Fault-tolerant sub-lithographic design with rollback recovery

Shrinking feature sizes and energy levels coupled with high clock rates and decreasing node capacitance lead us into a regime where transient errors in logic cannot be ignored. Consequently, several recent studies have focused on feed-forward spatial redundancy techniques to combat these high transient fault rates. To complement these studies, we analyze fine-grained rollback techniques and show that they can offer lower spatial redundancy factors with no significant impact on system performance for fault rates up to one fault per device per ten million cycles of operation (Pf = 10^-7) in systems with 10^12 susceptible devices. Further, we concretely demonstrate these claims on nanowire-based programmable logic arrays. Despite expensive rollback buffers and general-purpose, conservative analysis, we show the area overhead factor of our technique is roughly an order of magnitude lower than a gate level feed-forward redundancy scheme

Scalable Energy-Recovery Architectures.

Energy efficiency is a critical challenge for today's integrated circuits, especially for high-end digital signal processing and communications that require both high throughput and low energy dissipation for extended battery life. Charge-recovery logic recovers and reuses charge using inductive elements and has the potential to achieve order-of-magnitude improvement in energy efficiency while maintaining high performance. However, the lack of large-scale high-speed silicon demonstrations and inductor area overheads are two major concerns. This dissertation focuses on scalable charge-recovery designs. We present a semi-automated design flow to enable the design of large-scale charge-recovery chips. We also present a new architecture that uses in-package inductors, eliminating the area overheads caused by the use of integrated inductors in high-performance charge-recovery chips. To demonstrate our semi-automated flow, which uses custom-designed standard-cell-like dynamic cells, we have designed a 576-bit charge-recovery low-density parity-check (LDPC) decoder chip. Functioning correctly at clock speeds above 1 GHz, this prototype is the first-ever demonstration of a GHz-speed charge-recovery chip of significant complexity. In terms of energy consumption, this chip improves over recent state-of-the-art LDPCs by at least 1.3 times with comparable or better area efficiency. To demonstrate our architecture for eliminating inductor overheads, we have designed a charge-recovery LDPC decoder chip with in-package inductors. This test-chip has been fabricated in a 65nm CMOS flip-chip process. A custom 6-layer FC-BGA package substrate has been designed with 16 inductors embedded in the fifth layer of the package substrate, yielding higher Q and significantly improving area efficiency and energy efficiency compared to their on-chip counterparts. From measurements, this chip achieves at least 2.3 times lower energy consumption with better area efficiency over state-of-the-art published designs.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116653/1/terryou_1.pd

A 90 nm CMOS 16 Gb/s Transceiver for Optical Interconnects

Interconnect architectures which leverage high-bandwidth optical channels offer a promising solution to address the increasing chip-to-chip I/O bandwidth demands. This paper describes a dense, high-speed, and low-power CMOS optical interconnect transceiver architecture. Vertical-cavity surface-emitting laser (VCSEL) data rate is extended for a given average current and corresponding reliability level with a four-tap current summing FIR transmitter. A low-voltage integrating and double-sampling optical receiver front-end provides adequate sensitivity in a power efficient manner by avoiding linear high-gain elements common in conventional transimpedance-amplifier (TIA) receivers. Clock recovery is performed with a dual-loop architecture which employs baud-rate phase detection and feedback interpolation to achieve reduced power consumption, while high-precision phase spacing is ensured at both the transmitter and receiver through adjustable delay clock buffers. A prototype chip fabricated in 1 V 90 nm CMOS achieves 16 Gb/s operation while consuming 129 mW and occupying 0.105 mm^2

The 30/20 GHz flight experiment system, phase 2. Volume 2: Experiment system description

A detailed technical description of the 30/20 GHz flight experiment system is presented. The overall communication system is described with performance analyses, communication operations, and experiment plans. Hardware descriptions of the payload are given with the tradeoff studies that led to the final design. The spacecraft bus which carries the payload is discussed and its interface with the launch vehicle system is described. Finally, the hardwares and the operations of the terrestrial segment are presented

Application of advanced on-board processing concepts to future satellite communications systems

An initial definition of on-board processing requirements for an advanced satellite communications system to service domestic markets in the 1990's is presented. An exemplar system architecture with both RF on-board switching and demodulation/remodulation baseband processing was used to identify important issues related to system implementation, cost, and technology development