3,753 research outputs found

    Embedded co-processor architecture for CMOS based image acquisition

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    Embedded Co-Processor Architecture for CMOS Based Image Acquisition

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    This paper describes a new co-processor architecture designed for CMOS sensor imaging. The co-processor unit is integrated into the image acquisition loop so as to exploit the full potential of CMOS selective access imaging technology. The processing features of the coprocessor are functional to the specific acquisition process of CMOS sensors (random region acquisition, variable image size, variable acquisition modes line/region based, multi-exposition images). Moreover, although built with pipelined or parallel HW processing modules, the co-processor architecture has been designed so as to obtain a unit that can be configured on the fly, in terms of type and number of chained processing, during the image acquisition process that is defined by the application. Simulated performances based on a FPGA implementation, are reported and compared to classical image acquisition systems based on PC platforms

    Form Factor Improvement of Smart-Pixels for Vision Sensors through 3-D Vertically- Integrated Technologies

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    While conventional CMOS active pixel sensors embed only the circuitry required for photo-detection, pixel addressing and voltage buffering, smart pixels incorporate also circuitry for data processing, data storage and control of data interchange. This additional circuitry enables data processing be realized concurrently with the acquisition of images which is instrumental to reduce the number of data needed to carry to information contained into images. This way, more efficient vision systems can be built at the cost of larger pixel pitch. Vertically-integrated 3D technologies enable to keep the advnatges of smart pixels while improving the form factor of smart pixels.Office of Naval Research N000141110312Ministerio de Ciencia e Innovación IPT-2011-1625-43000

    CMOS Vision Sensors: Embedding Computer Vision at Imaging Front-Ends

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    CMOS Image Sensors (CIS) are key for imaging technol-ogies. These chips are conceived for capturing opticalscenes focused on their surface, and for delivering elec-trical images, commonly in digital format. CISs may incor-porate intelligence; however, their smartness basicallyconcerns calibration, error correction and other similartasks. The term CVISs (CMOS VIsion Sensors) definesother class of sensor front-ends which are aimed at per-forming vision tasks right at the focal plane. They havebeen running under names such as computational imagesensors, vision sensors and silicon retinas, among others. CVIS and CISs are similar regarding physical imple-mentation. However, while inputs of both CIS and CVISare images captured by photo-sensors placed at thefocal-plane, CVISs primary outputs may not be imagesbut either image features or even decisions based on thespatial-temporal analysis of the scenes. We may hencestate that CVISs are more “intelligent” than CISs as theyfocus on information instead of on raw data. Actually,CVIS architectures capable of extracting and interpretingthe information contained in images, and prompting reac-tion commands thereof, have been explored for years inacademia, and industrial applications are recently ramp-ing up.One of the challenges of CVISs architects is incorporat-ing computer vision concepts into the design flow. Theendeavor is ambitious because imaging and computervision communities are rather disjoint groups talking dif-ferent languages. The Cellular Nonlinear Network Univer-sal Machine (CNNUM) paradigm, proposed by Profs.Chua and Roska, defined an adequate framework forsuch conciliation as it is particularly well suited for hard-ware-software co-design [1]-[4]. This paper overviewsCVISs chips that were conceived and prototyped at IMSEVision Lab over the past twenty years. Some of them fitthe CNNUM paradigm while others are tangential to it. Allthem employ per-pixel mixed-signal processing circuitryto achieve sensor-processing concurrency in the quest offast operation with reduced energy budget.Junta de Andalucía TIC 2012-2338Ministerio de Economía y Competitividad TEC 2015-66878-C3-1-R y TEC 2015-66878-C3-3-

    MorphIC: A 65-nm 738k-Synapse/mm2^2 Quad-Core Binary-Weight Digital Neuromorphic Processor with Stochastic Spike-Driven Online Learning

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    Recent trends in the field of neural network accelerators investigate weight quantization as a means to increase the resource- and power-efficiency of hardware devices. As full on-chip weight storage is necessary to avoid the high energy cost of off-chip memory accesses, memory reduction requirements for weight storage pushed toward the use of binary weights, which were demonstrated to have a limited accuracy reduction on many applications when quantization-aware training techniques are used. In parallel, spiking neural network (SNN) architectures are explored to further reduce power when processing sparse event-based data streams, while on-chip spike-based online learning appears as a key feature for applications constrained in power and resources during the training phase. However, designing power- and area-efficient spiking neural networks still requires the development of specific techniques in order to leverage on-chip online learning on binary weights without compromising the synapse density. In this work, we demonstrate MorphIC, a quad-core binary-weight digital neuromorphic processor embedding a stochastic version of the spike-driven synaptic plasticity (S-SDSP) learning rule and a hierarchical routing fabric for large-scale chip interconnection. The MorphIC SNN processor embeds a total of 2k leaky integrate-and-fire (LIF) neurons and more than two million plastic synapses for an active silicon area of 2.86mm2^2 in 65nm CMOS, achieving a high density of 738k synapses/mm2^2. MorphIC demonstrates an order-of-magnitude improvement in the area-accuracy tradeoff on the MNIST classification task compared to previously-proposed SNNs, while having no penalty in the energy-accuracy tradeoff.Comment: This document is the paper as accepted for publication in the IEEE Transactions on Biomedical Circuits and Systems journal (2019), the fully-edited paper is available at https://ieeexplore.ieee.org/document/876400

    A versatile sensor interface for programmable vision systems-on-chip

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    This paper describes an optical sensor interface designed for a programmable mixed-signal vision chip. This chip has been designed and manufactured in a standard 0.35μm n-well CMOS technology with one poly layer and five metal layers. It contains a digital shell for control and data interchange, and a central array of 128 × 128 identical cells, each cell corresponding to a pixel. Die size is 11.885 × 12.230mm2 and cell size is 75.7μm × 73.3μm. Each cell contains 198 transistors dedicated to functions like processing, storage, and sensing. The system is oriented to real-time, single-chip image acquisition and processing. Since each pixel performs the basic functions of sensing, processing and storage, data transferences are fully parallel (image-wide). The programmability of the processing functions enables the realization of complex image processing functions based on the sequential application of simpler operations. This paper provides a general overview of the system architecture and functionality, with special emphasis on the optical interface.European Commission IST-1999-19007Office of Naval Research (USA) N00014021088

    ACE16K: A 128×128 focal plane analog processor with digital I/O

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    This paper presents a new generation 128×128 focal-plane analog programmable array processor (FPAPAP), from a system level perspective, which has been manufactured in a 0.35 μm standard digital 1P-5M CMOS technology. The chip has been designed to achieve the high-speed and moderate-accuracy (8b) requirements of most real time early-vision processing applications. It is easily embedded in conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four millions transistors, 90% of them working in analog mode, and exhibits a relatively low power consumption-<4 W, i.e. less than 1 μW per transistor. Computing vs. power peak values are in the order of 1 TeraOPS/W, while maintained VGA processing throughputs of 100 frames/s are possible with about 10-20 basic image processing tasks on each frame

    A mixed-signal early vision chip with embedded image and programming memories and digital I/O

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    From a system level perspective, this paper presents a 128 × 128 flexible and reconfigurable Focal-Plane Analog Programmable Array Processor, which has been designed as a single chip in a 0.35μm standard digital 1P-5M CMOS technology. The core processing array has been designed to achieve high-speed of operation and large-enough accuracy (∼ 7bit) with low power consumption. The chip includes on-chip program memory to allow for the execution of complex, sequential and/or bifurcation flow image processing algorithms. It also includes the structures and circuits needed to guarantee its embedding into conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four million transistors, 90% of them working in analog mode. The chip features up to 330GOPs (Giga Operations per second), and uses the power supply (180GOP/Joule) and the silicon area (3.8 GOPS/mm2) efficiently, as it is able to maintain VGA processing throughputs of 100Frames/s with about 15 basic image processing tasks on each frame

    Efficient Smart CMOS Camera Based on FPGAs Oriented to Embedded Image Processing

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    This article describes an image processing system based on an intelligent ad-hoc camera, whose two principle elements are a high speed 1.2 megapixel Complementary Metal Oxide Semiconductor (CMOS) sensor and a Field Programmable Gate Array (FPGA). The latter is used to control the various sensor parameter configurations and, where desired, to receive and process the images captured by the CMOS sensor. The flexibility and versatility offered by the new FPGA families makes it possible to incorporate microprocessors into these reconfigurable devices, and these are normally used for highly sequential tasks unsuitable for parallelization in hardware. For the present study, we used a Xilinx XC4VFX12 FPGA, which contains an internal Power PC (PPC) microprocessor. In turn, this contains a standalone system which manages the FPGA image processing hardware and endows the system with multiple software options for processing the images captured by the CMOS sensor. The system also incorporates an Ethernet channel for sending processed and unprocessed images from the FPGA to a remote node. Consequently, it is possible to visualize and configure system operation and captured and/or processed images remotely

    An IoT Endpoint System-on-Chip for Secure and Energy-Efficient Near-Sensor Analytics

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    Near-sensor data analytics is a promising direction for IoT endpoints, as it minimizes energy spent on communication and reduces network load - but it also poses security concerns, as valuable data is stored or sent over the network at various stages of the analytics pipeline. Using encryption to protect sensitive data at the boundary of the on-chip analytics engine is a way to address data security issues. To cope with the combined workload of analytics and encryption in a tight power envelope, we propose Fulmine, a System-on-Chip based on a tightly-coupled multi-core cluster augmented with specialized blocks for compute-intensive data processing and encryption functions, supporting software programmability for regular computing tasks. The Fulmine SoC, fabricated in 65nm technology, consumes less than 20mW on average at 0.8V achieving an efficiency of up to 70pJ/B in encryption, 50pJ/px in convolution, or up to 25MIPS/mW in software. As a strong argument for real-life flexible application of our platform, we show experimental results for three secure analytics use cases: secure autonomous aerial surveillance with a state-of-the-art deep CNN consuming 3.16pJ per equivalent RISC op; local CNN-based face detection with secured remote recognition in 5.74pJ/op; and seizure detection with encrypted data collection from EEG within 12.7pJ/op.Comment: 15 pages, 12 figures, accepted for publication to the IEEE Transactions on Circuits and Systems - I: Regular Paper
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