41 research outputs found

    VLSI Design

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    This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

    Evaluation of temperature-performance trade-offs in wireless network-on-chip architectures

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    Continued scaling of device geometries according to Moore\u27s Law is enabling complete end-user systems on a single chip. Massive multicore processors are enablers for many information and communication technology (ICT) innovations spanning various domains, including healthcare, defense, and entertainment. In the design of high-performance massive multicore chips, power and heat are dominant constraints. Temperature hotspots witnessed in multicore systems exacerbate the problem of reliability in deep submicron technologies. Hence, there is a great need to explore holistic power and thermal optimization and management strategies for the massive multicore chips. High power consumption not only raises chip temperature and cooling cost, but also decreases chip reliability and performance. Thus, addressing thermal concerns at different stages of the design and operation is critical to the success of future generation systems. The performance of a multicore chip is also influenced by its overall communication infrastructure, which is predominantly a Network-on-Chip (NoC). The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency, significant power consumption, and temperature hotspots arising out of long, multi-hop wireline links used in data exchange. On-chip wireless networks are envisioned as an enabling technology to design low power and high bandwidth massive multicore architectures. However, optimizing wireless NoCs for best performance does not necessarily guarantee a thermally optimal interconnection architecture. The wireless links being highly efficient attract very high traffic densities which in turn results in temperature hotspots. Therefore, while the wireless links result in better performance and energy-efficiency, they can also cause temperature hotspots and undermine the reliability of the system. Consequently, the location and utilization of the wireless links is an important factor in thermal optimization of high performance wireless Networks-on-Chip. Architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance yet energy-efficient massive multicore chips. This work contributes to exploration of various the design methodologies for establishing wireless NoC architectures that achieve the best trade-offs between temperature, performance and energy-efficiency. It further demonstrates that incorporating Dynamic Thermal Management (DTM) on a multicore chip designed with such temperature and performance optimized Wireless Network-on-Chip architectures improves thermal profile while simultaneously providing lower latency and reduced network energy dissipation compared to its conventional counterparts

    Using Proportional-Integral-Differential approach for Dynamic Traffic Prediction in Wireless Network-on-Chip

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    The massive integration of cores in multi-core system has enabled chip designer to design systems while meeting the power performance demands of the applications. Wireless interconnection has emerged as an energy efficient solution to the challenges of multi-hop communication over the wireline paths in conventional Networks-on-Chips (NoCs). However, to ensure the full benefits of this novel interconnect technology, design of simple, fair and efficient Medium Access Control (MAC) mechanism to grant access to the on-chip wireless communication channel is needed. Moreover, to adapt to the varying traffic demands from the applications running on a multicore environment, MAC mechanisms should dynamically adjust the transmission slots of the wireless interfaces (WIs). To ensure an efficient utilization of the wireless medium in a Wireless NoC (WiNoC), in this work we present the design of prediction model that is used by two dynamic MAC mechanism to predict the traffic demand of the WIs and respond accordingly by adjusting transmission slots of the WIs. Through system level simulations, we show that the traffic aware MAC mechanisms are more energy efficient as well as capable of sustaining higher data bandwidth in WiNoCs

    An Interconnection Architecture for Seamless Inter and Intra-Chip Communication Using Wireless Links

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    As semiconductor technologies continues to scale, more and more cores are being integrated on the same multicore chip. This increase in complexity poses the challenge of efficient data transfer between these cores. Several on-chip network architectures are proposed to improve the design flexibility and communication efficiency of such multicore chips. However, in a larger system consisting of several multicore chips across a board or in a System-in-Package (SiP), the performance is limited by the communication among and within these chips. Such systems, most commonly found within computing modules in typical data center nodes or server racks, are in dire need of an efficient interconnection architecture. Conventional interchip communication using wireline links involve routing the data from the internal cores to the peripheral I/O ports, travelling over the interchip channels to the destination chip, and finally getting routed from the I/O to the internal cores there. This multihop communication increases latency and energy consumption while decreasing data bandwidth in a multichip system. Furthermore, the intrachip and interchip communication architectures are separately designed to maximize design flexibility. Jointly designing them could, however, improve the communication efficiency significantly and yield better solutions. Previous attempts at this include an all-photonic approach that provides a unified inter/intra-chip optical network, based on recent progress in nano-photonic technologies. Works on wireless inter-chip interconnects successfully yielded better results than their wired counterparts, but their scopes were limited to establishing a single wireless connection between two chips rather than a communication architecture for a system as a whole. In this thesis, the design of a seamless hybrid wired and wireless interconnection network for multichip systems in a package is proposed. The design utilizes on-chip wireless transceivers with dimensions spanning up to tens of centimeters. It manages to seamlessly bind both intrachip and interchip communication architectures and enables direct chip-to-chip communication between the internal cores. It is shown through cycle accurate simulations that the proposed design increases the bandwidth and reduces the energy consumption when compared to the state-of-the-art wireline I/O based multichip communications

    An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

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    Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

    Broadcast-oriented wireless network-on-chip : fundamentals and feasibility

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    Premi extraordinari doctorat UPC curs 2015-2016, àmbit Enginyeria de les TICRecent years have seen the emergence and ubiquitous adoption of Chip Multiprocessors (CMPs), which rely on the coordinated operation of multiple execution units or cores. Successive CMP generations integrate a larger number of cores seeking higher performance with a reasonable cost envelope. For this trend to continue, however, important scalability issues need to be solved at different levels of design. Scaling the interconnect fabric is a grand challenge by itself, as new Network-on-Chip (NoC) proposals need to overcome the performance hurdles found when dealing with the increasingly variable and heterogeneous communication demands of manycore processors. Fast and flexible NoC solutions are needed to prevent communication become a performance bottleneck, situation that would severely limit the design space at the architectural level and eventually lead to the use of software frameworks that are slow, inefficient, or less programmable. The emergence of novel interconnect technologies has opened the door to a plethora of new NoCs promising greater scalability and architectural flexibility. In particular, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. Most of the resulting Wireless Network-on-Chip (WNoC) proposals have set the focus on leveraging the latency advantage of this paradigm by creating multiple wireless channels to interconnect far-apart cores. This strategy is effective as the complement of wired NoCs at moderate scales, but is likely to be overshadowed at larger scales by technologies such as nanophotonics unless bandwidth is unrealistically improved. This dissertation presents the concept of Broadcast-Oriented Wireless Network-on-Chip (BoWNoC), a new approach that attempts to foster the inherent simplicity, flexibility, and broadcast capabilities of the wireless technology by integrating one on-chip antenna and transceiver per processor core. This paradigm is part of a broader hybrid vision where the BoWNoC serves latency-critical and broadcast traffic, tightly coupled to a wired plane oriented to large flows of data. By virtue of its scalable broadcast support, BoWNoC may become the key enabler of a wealth of unconventional hardware architectures and algorithmic approaches, eventually leading to a significant improvement of the performance, energy efficiency, scalability and programmability of manycore chips. The present work aims not only to lay the fundamentals of the BoWNoC paradigm, but also to demonstrate its viability from the electronic implementation, network design, and multiprocessor architecture perspectives. An exploration at the physical level of design validates the feasibility of the approach at millimeter-wave bands in the short term, and then suggests the use of graphene-based antennas in the terahertz band in the long term. At the link level, this thesis provides an insightful context analysis that is used, afterwards, to drive the design of a lightweight protocol that reliably serves broadcast traffic with substantial latency improvements over state-of-the-art NoCs. At the network level, our hybrid vision is evaluated putting emphasis on the flexibility provided at the network interface level, showing outstanding speedups for a wide set of traffic patterns. At the architecture level, the potential impact of the BoWNoC paradigm on the design of manycore chips is not only qualitatively discussed in general, but also quantitatively assessed in a particular architecture for fast synchronization. Results demonstrate that the impact of BoWNoC can go beyond simply improving the network performance, thereby representing a possible game changer in the manycore era.Avenços en el disseny de multiprocessadors han portat a una àmplia adopció dels Chip Multiprocessors (CMPs), que basen el seu potencial en la operació coordinada de múltiples nuclis de procés. Generacions successives han anat integrant més nuclis en la recerca d'alt rendiment amb un cost raonable. Per a que aquesta tendència continuï, però, cal resoldre importants problemes d'escalabilitat a diferents capes de disseny. Escalar la xarxa d'interconnexió és un gran repte en ell mateix, ja que les noves propostes de Networks-on-Chip (NoC) han de servir un tràfic eminentment variable i heterogeni dels processadors amb molts nuclis. Són necessàries solucions ràpides i flexibles per evitar que les comunicacions dins del xip es converteixin en el pròxim coll d'ampolla de rendiment, situació que limitaria en gran mesura l'espai de disseny a nivell d'arquitectura i portaria a l'ús d'arquitectures i models de programació lents, ineficients o poc programables. L'aparició de noves tecnologies d'interconnexió ha possibilitat la creació de NoCs més flexibles i escalables. En particular, la comunicació intra-xip sense fils ha despertat un interès considerable en virtut de les seva baixa latència, simplicitat, i bon rendiment amb tràfic broadcast. La majoria de les Wireless NoC (WNoC) proposades fins ara s'han centrat en aprofitar l'avantatge en termes de latència d'aquest nou paradigma creant múltiples canals sense fils per interconnectar nuclis allunyats entre sí. Aquesta estratègia és efectiva per complementar a NoCs clàssiques en escales mitjanes, però és probable que altres tecnologies com la nanofotònica puguin jugar millor aquest paper a escales més grans. Aquesta tesi presenta el concepte de Broadcast-Oriented WNoC (BoWNoC), un nou enfoc que intenta rendibilitzar al màxim la inherent simplicitat, flexibilitat, i capacitats broadcast de la tecnologia sense fils integrant una antena i transmissor/receptor per cada nucli del processador. Aquest paradigma forma part d'una visió més àmplia on un BoWNoC serviria tràfic broadcast i urgent, mentre que una xarxa convencional serviria fluxos de dades més pesats. En virtut de la escalabilitat i del seu suport broadcast, BoWNoC podria convertir-se en un element clau en una gran varietat d'arquitectures i algoritmes poc convencionals que milloressin considerablement el rendiment, l'eficiència, l'escalabilitat i la programabilitat de processadors amb molts nuclis. El present treball té com a objectius no només estudiar els aspectes fonamentals del paradigma BoWNoC, sinó també demostrar la seva viabilitat des dels punts de vista de la implementació, i del disseny de xarxa i arquitectura. Una exploració a la capa física valida la viabilitat de l'enfoc usant tecnologies longituds d'ona milimètriques en un futur proper, i suggereix l'ús d'antenes de grafè a la banda dels terahertz ja a més llarg termini. A capa d'enllaç, la tesi aporta una anàlisi del context de l'aplicació que és, més tard, utilitzada per al disseny d'un protocol d'accés al medi que permet servir tràfic broadcast a baixa latència i de forma fiable. A capa de xarxa, la nostra visió híbrida és avaluada posant èmfasi en la flexibilitat que aporta el fet de prendre les decisions a nivell de la interfície de xarxa, mostrant grans millores de rendiment per una àmplia selecció de patrons de tràfic. A nivell d'arquitectura, l'impacte que el concepte de BoWNoC pot tenir sobre el disseny de processadors amb molts nuclis no només és debatut de forma qualitativa i genèrica, sinó també avaluat quantitativament per una arquitectura concreta enfocada a la sincronització. Els resultats demostren que l'impacte de BoWNoC pot anar més enllà d'una millora en termes de rendiment de xarxa; representant, possiblement, un canvi radical a l'era dels molts nuclisAward-winningPostprint (published version

    Broadcast-oriented wireless network-on-chip : fundamentals and feasibility

    Get PDF
    Premi extraordinari doctorat UPC curs 2015-2016, àmbit Enginyeria de les TICRecent years have seen the emergence and ubiquitous adoption of Chip Multiprocessors (CMPs), which rely on the coordinated operation of multiple execution units or cores. Successive CMP generations integrate a larger number of cores seeking higher performance with a reasonable cost envelope. For this trend to continue, however, important scalability issues need to be solved at different levels of design. Scaling the interconnect fabric is a grand challenge by itself, as new Network-on-Chip (NoC) proposals need to overcome the performance hurdles found when dealing with the increasingly variable and heterogeneous communication demands of manycore processors. Fast and flexible NoC solutions are needed to prevent communication become a performance bottleneck, situation that would severely limit the design space at the architectural level and eventually lead to the use of software frameworks that are slow, inefficient, or less programmable. The emergence of novel interconnect technologies has opened the door to a plethora of new NoCs promising greater scalability and architectural flexibility. In particular, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. Most of the resulting Wireless Network-on-Chip (WNoC) proposals have set the focus on leveraging the latency advantage of this paradigm by creating multiple wireless channels to interconnect far-apart cores. This strategy is effective as the complement of wired NoCs at moderate scales, but is likely to be overshadowed at larger scales by technologies such as nanophotonics unless bandwidth is unrealistically improved. This dissertation presents the concept of Broadcast-Oriented Wireless Network-on-Chip (BoWNoC), a new approach that attempts to foster the inherent simplicity, flexibility, and broadcast capabilities of the wireless technology by integrating one on-chip antenna and transceiver per processor core. This paradigm is part of a broader hybrid vision where the BoWNoC serves latency-critical and broadcast traffic, tightly coupled to a wired plane oriented to large flows of data. By virtue of its scalable broadcast support, BoWNoC may become the key enabler of a wealth of unconventional hardware architectures and algorithmic approaches, eventually leading to a significant improvement of the performance, energy efficiency, scalability and programmability of manycore chips. The present work aims not only to lay the fundamentals of the BoWNoC paradigm, but also to demonstrate its viability from the electronic implementation, network design, and multiprocessor architecture perspectives. An exploration at the physical level of design validates the feasibility of the approach at millimeter-wave bands in the short term, and then suggests the use of graphene-based antennas in the terahertz band in the long term. At the link level, this thesis provides an insightful context analysis that is used, afterwards, to drive the design of a lightweight protocol that reliably serves broadcast traffic with substantial latency improvements over state-of-the-art NoCs. At the network level, our hybrid vision is evaluated putting emphasis on the flexibility provided at the network interface level, showing outstanding speedups for a wide set of traffic patterns. At the architecture level, the potential impact of the BoWNoC paradigm on the design of manycore chips is not only qualitatively discussed in general, but also quantitatively assessed in a particular architecture for fast synchronization. Results demonstrate that the impact of BoWNoC can go beyond simply improving the network performance, thereby representing a possible game changer in the manycore era.Avenços en el disseny de multiprocessadors han portat a una àmplia adopció dels Chip Multiprocessors (CMPs), que basen el seu potencial en la operació coordinada de múltiples nuclis de procés. Generacions successives han anat integrant més nuclis en la recerca d'alt rendiment amb un cost raonable. Per a que aquesta tendència continuï, però, cal resoldre importants problemes d'escalabilitat a diferents capes de disseny. Escalar la xarxa d'interconnexió és un gran repte en ell mateix, ja que les noves propostes de Networks-on-Chip (NoC) han de servir un tràfic eminentment variable i heterogeni dels processadors amb molts nuclis. Són necessàries solucions ràpides i flexibles per evitar que les comunicacions dins del xip es converteixin en el pròxim coll d'ampolla de rendiment, situació que limitaria en gran mesura l'espai de disseny a nivell d'arquitectura i portaria a l'ús d'arquitectures i models de programació lents, ineficients o poc programables. L'aparició de noves tecnologies d'interconnexió ha possibilitat la creació de NoCs més flexibles i escalables. En particular, la comunicació intra-xip sense fils ha despertat un interès considerable en virtut de les seva baixa latència, simplicitat, i bon rendiment amb tràfic broadcast. La majoria de les Wireless NoC (WNoC) proposades fins ara s'han centrat en aprofitar l'avantatge en termes de latència d'aquest nou paradigma creant múltiples canals sense fils per interconnectar nuclis allunyats entre sí. Aquesta estratègia és efectiva per complementar a NoCs clàssiques en escales mitjanes, però és probable que altres tecnologies com la nanofotònica puguin jugar millor aquest paper a escales més grans. Aquesta tesi presenta el concepte de Broadcast-Oriented WNoC (BoWNoC), un nou enfoc que intenta rendibilitzar al màxim la inherent simplicitat, flexibilitat, i capacitats broadcast de la tecnologia sense fils integrant una antena i transmissor/receptor per cada nucli del processador. Aquest paradigma forma part d'una visió més àmplia on un BoWNoC serviria tràfic broadcast i urgent, mentre que una xarxa convencional serviria fluxos de dades més pesats. En virtut de la escalabilitat i del seu suport broadcast, BoWNoC podria convertir-se en un element clau en una gran varietat d'arquitectures i algoritmes poc convencionals que milloressin considerablement el rendiment, l'eficiència, l'escalabilitat i la programabilitat de processadors amb molts nuclis. El present treball té com a objectius no només estudiar els aspectes fonamentals del paradigma BoWNoC, sinó també demostrar la seva viabilitat des dels punts de vista de la implementació, i del disseny de xarxa i arquitectura. Una exploració a la capa física valida la viabilitat de l'enfoc usant tecnologies longituds d'ona milimètriques en un futur proper, i suggereix l'ús d'antenes de grafè a la banda dels terahertz ja a més llarg termini. A capa d'enllaç, la tesi aporta una anàlisi del context de l'aplicació que és, més tard, utilitzada per al disseny d'un protocol d'accés al medi que permet servir tràfic broadcast a baixa latència i de forma fiable. A capa de xarxa, la nostra visió híbrida és avaluada posant èmfasi en la flexibilitat que aporta el fet de prendre les decisions a nivell de la interfície de xarxa, mostrant grans millores de rendiment per una àmplia selecció de patrons de tràfic. A nivell d'arquitectura, l'impacte que el concepte de BoWNoC pot tenir sobre el disseny de processadors amb molts nuclis no només és debatut de forma qualitativa i genèrica, sinó també avaluat quantitativament per una arquitectura concreta enfocada a la sincronització. Els resultats demostren que l'impacte de BoWNoC pot anar més enllà d'una millora en termes de rendiment de xarxa; representant, possiblement, un canvi radical a l'era dels molts nuclisAward-winningPostprint (published version

    Combined Dynamic Thermal Management Exploiting Broadcast-Capable Wireless Network-on-Chip Architecture

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    With the continuous scaling of device dimensions, the number of cores on a single die is constantly increasing. This integration of hundreds of cores on a single die leads to high power dissipation and thermal issues in modern Integrated Circuits (ICs). This causes problems related to reliability, timing violations and lifetime of electronic devices. Dynamic Thermal Management (DTM) techniques have emerged as potential solutions that mitigate the increasing temperatures on a die. However, considering the scaling of system sizes and the adoption of the Network-on-Chip (NoC) paradigm to serve as the interconnection fabric exacerbates the problem as both cores and NoC elements contribute to the increased heat dissipation on the chip. Typically, DTM techniques can either be proactive or reactive. Proactive DTM techniques, where the system has the ability to predict the thermal profile of the chip ahead of time are more desirable than reactive DTM techniques where the system utilizes thermal sensors to determine the current temperature of the chip. Moreover, DTM techniques either address core or NoC level thermal issues separately. Hence, this thesis proposes a combined proactive DTM technique that integrates both core level and NoC level DTM techniques. The combined DTM mechanism includes a dynamic temperature-aware routing approach for the NoC level elements, and includes task reallocation heuristics for the core level elements. On-chip wireless interconnects recently envisioned to enable energy-efficient data exchange between cores in a multicore chip will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM. Combining the proactive DTM technique with on-chip wireless interconnects, the on-chip temperature is restricted within target temperatures without significantly affecting the performance of the NoC based interconnection fabric of the multicore chip

    Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

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    This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast
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