Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

Temporal and spatial combining for 5G mmWave small cells

This chapter proposes the combination of temporal processing through Rake combining based on direct sequence-spread spectrum (DS-SS), and multiple antenna beamforming or antenna spatial diversity as a possible physical layer access technique for fifth generation (5G) small cell base stations (SBS) operating in the millimetre wave (mmWave) frequencies. Unlike earlier works in the literature aimed at previous generation wireless, the use of the beamforming is presented as operating in the radio frequency (RF) domain, rather than the baseband domain, to minimise power expenditure as a more suitable method for 5G small cells. Some potential limitations associated with massive multiple input-multiple output (MIMO) for small cells are discussed relating to the likely limitation on available antennas and resultant beamwidth. Rather than relying, solely, on expensive and potentially power hungry massive MIMO (which in the case of a SBS for indoor use will be limited by a physically small form factor) the use of a limited number of antennas, complimented with Rake combining, or antenna diversity is given consideration for short distance indoor communications for both the SBS) and user equipment (UE). The proposal’s aim is twofold: to solve eroded path loss due to the effective antenna aperture reduction and to satisfy sensitivity to blockages and multipath dispersion in indoor, small coverage area base stations. Two candidate architectures are proposed. With higher data rates, more rigorous analysis of circuit power and its effect on energy efficiency (EE) is provided. A detailed investigation is provided into the likely design and signal processing requirements. Finally, the proposed architectures are compared to current fourth generation long term evolution (LTE) MIMO technologies for their anticipated power consumption and EE

Pulse interspersing in static multipath chip environments for Impulse Radio communications

Communications are becoming the bottleneck in the performance of Chip Multiprocessor (CMP). To address this issue, the use of wireless communications within a chip has been proposed, since they offer a low latency among nodes and high reconfigurability. The chip scenario has the particularity that is static, and the multipath can be known a priori. Within this context, we propose in this paper a simple yet very efficient modulation technique, based on Impulse Radio-On–Off-Keying (IR-OOK), which significantly optimizes the performance in Wireless Network-on-Chip (WNoC) as well as off-chip scenarios. This technique is based on interspersing information pulses among the reflected pulses in order to reduce the time between pulses, thus increasing the data rate. We prove that the final data rate can be considerably increased without increasing the hardware complexity of the transceiver.Peer ReviewedPostprint (published version

Design Considerations of a Sub-50 {\mu}W Receiver Front-end for Implantable Devices in MedRadio Band

Emerging health-monitor applications, such as information transmission through multi-channel neural implants, image and video communication from inside the body etc., calls for ultra-low active power (<50${\mu}$W) high data-rate, energy-scalable, highly energy-efficient (pJ/bit) radios. Previous literature has strongly focused on low average power duty-cycled radios or low power but low-date radios. In this paper, we investigate power performance trade-off of each front-end component in a conventional radio including active matching, down-conversion and RF/IF amplification and prioritize them based on highest performance/energy metric. The analysis reveals 50${\Omega}$ active matching and RF gain is prohibitive for 50${\mu}$W power-budget. A mixer-first architecture with an N-path mixer and a self-biased inverter based baseband LNA, designed in TSMC 65nm technology show that sub 50${\mu}$W performance can be achieved up to 10Mbps (< 5pJ/b) with OOK modulation.Comment: Accepted to appear on International Conference on VLSI Design 2018 (VLSID

OrthoNoC: a broadcast-oriented dual-plane wireless network-on-chip architecture

© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksOn-chip communication remains as a key research issue at the gates of the manycore era. In response to this, novel interconnect technologies have opened the door to new Network-on-Chip (NoC) solutions towards greater scalability and architectural flexibility. Particularly, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. This work presents ORTHONOC, a wired-wireless architecture that differs from existing proposals in that both network planes are decoupled and driven by traffic steering policies enforced at the network interfaces. With these and other design decisions, ORTHONOC seeks to emphasize the ordered broadcast advantage offered by the wireless technology. The performance and cost of ORTHONOC are first explored using synthetic traffic, showing substantial improvements with respect to other wired-wireless designs with a similar number of antennas. Then, the applicability of ORTHONOC in the multiprocessor scenario is demonstrated through the evaluation of a simple architecture that implements fast synchronization via ordered broadcast transmissions. Simulations reveal significant execution time speedups and communication energy savings for 64-threaded benchmarks, proving that the value of ORTHONOC goes beyond simply improving the performance of the on-chip interconnect.Peer ReviewedPostprint (author's final draft

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system