Adhesion test for UTCP structure in humid environment

Ultra-Thin Chip Packaging (UTCP) technology enables the integration of off-the-shelf integrated circuits into thin substrates such as different kinds of circuit boards. This technology has been created at CMST during many years of intensive study. In this technology the thinned chip is embedded into polyimide and a copper fan-out is created to form the connections between the chip and the circuit board. This technology is compatible with standard circuit board manufacturing technology, which makes it an attractive solution to create miniaturized packages for electronics. In this paper the reliability of UTCP structure was studied using adhesion peel testing. The different solutions for constructing the material layers inside a UTCP were compared for their adhesion. Special test structures were manufactured for testing. The tested material layers consisted of polyimide, benzocyclobutene (BCB) and adhesion promoter for BCB. Altogether four different constructions were tested and the peel testing was done to half of the samples right after manufacturing and to the other half after exposure in 85/85 –environment for 500h. The results show difference in adhesion after exposure to humidity. Test structures with BCB suffer from loss of adhesion in PI – BCB interface after exposure to moisture. This result addresses that the structure is more reliable when the amount of different materials and interfaces is decreased

Neural net device for IED gas identification

Most of the embedded systems that detect gases today are for specific types and indicate the levels of the gas present with their standard sensors. We introduce here an adaptable system that can detect and distinguish the type of gas in a volatile environment such as searching for Improvised Explosive Devices (IEDs). This is achieved with a small device mounted on a mobile robot through the use of an algorithm that is an Artificial Neural Network (ANN). The input layer to the ANN is an array of environmental and gas sensors. The small device, comprising of a multilayer circuit board with sensors in a rugged lightweight case, mounts on the mobile robot and communicates the gaseous data to the robot. The ANN is implemented in the hardware of a FPGA with the control of the ANN being achieved through the configurable processor and memory. Calibration and testing of the device involves the training of device and the ANN with specific target gases. The Accuracy of the device is validated through lab testing against high-end gas test instruments with known concentrations of gases

Bridging the Testing Speed Gap: Design for Delay Testability

The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, expensive testers are not always capable of testing these ICs because of their high-speed limitations. This paper focuses on a design for delay testability technique such that high-speed ICs can be tested using inexpensive, low-speed ATE. Also extensions for possible full BIST of delay faults are addresse

Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form

An innovative method for rapid prototyping (RP) of electronic circuits with components characteristic of typical electronics applications was demonstrated using an enhanced version of a previously developed hybrid stereolithography (SL) and direct write (DW) system, where an existing SL machine was integrated with a three-axis DW fluid dispensing system for combined arbitrary form electronic systems manufacturing. This paper presents initial efforts at embedding functional electronic circuits using the hybrid SL/DW system. A simple temperature-sensitive circuit was selected, which oscillated an LED at a frequency proportional to the temperature sensed by the thermistor. The circuit was designed to incorporate all the required electronic components within a 2.5” x 2” x 0.5” SL part. Electrical interconnects between electronic components were deposited on the SL part with a DW system using silver conductive ink lines. Several inks were deposited, cured, and tested on a variety of SL resin substrates, and the E 1660 ink (Ercon Inc, Wareham, MA) was selected due to its measured lowest average resistivity on the SL substrates. The finished circuit was compared with Printed Circuit Board (PCB) technology for functionality. The electronic components used here include a low voltage battery, LM 555 timer chip, resistors, a thermistor, capacitors, and Light Emitting Diodes (LEDs). This circuit was selected because it (1) represented a simple circuit combining many typically used electronic components and thus provided a useful demonstration for integrated electronic systems manufacturing applicable to a wide variety of devices, and (2) provided an indication of the parasitic resistances and capacitances introduced by the fabrication process due to its sensitivity to manufacturing variation. The hybrid technology can help achieve significant size reductions, enable systems integration in atypical forms, a natural resistance to reverse engineering and possibly increase maximum operating temperatures of electronic circuits as compared to the traditional PCB process. This research demonstrates the ability of the hybrid SL/DW technology for fabricating combined electronic systems for unique electronics applications in which arbitrary form is a requirement and traditional PCB technology cannot be used.Mechanical Engineerin

The integration of on-line monitoring and reconfiguration functions using IEEE1149.4 into a safety critical automotive electronic control unit.

This paper presents an innovative application of IEEE 1149.4 and the integrated diagnostic reconfiguration (IDR) as tools for the implementation of an embedded test solution for an automotive electronic control unit, implemented as a fully integrated mixed signal system. The paper describes how the test architecture can be used for fault avoidance with results from a hardware prototype presented. The paper concludes that fault avoidance can be integrated into mixed signal electronic systems to handle key failure modes

Piezoelectric vibration energy harvesting from airflow in HVAC (Heating Ventilation and Air Conditioning) systems

This study focuses on the design and wind tunnel testing of a high efficiency Energy Harvesting device, based on piezoelectric materials, with possible applications for the sustainability of smart buildings, structures and infrastructures. The development of the device was supported by ESA (the European Space Agency) under a program for the space technology transfer in the period 2014-2016. The EH device harvests the airflow inside Heating, Ventilation and Air Conditioning (HVAC) systems, using a piezoelectric component and an appropriate customizable aerodynamic appendix or fin that takes advantage of specific airflow phenomena (vortex shedding and galloping), and can be implemented for optimizing the energy consumption inside buildings. Focus is given on several relevant aspects of wind tunnel testing: different configurations for the piezoelectric bender (rectangular, cylindrical and T-shaped) are tested and compared, and the effective energy harvesting potential of a working prototype device is assessed

A software controlled voltage tuning system using multi-purpose ring oscillators

This paper presents a novel software driven voltage tuning method that utilises multi-purpose Ring Oscillators (ROs) to provide process variation and environment sensitive energy reductions. The proposed technique enables voltage tuning based on the observed frequency of the ROs, taken as a representation of the device speed and used to estimate a safe minimum operating voltage at a given core frequency. A conservative linear relationship between RO frequency and silicon speed is used to approximate the critical path of the processor. Using a multi-purpose RO not specifically implemented for critical path characterisation is a unique approach to voltage tuning. The parameters governing the relationship between RO and silicon speed are obtained through the testing of a sample of processors from different wafer regions. These parameters can then be used on all devices of that model. The tuning method and software control framework is demonstrated on a sample of XMOS XS1-U8A-64 embedded microprocessors, yielding a dynamic power saving of up to 25% with no performance reduction and no negative impact on the real-time constraints of the embedded software running on the processor

Implementation of packaged integrated antenna with embedded front end for Bluetooth applications

The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today’s printed circuit board manufacturing capability. A commercially available Bluetooth integrated chip was chosen as the chipset of our demonstrator, and a package integrated antenna together with an embedded front end completes the system in package integration. The front end developed here is based on an embedded meander line combline filter and an embedded transformer balun. The filter has a 35% area reduction when compared with the classical combline filter and similar performance. The balun has the coils distributed on three layers that minimized the board area needed it and optimizes the performances. The proposed packaged integrated antenna approach is successfully demonstrated here and the new module shows excellent performance when compared with a commercial solution, surpassing the normal Bluetooth class II dongle range which is up to 10 m and increasing the module range up to 120 m without an extra power amplifier