382 research outputs found

    Enhanced Responsivity of Photodetectors Realized via Impact Ionization

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    To increase the responsivity is one of the vital issues for a photodetector. By employing ZnO as a representative material of ultraviolet photodetectors and Si as a representative material of visible photodetectors, an impact ionization process, in which additional carriers can be generated in an insulating layer at a relatively large electric field, has been employed to increase the responsivity of a semiconductor photodetector. It is found that the responsivity of the photodetectors can be enhanced by tens of times via this impact ionization process. The results reported in this paper provide a general route to enhance the responsivity of a photodetector, thus may represent a step towards high-performance photodetectors

    Miniaturized Silicon Photodetectors

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    Silicon (Si) technologies provide an excellent platform for the design of microsystems where photonic and microelectronic functionalities are monolithically integrated on the same substrate. In recent years, a variety of passive and active Si photonic devices have been developed, and among them, photodetectors have attracted particular interest from the scientific community. Si photodiodes are typically designed to operate at visible wavelengths, but, unfortunately, their employment in the infrared (IR) range is limited due to the neglectable Si absorption over 1100 nm, even though the use of germanium (Ge) grown on Si has historically allowed operations to be extended up to 1550 nm. In recent years, significant progress has been achieved both by improving the performance of Si-based photodetectors in the visible range and by extending their operation to infrared wavelengths. Near-infrared (NIR) SiGe photodetectors have been demonstrated to have a ā€œzero changeā€ CMOS process flow, while the investigation of new effects and structures has shown that an all-Si approach could be a viable option to construct devices comparable with Ge technology. In addition, the capability to integrate new emerging 2D and 3D materials with Si, together with the capability of manufacturing devices at the nanometric scale, has led to the development of new device families with unexpected performance. Accordingly, this Special Issue of Micromachines seeks to showcase research papers, short communications, and review articles that show the most recent advances in the field of silicon photodetectors and their respective applications

    State-of-the-art all-silicon sub-bandgap photodetectors at telecom and datacom wavelengths

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    Silicon-based technologies provide an ideal platform for the monolithic integration of photonics and microelectronics. In this context, a variety of passive and active silicon photonic devices have been developed to operate at telecom and datacom wavelengths, at which silicon has minimal optical absorption - due to its bandgap of 1.12 eV. Although in principle this transparency window limits the use of silicon for optical detection at wavelengths above 1.1Ā Ī¼m, in recent years tremendous advances have been made in the field of all-silicon sub-bandgap photodetectors at telecom and datacom wavelengths. By taking advantage of emerging materials and novel structures, these devices are becoming competitive with the more well-established technologies, and are opening new and intriguing perspectives. In this paper, a review of the state-of-the-art is presented. Devices based on defect-mediated absorption, two-photon absorption and the internal photoemission effect are reported, their working principles are elucidated and their performance discussed and compared

    Spatially controlled electrostatic doping in graphene p-i-n junction for hybrid silicon photodiode

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    Sufficiently large depletion region for photocarrier generation and separation is a key factor for two-dimensional material optoelectronic devices, but few device configurations has been explored for a deterministic control of a space charge region area in graphene with convincing scalability. Here we investigate a graphene-silicon p-i-n photodiode defined in a foundry processed planar photonic crystal waveguide structure, achieving visible - near-infrared, zero-bias and ultrafast photodetection. Graphene is electrically contacting to the wide intrinsic region of silicon and extended to the p an n doped region, functioning as the primary photocarrier conducting channel for electronic gain. Graphene significantly improves the device speed through ultrafast out-of-plane interfacial carrier transfer and the following in-plane built-in electric field assisted carrier collection. More than 50 dB converted signal-to-noise ratio at 40 GHz has been demonstrated under zero bias voltage, with quantum efficiency could be further amplified by hot carrier gain on graphene-i Si interface and avalanche process on graphene-doped Si interface. With the device architecture fully defined by nanomanufactured substrate, this study is the first demonstration of post-fabrication-free two-dimensional material active silicon photonic devices.Comment: NPJ 2D materials and applications (2018

    Multiphysics modelling of high-speed optoelectronic devices for silicon photonics platforms

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    L'abstract ĆØ presente nell'allegato / the abstract is in the attachmen

    Advanced germanium p-i-n and avalanche photodetectors for low-power optical interconnects

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    Characterization And Optimization Of Avalanche Photodiodes Fabricated By Standard Cmos Process For High-Speed High-Speed Photoreceivers

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    A dissertation presented on the characterization and optimization of avalanche photodiodes fabricated by standard CMOS process (CMOS-APD) for high-speed photoreceivers, beginning with the theory and principle related to photodetector and avalanche photodiodes, followed by characterization,optimization, and wavelength dependence of CMOS-APD, and finally link up with the transimpedance amplifier. nMOS-type and pMOS-type silicon avalanche photodiodes were fabricated by standard 0.18 Ī¼m CMOS process, and the currentvoltage characteristic and the frequency response of the CMOS-APDs with and without the guard ring structure were measured. CMOS-APDs have features of high avalanche gain below 10 V, wide bandwidth over 5 GHz, and easy integration with electronic circuits. In CMOS-APDs, guard ring structure is introduced for high-speed operation with the role of elimination the slow photo generated carriers in a deep layer and a substrate. The bandwidth of the CMOS-APD is enhanced with the guard ring structure at a sacrifice of the responsivity. Based on comparison of nMOS-type and pMOS-type APDs, the nMOS-type APD is more suitable for high-speed operation. The bandwidth is enhanced with decreasing the spacing of interdigital electrodes due to decreased carrier transit time and with decreasing the detection area and the PAD size for RF probing due to decreased device capacitance. Thus, an nMOS-type APD with the electrode spacing of 0.84 Ī¼m, the detection area of 10 x 10 Ī¼mĀ², the PAD size for RF probing of 30 x 30 Ī¼mĀ² along with the guard ring structure was fabricated. As a results, the maximum bandwidth of 8.4 GHz at the avalanche gain of about 10 and the gain-bandwidth product of 280 GHz were achieved. Furthermore, the wavelength dependence of the responsivity and the bandwidth of the CMOS-APDs with and without the guard ring structure also revealed. At a wavelength of 520 nm or less, there is no difference in the responsivity and the frequency response because all the illuminated light is absorbed in the p+-layer and the Nwell due to strong light absorption of Si. On the other hand, a part of the incident light is absorbed in the Psubstrate and the photo-generated carriers in the P-substrate are eliminated by the guard ring structure for the wavelength longer than 520 nm, and then bandwidth was remarkably enhanced at the sacrifice of the responsivity. In addition, to achieve high-speed photoreceivers, two types of TIA which are common-source and regulated-cascode TIAs were simulated by utilizing the output of the CMOSAPDs.The figure of merits of gain-bandwidth product was used to find the ideal results of the transimpedance gain and bandwidth performance due to trade-offs between both of them. The common-source TIA produced the transimpedance gain of 22.17 dBĪ©, the bandwidth of 21.21 GHz and the gain-bandwidth product of 470.23 THz Ɨ dBĪ©. Besides that, the simulated results of the regulated-cascade TIA configuration demonstrate 79.45 dBĪ© transimpedance gain, 10.64 GHz bandwidth, and 845.35 THz Ɨ dBĪ© gain-bandwidth product. Both of these TIA results meet the target of this research and further encouraging this successful CMOS-APDs to realize high-speed photoreceivers

    GaN/AlGaN-based UV photodetectors with performances exceeding the PMTS

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    Ankara : The Department of Physics and the Institute of Engineering and Science of Bilkent University, 2008.Thesis (Ph.D.) -- Bilkent University, 2008.Includes bibliographical references leaves 73-80.The recent developments in high Al-content AlxGa1āˆ’xN material growth technology made it possible to fabricate high performance solar-blind photodetectors operating in the ultraviolet (UV) spectral region with improved receiver sensitivity, low noise, low dark current density, and high speed. AlGaN-based Schottky, p-i-n, and metal-semiconductor-metal photodetectors (MSM) with very high performances have already been demonstrated. The UVfiltering nature of the atmospheric ozone molecules blocks the solar radiation to reach the earthā€™s surface for wavelengths shorter than 280 nm. In this case, UV photodetectors with cutoff wavelengths around 280 nm, which are also called solarblind detectors, can detect very weak UV signals under intense background radiation. These devices have important applications including missile plume detection, chemical/biological agent sensing, flame alarms, covert space-tospace and submarine communications, ozone-layer monitoring, and gas detection. Due to their high responsivity (600 A/W), high speed, high cathode gain (on the order of a million), and low dark current properties, photomultiplier tubes (PMTs) are frequently used in such applications. However, PMTs are very expensive and bulky. Besides, they require a cooling system, and they have high operation voltages in excess of 1000 V. To achieve solar-blind detection, PMTs should also be integrated with complex and expensive filters. In order to avoid these disadvantages, high performance solid-state UV photodetectors with high internal gain are needed. Wide band-gap semiconductor photodetectors, such as AlxGa1āˆ’xN with x=0.4, are ideal candidates for this purpose. These devices are intrinsically solar blind, in which no additional filters are needed, they have low noise, and fast response times. The lack of high internal gain has been the major limitation for the usage of AlGaN photodetectors for applications that require high sensitivity detectors. There have been several theoretical research works that examined the avalanche effect in GaN and AlGaN-based structures. However, reproducible high gain in AlGaN-based APDs is still a major limitation. We have designed, fabricated, GaN/AlGaN based photodetectors, and according to characterization measurements, the Schottky, p-i-n, and avalanche detectors have high performance in terms of quantum efficiency, dark current, detectivity, high speed response, and high reproducible avalanche gain.Tut, TurgutPh.D
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