349 research outputs found

    FOSS as an efficient tool for extraction of MOSFET compact model parameters

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    A GNU Octave - based application for device-level compact model evaluation and parameter extraction has been developed. The applications main features are as follows: experimental I-V data importing, generating input data for different circuit simulation programs, running the simulation program to calculate I-V characteristics of the specified models, calculating model misfit and its sensitivity to selected parameter variation, and the comparison of experimental and simulated characteristics. Measured I-V data stored by different measurement systems are accepted. Circuit simulations may be done with Ngspice, Qucs and LTSpiceIV © . Selected aspects of the application are presented and discussed

    Simulation and Optimisation of SiGe MOSFETs

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    This research project is concerned with the development of methodology for simulating advanced SiGe MOSFETs using commercial simulators, the calibration of simulators against higher level Monte Carlo simulation results and real device measurements, and the application of simulation tools in the design of next generation p- channel devices. The methodology for the modelling and simulation of SiGe MOSFET devices is outlined. There are many simulation approaches widely used to simulate SiGe devices, such as Monte Carlo, hydrodynamic, energy transport, and drift diffusion. Different numerical techniques including finite difference, finite box and finite element methods, may be used in the simulators. The Si0.8Ge0.2 p-MOSFETs fabricated especially for high-field transport studies and the Si0.64Ge0.36 p-channel MOSFETs fabricated at Warwick and Southampton Universities with a CMOS compatible process in varying gate lengths were calibrated and investigated. Enhanced low field mobility in SiGe layers compared to Si control devices was observed. The results indicated that the potential of velocity overshoot effects for SiGe p-MOSFETs was considerably higher than Si counterparts, promising higher performance in the former at equal gate lengths at ultra-small devices. The effects of punchthrough stopper, undoped buffers and delta doping for SiGe p-MOSFETs were analysed systematically. It was found that the threshold voltage roll off might be reduced considerably by using an appropriate punchthrough stopper. In order to adjust the threshold voltage for digital CMOS applications, p-type delta doping was required for n+-polysilicon gate p-MOSFET. The use of delta doping made the threshold voltage roll off a more serious issue, therefore delta doping should be used with caution. The two-dimensional process simulator TSUPREM-4 and the two-dimensional device simulator MEDICI were employed to optimise and design Si/SiGe hybrid CMOS. The output of TSUPREM-4 was transferred automatically to the MEDICI device simulator. This made the simulation results more realistic. For devices at small gate length, lightly doped drain (LDD) structures were required. They would decrease the lateral subdiffusion and allow threshold voltage roll off to be minimised. These structures, however, would generally reduce drain current due to an increase in the series resistance of the drain region. Further consideration must be made of these trade-offs. Comparison between drift diffusion and hydrodynamic simulation results for SiGe p-MOSFETs were presented for the first time, with transport parameters extracted from our in-house full-band hole Monte Carlo transport simulator. It was shown that while drift diffusion and hydrodynamic simulations provided a reasonable estimation of the I-V characteristics for Si devices, the same could not be said for aggressively scaled SiGe devices. The resulting high fields at the source end of the devices meant that nonequilibrium transport effects were significant. Therefore for holes, models based on an isotropic carrier temperature were no longer appropriate, as it was shown by analysing the tensor components of the carrier temperature obtained from Monte Carlo simulation. Two-dimensional drift diffusion and Monte Carlo simulations of well-tempered Si p-MOSFETs with gate lengths of 25 and 50 nm were performed. By comparing Monte Carlo simulations with carefully calibrated drift diffusion results, it was found that nonequilibrium transport was important for understanding the high current device characteristics in sub 0.1 mum p-MOSFETs. The well-tempered devices showed better characteristics than the conventional SiGe devices. Both threshold voltage roll off and the subthreshold slope were acceptable although the effective channel length of this device was reduced from 50 nm to 25 nm. In order to adjust the threshold voltage for the digital CMOS applications, p-type delta doping was used for 50 nm well-tempered SiGe p- MOSFETs. As the delta doping made the threshold voltage roll off too serious, it was not suitable for 25 nm well-tempered SiGe p-MOSFETs

    Circuit Optimisation using Device Layout Motifs

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    Circuit designers face great challenges as CMOS devices continue to scale to nano dimensions, in particular, stochastic variability caused by the physical properties of transistors. Stochastic variability is an undesired and uncertain component caused by fundamental phenomena associated with device structure evolution, which cannot be avoided during the manufacturing process. In order to examine the problem of variability at atomic levels, the 'Motif' concept, defined as a set of repeating patterns of fundamental geometrical forms used as design units, is proposed to capture the presence of statistical variability and improve the device/circuit layout regularity. A set of 3D motifs with stochastic variability are investigated and performed by technology computer aided design simulations. The statistical motifs compact model is used to bridge between device technology and circuit design. The statistical variability information is transferred into motifs' compact model in order to facilitate variation-aware circuit designs. The uniform motif compact model extraction is performed by a novel two-step evolutionary algorithm. The proposed extraction method overcomes the drawbacks of conventional extraction methods of poor convergence without good initial conditions and the difficulty of simulating multi-objective optimisations. After uniform motif compact models are obtained, the statistical variability information is injected into these compact models to generate the final motif statistical variability model. The thesis also considers the influence of different choices of motif for each device on circuit performance and its statistical variability characteristics. A set of basic logic gates is constructed using different motif choices. Results show that circuit performance and variability mitigation can benefit from specific motif permutations. A multi-stage optimisation methodology is introduced, in which the processes of optimisation are divided into several stages. Benchmark circuits show the efficacy of the proposed methods. The results presented in this thesis indicate that the proposed methods are able to provide circuit performance improvements and are able to create circuits that are more robust against variability

    The ReaxFF reactive force-field : development, applications and future directions

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    The reactive force-field (ReaxFF) interatomic potential is a powerful computational tool for exploring, developing and optimizing material properties. Methods based on the principles of quantum mechanics (QM), while offering valuable theoretical guidance at the electronic level, are often too computationally intense for simulations that consider the full dynamic evolution of a system. Alternatively, empirical interatomic potentials that are based on classical principles require significantly fewer computational resources, which enables simulations to better describe dynamic processes over longer timeframes and on larger scales. Such methods, however, typically require a predefined connectivity between atoms, precluding simulations that involve reactive events. The ReaxFF method was developed to help bridge this gap. Approaching the gap from the classical side, ReaxFF casts the empirical interatomic potential within a bond-order formalism, thus implicitly describing chemical bonding without expensive QM calculations. This article provides an overview of the development, application, and future directions of the ReaxFF method

    Numerical Simulations

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    This book will interest researchers, scientists, engineers and graduate students in many disciplines, who make use of mathematical modeling and computer simulation. Although it represents only a small sample of the research activity on numerical simulations, the book will certainly serve as a valuable tool for researchers interested in getting involved in this multidisciplinary field. It will be useful to encourage further experimental and theoretical researches in the above mentioned areas of numerical simulation

    Prognostics and health management of power electronics

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    Prognostics and health management (PHM) is a major tool enabling systems to evaluate their reliability in real-time operation. Despite ground-breaking advances in most engineering and scientific disciplines during the past decades, reliability engineering has not seen significant breakthroughs or noticeable advances. Therefore, self-awareness of the embedded system is also often required in the sense that the system should be able to assess its own health state and failure records, and those of its main components, and take action appropriately. This thesis presents a radically new prognostics approach to reliable system design that will revolutionise complex power electronic systems with robust prognostics capability enhanced Insulated Gate Bipolar Transistors (IGBT) in applications where reliability is significantly challenging and critical. The IGBT is considered as one of the components that is mainly damaged in converters and experiences a number of failure mechanisms, such as bond wire lift off, die attached solder crack, loose gate control voltage, etc. The resulting effects mentioned are complex. For instance, solder crack growth results in increasing the IGBT’s thermal junction which becomes a source of heat turns to wire bond lift off. As a result, the indication of this failure can be seen often in increasing on-state resistance relating to the voltage drop between on-state collector-emitter. On the other hand, hot carrier injection is increased due to electrical stress. Additionally, IGBTs are components that mainly work under high stress, temperature and power consumptions due to the higher range of load that these devices need to switch. This accelerates the degradation mechanism in the power switches in discrete fashion till reaches failure state which fail after several hundred cycles. To this end, exploiting failure mechanism knowledge of IGBTs and identifying failure parameter indication are background information of developing failure model and prognostics algorithm to calculate remaining useful life (RUL) along with ±10% confidence bounds. A number of various prognostics models have been developed for forecasting time to failure of IGBTs and the performance of the presented estimation models has been evaluated based on two different evaluation metrics. The results show significant improvement in health monitoring capability for power switches.Furthermore, the reliability of the power switch was calculated and conducted to fully describe health state of the converter and reconfigure the control parameter using adaptive algorithm under degradation and load mission limitation. As a result, the life expectancy of devices has been increased. These all allow condition-monitoring facilities to minimise stress levels and predict future failure which greatly reduces the likelihood of power switch failures in the first place

    Industrial and Technological Applications of Power Electronics Systems

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    The Special Issue "Industrial and Technological Applications of Power Electronics Systems" focuses on: - new strategies of control for electric machines, including sensorless control and fault diagnosis; - existing and emerging industrial applications of GaN and SiC-based converters; - modern methods for electromagnetic compatibility. The book covers topics such as control systems, fault diagnosis, converters, inverters, and electromagnetic interference in power electronics systems. The Special Issue includes 19 scientific papers by industry experts and worldwide professors in the area of electrical engineering

    Cutting Edge Nanotechnology

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    The main purpose of this book is to describe important issues in various types of devices ranging from conventional transistors (opening chapters of the book) to molecular electronic devices whose fabrication and operation is discussed in the last few chapters of the book. As such, this book can serve as a guide for identifications of important areas of research in micro, nano and molecular electronics. We deeply acknowledge valuable contributions that each of the authors made in writing these excellent chapters

    Modeling and Simulation in Engineering

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    The general aim of this book is to present selected chapters of the following types: chapters with more focus on modeling with some necessary simulation details and chapters with less focus on modeling but with more simulation details. This book contains eleven chapters divided into two sections: Modeling in Continuum Mechanics and Modeling in Electronics and Engineering. We hope our book entitled "Modeling and Simulation in Engineering - Selected Problems" will serve as a useful reference to students, scientists, and engineers
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