Low power signal processing research at Stanford

This paper gives an overview of the research being conducted at Stanford University's Space, Telecommunications, and Radioscience Laboratory in the area of low energy computation. It discusses the work we are doing in large scale digital VLSI neural networks, interleaved processor and pipelined memory architectures, energy estimation and optimization, multichip module packaging, and low voltage digital logic

Ultra low power CMOS technology

This paper discusses the motivation, opportunities, and problems associated with implementing digital logic at very low voltages, including the challenge of making use of the available real estate in 3D multichip modules, energy requirements of very large neural networks, energy optimization metrics and their impact on system design, modeling problems, circuit design constraints, possible fabrication process modifications to improve performance, and barriers to practical implementation

Channel Characterization for Chip-scale Wireless Communications within Computing Packages

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses.Comment: To be presented 12th IEEE/ACM International Symposium on Networks-on-Chip (NOCS 2018); Torino, Italy; October 201

Center for Aeronautics and Space Information Sciences

This report summarizes the research done during 1991/92 under the Center for Aeronautics and Space Information Science (CASIS) program. The topics covered are computer architecture, networking, and neural nets

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Channel characterization for chip-scale wireless communications within computing packages

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses.Peer ReviewedPostprint (author's final draft

Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

Real-Time Prediction of Power Electronic Device Temperatures Using PRBS-Generated Frequency-Domain Thermal Cross Coupling Characteristics

This paper presents a technique to predict the temperature response of a multielement thermal system based on the thermal cross coupling between elements. The complex frequency-domain cross coupling of devices is first characterized using a pseudorandom binary sequence technique. The characteristics are then used to predict device temperatures for a known input power waveform using a discrete Fourier transform-based technique. The resulting prediction shows good agreement with an example practical system used for evaluation. To reduce the computational complexity of the initial method, a digital infinite impedance response (IIR) filter is fitted to each cross coupling characteristic. A high correlation fit is demonstrated that produces a near-identical temperature response compared to the initial procedure while requiring fewer mathematical operations. Experimental validation on the practical system shows good agreement between IIR filter predictions and practical results. It is further demonstrated that this agreement can be substantially improved by taking feedback from an internal reference temperature. Additionally, the proposed IIR filter technique allows the efficient calculation of future device temperatures based on simulated input, facilitating future temperature predictions

Scaling of MOS Technology to Submicrometer Feature Sizes

Industries based on MOS technology now play a prominent role in the developed and the developing world. More importantly, MOS technology drives a large proportion of innovation in many technologies. It is likely that the course of technological development depends more on the capability of MOS technology than on any other technical factor. Therefore, it is worthwhile investigating the nature and limits of future improvements to MOS fabrication. The key to improved MOS technology is reduction in feature size. Reduction in feature size, and the attendant changes in device behaviour, will shape the nature of effective uses of the technology at the system level. This paper reviews recent, and historical, data on feature scaling and device behavior, and attempts to predict the limits to this scaling. We conclude with some remarks on the system-level implications of feature size as the minimum size approaches physical limits