal seismic design of RC multi-storey buildings, the finite-element analysis of cable-stayed bridges under strong ground motions and the acute psychiatric trauma intervention due to earthquakes

Reliability in Power Electronics and Power Systems

L'abstract è presente nell'allegato / the abstract is in the attachmen