39,854 research outputs found

    A Case Study Of E-Supply Chain & Business Process Reengineering Of A Semiconductor Company In Malaysia

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    Penglibatan e-perniagaan dalam rantaian bekalan telah mewujudkan e-rantaian bekalan yang baru (e-SC) di firma-firma tempatan dan global. Due to globalization and advancement in information technology (IT), companies adopt best practices in e-business and supply chain management to be globally competitive as both are realities and prospects in 21st century

    Competitiveness and industrial renewal via production relocation by global multinational networks

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    Electrical industry is regarded as the backbone of the ICT branch’s hard-ware production. The international settlement of this industry is therefore of paramount interest for developed economies and emerging market economies as well. They all compete for investments in this sector. This study analysis the development of Hungarian electrical industry from the early years of transition when output performance was at the deepest level and when this sector along with the automotive branch became the primary source of eco-nomic expansion. The sector’s performance is compared with data from other CEE countries and with other Hungarian industries in order to illus-trate the widespread modernization effects of foreign investments in this sec-tor. The question of activities ’ relocation from more developed countries to Hungary, and in most recent years from Hungary to less developed regions is also dealt with. Relocations are regarded in this paper from the Hungar-ian viewpoint as necessary and positive developments. Relocated activities give room for other, more sophisticated and more income generating activi-ties

    Effect of overmolding process on the integrity of electronic circuits

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    Traditional injection molding processes have been widely used in the plastic processing industry. It is the major processing technique for converting thermoplastic polymers into complicated 3D parts with the aid of heat and pressure. Next generation of electronic circuits used in different application areas such as automotive, home appliances and medical devices will embed various electronic functionalities in plastic products. In this study, over-molding injection molding (OVM) of electronic components will be examined to insert novel performance in polymer materials. This low-cost manufacturing process offers potential benefits such as, reduction in processing time, higher freedom of design and less energy used when compared to the conventional injection molding method. This paper aims to evaluate the performance of this process and propose a series of alternative solutions to optimize the adhesion between and integration of electronics and engineering plastics. A number of methods are used to optimize the process so that the electronic circuits are not damaged during the over-molding, moreover to test the reliability of the system in order to control the continuity of connections between the electronic circuit foils and the electronic components after the OVM process. Correspondingly, we have performed specific tests for this purpose varying in some conditions: the type of injected plastic used, over-molding parameters (temperature, pressure and injection time), electronic circuit design, type of assembled electronic components, type of foils used and the effect of using underfill material below the electronic component. From these tests, first conclusions were made. We have also studied adhesion between the foil and the over-molding material. In this case, various types of engineering plastics have been tested; polypropylene (PP), 30% weight percentage glass,fiber filled polypropylene (GF-PP), Polyamide-6 (PA6) and 50% weight percentage glass fiber filled polyamide-6 (GF-PA6). It was proved that throughout the wide range of tested materials, (PA6) over-molded samples showed a better adhesion on the copper-polyimide foils than the rest. These plastics were over-molded on two types of polyimide (PP/Copper (Cu) tracks foils with and without an adhesive layer between PI and Cu. It was obviously clear that the foils with on adhesive layer between PI and Cu had more delamination in the Cu tracks than the foils without an adhesive layer. Furthermore, it was shown that the presence of an underfill material has on effect on the system as the foils that had an underfill material below their components successfully had a better connection than the folis without an underfill material. Finally, experiments were executed using the two probe method as an electrical measurement and microscope investigation as the visual inspection

    The Global Positioning System: Global Developments and Opportunities

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    International Relations/Trade,

    Surveys for sensitivity to fibers and potential impacts from fiber induced failures

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    The surveys for sensitivities to fibers and potential impacts from fiber induced failures begins with a review of the survey work completed to date and then describes an impact study involving four industrial installations located in Virginia. The observations and results from both the surveys and the study provide guidelines for future efforts. The survey work was done with three broad objectives: (1) identify the pieces of potentially vulnerable equipment as candidates for test; (2) support the transfer function work by gaining an understanding of how fibers could get into a building; and (3) support the economic analysis by understanding what would happen if fibers precipitated a failure in an item of equipment
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