Supply Current Modeling and Analysis of Deep Sub-Micron Cmos Circuits

Continued technology scaling has introduced many new challenges in VLSI design. Instantaneous switching of the gates yields high current flow through them that causes large voltage drop at the supply lines. Such high instantaneous currents and voltage drop cause reliability and performance degradation. Reliability is an issue as high magnitude of current can cause electromigration, whereas, voltage drop can slow down the circuit performance. Therefore, designing power supply lines emphasizes the need of computing maximum current through them. However, the development of digital integrated circuits in short design cycle requires accurate and fast timing and power simulation. Unfortunately, simulators that employ device modeling methods, such as HSPICE are prohibitively slow for large designs. Therefore, methods which can produce good maximum current estimates in short times are critical. In this work a compact model has been developed for maximum current estimation that speeds up the computation by orders of magnitude over the commercial tools

An Electromigration and Thermal Model of Power Wires for a Priori High-Level Reliability Prediction

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap projections, we are able to predict a priori that the minimum width that satisfies the electromigration constraints does not scale like the minimum metal pitch in future technology nodes. As a consequence, the percentage of chip area covered by power lines is expected to increase at the expense of wiring resources unless proper countermeasures are taken. Some possible solutions are proposed in the paper

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

Integrated temperature sensors in deep sub-micron CMOS technologies

textIntegrated temperature sensors play an important role in enhancing the performance of on-chip power and thermal management systems in today's highly-integrated system-on-chip (SoC) platforms, such as microprocessors. Accurate on-chip temperature measurement is essential to maximize the performance and reliability of these SoCs. However, due to non-uniform power consumption by different functional blocks, microprocessors have fairly large thermal gradient (and variation) across their chips. In the case of multi-core microprocessors for example, there are task-specific thermal gradients across different cores on the same die. As a result, multiple temperature sensors are needed to measure the temperature profile at all relevant coordinates of the chip. Subsequently, the results of the temperature measurements are used to take corrective measures to enhance the performance, or save the SoC from catastrophic over-heating situations which can cause permanent damage. Furthermore, in a large multi-core microprocessor, it is also imperative to continuously monitor potential hot-spots that are prone to thermal runaway. The locations of such hot spots depend on the operations and instruction the processor carries out at a given time. Due to practical limitations, it is an overkill to place a big size temperature sensor nearest to all possible hot spots. Thus, an ideal on-chip temperature sensor should have minimal area so that it can be placed non-invasively across the chip without drastically changing the chip floor plan. In addition, the power consumption of the sensors should be very low to reduce the power budget overhead of thermal monitoring system, and to minimize measurement inaccuracies due to self-heating. The objective of this research is to design an ultra-small size and ultra-low power temperature sensor such that it can be placed in the intimate proximity of all possible hot spots across the chip. The general idea is to use the leakage current of a reverse-bias p-n junction diode as an operand for temperature sensing. The tasks within this project are to examine the theoretical aspect of such sensors in both Silicon-On-Insulator (SOI), and bulk Complementary Metal-Oxide Semiconductor (CMOS) technologies, implement them in deep sub-micron technologies, and ultimately evaluate their performances, and compare them to existing solutions.Electrical and Computer Engineerin

On Co-Optimization Of Constrained Satisfiability Problems For Hardware Software Applications

Manufacturing technology has permitted an exponential growth in transistor count and density. However, making efficient use of the available transistors in the design has become exceedingly difficult. Standard design flow involves synthesis, verification, placement and routing followed by final tape out of the design. Due to the presence of various undesirable effects like capacitive crosstalk, supply noise, high temperatures, etc., verification/validation of the design has become a challenging problem. Therefore, having a good design convergence may not be possible within the target time, due to a need for a large number of design iterations. Capacitive crosstalk is one of the major causes of design convergence problems in deep sub-micron era. With scaling, the number of crosstalk violations has been increasing because of reduced inter-wire distances. Consequently only the most severe crosstalk faults are fixed pre-silicon while the rest are tested post-silicon. Testing for capacitive crosstalk involves generation of input patterns which can be applied post-silicon to the integrated circuit and comparison of the output response. These patterns are generated at the gate/ Register Transfer Level (RTL) of abstraction using Automatic Test Pattern Generation (ATPG) tools. In this dissertation, anInteger Linear Programming (ILP) based ATPG technique for maximizing crosstalk induced delay increase at the victim net, for multiple aggressor crosstalk faults, is presented. Moreover, various solutions for pattern generation considering both zero as well as unit delay models is also proposed. With voltage scaling, power supply switching noise has become one of the leading causes of signal integrity related failures in deep sub-micron designs. Hence, during power supply network design and analysis of power supply switching noise, computation of peak supply current is an essential step. Traditional peak current estimation approaches involve addition of peak current associated with all the CMOS gates which are switching in a combinational circuit. Consequently, this approach does not take the Boolean and temporal relationships of the circuit into account. This work presents an ILP based technique for generation of an input pattern pair which maximizes switching supply currents for a combinational circuit in the presence of integer gate delays. The input pattern pair generated using the above approach can be applied post-silicon for power droop testing. With high level of integration, Multi-Processor Systems on Chip (MPSoC) feature multiple processor cores and accelerators on the same die, so as to exploit the instruction level parallelism in the application. For hardware-software co-design, application programming model is based on a Task Graph, which represents task dependencies and execution/transfer times for various threads and processes within an application. Mapping an application to an MPSoC traditionally involves representing it in the form of a task graph and employing static scheduling in order to minimize the schedule length. Dynamic system behavior is not taken into consideration during static scheduling, while dynamic scheduling requires the knowledge of task graph at runtime. A run-time task graph extraction heuristic to facilitate dynamic scheduling is also presented here. A novel game theory based approach uses this extracted task graph to perform run-time scheduling in order to minimize total schedule length. With increase in transistor density, power density has gone up substantially. This has lead to generation of regions with very high temperature called Hotspots. Hotspots lead to reliability and performance issues and affect design convergence. In current generation Integrated Circuits (ICs) temperature is controlled by reducing power dissipation using Dynamic Thermal Management (DTM) techniques like frequency and/or voltage scaling. These techniques are reactive in nature and have detrimental effects on performance. Here, a look-ahead based task migration technique is proposed, in order to utilize the multitude of cores available in an MPSoC to eliminate thermal emergencies. Our technique is based on temperature prediction, leveraging upon a novel wavelet based thermal modeling approach. Hence, this work addresses several optimization problems that can be reduced to constrained max-satisfiability, involving integer as well as Boolean constraints in hardware and software domains. Moreover, it provides domain specific heuristic solutions for each of them

A novel concept for a fully digital particle detector

Silicon sensors are the most diffuse position sensitive device in particle physics 8 experiments and in countless applications in science and technology. They had a spectacular progress in performance over almost 40 years since their first introduction, but their evolution is now slowing down. The position resolution for single particle hits is larger than a few microns in the most advanced sensors. This value was reached already over 30 years ago [1]. The minimum ionising path length a sensor can detect is several tens of microns. There are fundamental reasons why these limits will not be substantially improved by further refinements of the current technology. This makes silicon sensors unsuitable to applications where the physics signature is the short path of a recoiling atom and constrains the layout of physics experiments where they represent by far the best option like high energy physics collider experiments. In perspective, the availability of sensors with sub-micron spatial resolution, in the order of a few tens of nanometres, would be a disruptive change for the sensor technology with a foreseeable huge impact on experiment layout and various applications of these devices. For providing such a leap in resolution, we propose a novel design based on a purely digital circuit. This disruptive concept potentially enables pixel sizes much smaller than 1{\mu}m2 and a number of advantages in terms of power consumption, readout speed and reduced thickness (for low mass sensors).Comment: 12 pages, 12 figures, 10 reference

Low power predictable memory and processing architectures

Great demand in power optimized devices shows promising economic potential and draws lots of attention in industry and research area. Due to the continuously shrinking CMOS process, not only dynamic power but also static power has emerged as a big concern in power reduction. Other than power optimization, average-case power estimation is quite significant for power budget allocation but also challenging in terms of time and effort. In this thesis, we will introduce a methodology to support modular quantitative analysis in order to estimate average power of circuits, on the basis of two concepts named Random Bag Preserving and Linear Compositionality. It can shorten simulation time and sustain high accuracy, resulting in increasing the feasibility of power estimation of big systems. For power saving, firstly, we take advantages of the low power characteristic of adiabatic logic and asynchronous logic to achieve ultra-low dynamic and static power. We will propose two memory cells, which could run in adiabatic and non-adiabatic mode. About 90% dynamic power can be saved in adiabatic mode when compared to other up-to-date designs. About 90% leakage power is saved. Secondly, a novel logic, named Asynchronous Charge Sharing Logic (ACSL), will be introduced. The realization of completion detection is simplified considerably. Not just the power reduction improvement, ACSL brings another promising feature in average power estimation called data-independency where this characteristic would make power estimation effortless and be meaningful for modular quantitative average case analysis. Finally, a new asynchronous Arithmetic Logic Unit (ALU) with a ripple carry adder implemented using the logically reversible/bidirectional characteristic exhibiting ultra-low power dissipation with sub-threshold region operating point will be presented. The proposed adder is able to operate multi-functionally

Novel techniques for the design and practical realization of switched-capacitor circuits in deep-submicron CMOS technologies

Dissertação apresentada para obtenção do Grau de Doutor em Engenharia Electrotécnica e de Computadores pela Universidade Nova de Lisboa, Faculdade de Ciências e TecnologiaSwitches presenting high linearity are more and more required in switched-capacitor circuits,namely in 12 to 16 bits resolution analog-to-digital converters. The CMOS technology evolves continuously towards lower supply voltages and, simultaneously, new design techniques are necessary to fulfill the realization of switches exhibiting a high dynamic range and a distortion compatible with referred resolutions. Moreover, with the continuously downing of the sizes, the physic constraints of the technology must be considered to avoid the excessive stress of the devices when relatively high voltages are applied to the gates. New switch-linearization techniques, with high reliability, must be necessarily developed and demonstrated in CMOS integrated circuits. Also, the research of new structures of circuits with switched-capacitor is permanent. Simplified and efficient structures are mandatory, adequate to the new demands emerging from the proliferation of portable equipments, necessarily with low energy consumption while assuring high performance and multiple functions. The work reported in this Thesis comprises these two areas. The behavior of the switches under these new constraints is analyzed, being a new and original solution proposed, in order to maintain the performance. Also, proposals for the application of simpler clock and control schemes are presented, and for the use of open-loop structures and amplifiers with localfeedback. The results, obtained in laboratory or by simulation, assess the feasibility of the presented proposals

Front-end Electronics for Silicon Trackers readout in Deep Sub-Micron CMOS Technology: The case of Silicon strips at the ILC

For the years to come, Silicon strips detectors will be read using the smallest available integrated technologies for room, transparency, and power considerations. CMOS, Bipolar- CMOS and Silicon-Germanium are presently offered in deepsubmicron (250 down to 90nm) at affordable cost through worldwide integrated circuits multiproject centers. As an example, a 180nm CMOS readout prototype chip has been designed and tested, and gave satisfactory results in terms of noise and power. Beam tests are under work, and prospectives in 130nm will be presented