Capacitance and Inductance Matrices for Multistrip Structures in Multilayered Anisotropic Dielectrics

In this paper we present a unified variational approach to determine the capacitance and inductance matrices of generalized multistrip systems embedded in a multilayered iso/anisotropic dielectric lossless medium. The analysis is carried out in the spectral domain to take advantage of previously obtained recurrence relations which calculate the Green's function in the spectral domain. The method leads to a low-order system of linear equations, which is shown explicitly. Examples and comparison with previously published results have been included

Incorporation of feed-network and circuit modeling into the time-domain finite element analysis of antenna arrays and microwave circuits

In this dissertation, accurate and efficient numerical algorithms are developed to incorporate the feed-network and circuit modeling into the time-domain finite element analysis of antenna arrays and microwave circuits. First, simulation of an antenna system requires accurate modeling of interactions between the radiating elements and the associated feeding network. In this work, a feed network is represented in terms of its scattering matrix in a rational function form in the frequency domain that enables its interfacing with the time-domain finite element modeling of the antenna elements through a fast recursive time-convolution algorithm. The exchange of information between the antenna elements and the feed network occurs through the incident and reflected modal voltages/currents at properly defined port interfaces. The proposed numerical scheme allows a full utilization of the advanced antenna simulation techniques, and significantly extends the current antenna modeling capability to the system level. Second, a hybrid field-circuit solver that combines the capabilities of the time-domain finite element method and a lumped circuit analysis is developed for accurate and efficient characterization of complicated microwave circuits that include both distributive and lumped-circuit components. The distributive portion of the device is modeled by the time-domain finite element method to generate a finite element subsystem, while the lumped circuits are analyzed by a SPICE-like circuit solver to generate a circuit subsystem. A global system for both the finite-element and circuit unknowns is established by combining the two subsystems through coupling matrices to model their interactions. For simulations of even more complicated mixed-scale circuit systems that contain pre-characterized blocks of discrete circuit elements, the hybrid field-circuit analysis implemented a systematic and efficient algorithm to incorporate multiport lumped networks in terms of frequency-dependent admittance matrices. Other advanced features in the hybrid field-circuit solver include application of the tree-cotree splitting algorithm and introduction of a flexible time-stepping scheme. Various numerical examples are presented to validate the implementation and demonstrate the accuracy, efficiency, and applications of the proposed numerical algorithms

Architectures, Antennas and Circuits for Millimeter-wave Wireless Full-Duplex Applications

Demand for wireless network capacity keeps growing exponentially every year, as a result a 1000-fold increase in data traffic is projected over the next 10 years in the context of 5G wireless networks. Solutions for delivering the 1000-fold increase in capacity fall into three main categories: deploying smaller cells, allocating more spectrum and improving spectral efficiency of wireless systems. Smaller cells at RF frequencies (1-6GHz) are unlikely to deliver the demanded capacity increase. On the other hand, millimeter-wave spectrum (frequencies over 24GHz) offers wider, multi-GHz channel bandwidths, and therefore has gained significant research interest as one of the most promising solutions to address the data traffic demands of 5G. Another disruptive technology is full-duplex which breaks a century-old assumption in wireless communication, by simultaneous transmission and reception on the same frequency channel. In doing so, full-duplex offers many benefits for wireless networks, including an immediate spectral efficiency improvement in the physical layer. Although FD promises great benefits, self-interference from the transmitter to its own receiver poses a fundamental challenge. The self-interference can be more than a billion times stronger than the desired signal and must be suppressed below the receiver noise floor. In recent years, there has been some research efforts on fully-integrated full-duplex RF transceivers, but mm-wave fully-integrated full-duplex systems, are still in their infancy. This dissertation presents novel architectures, antenna and circuit techniques to merge two exciting technologies, mm-wave and full-duplex, which can potentially offer the dual benefits of wide bandwidths and improved spectral efficiency. To this end, two different antenna interfaces, namely a wideband reconfigurable T/R antenna pair with polarization-based antenna cancellation and an mm-wave fully-integrated magnetic-free non-reciprocal circulator, are presented. The polarization-based antenna cancellation is employed in conjunction with the RF and digital cancellation to design a 60GHz full-duplex 45nm SOI CMOS transceiver with nearly 80dB self-interference suppression. The concepts and prototypes presented in this dissertation have also profound implications for emerging applications such as vehicular radars, 5G small-cell base-stations and virtual reality

Additively Manufactured RF Components, Packaging, Modules, and Flexible Modular Phased Arrays Enabling Widespread Massively Scalable mmWave/5G Applications

The 5G era is here and with it comes many challenges, particularily facing the high frequency mmWave adoption. This is because of the cost to implement such dense networks is much greater due to the high propagation losses of signals that range from 26 GHz to 40 GHz. Therefore there needs to be a way to utilize a method of fabrication that can change with the various environments that 5G will be deployed in, be it dense urban areas or suburban sprawl. In this research, the focus is on making these RF components utilized for 5G at low cost and modular with a focus on additive manufacturing. Since additive manufacturing is a rapid prototyping technique, the technology can be quickly adjusted and altered to meet certain specifications with negligible overhead. Several areas of research will be explored. Firstly, various RF passive components such as additively manufactured antennas and couplers with a combination hybrid inkjet and 3D printing will be discussed. Passive components are critical for evaluating the process of additive manufacturing for high frequency operation. Secondly, various structures will be evaluated specifically for packaging mmWave ICs, including interconnects, smart packaging and encapsulants for use in single or multichip modules. Thirdly, various antenna fabrication techniques will be explored which enables fully integrated ICs with antennas, called System on Antenna (SoA) which utilizes both inkjet and 3D printing to combine antennas and ICs into modules. These modules, can then be built into arrays in a modular fashion, allowing for large or smaller arrays to be assembled on the fly. Finally, a method of calibrating the arrays is introduced, utilizing inkjet printed sensors. This allows the sensor to actively detect bends and deformations in the array and restore optimal antenna array performance. Built for flexible phased arrays, the sensor is designed for implementation for ubiquitous use, meaning that its can be placed on any surface, which enables widespread use of 5G technologies.Ph.D

Microwave design of multi-layer interposers for the packaging of photonic integrated circuits

The increasing growth of data traffic on the Internet is supported by innovations in high-speed photonic devices. Some of this novel photonic devices are photonic integrated circuits (PICs) that use higher speeds, have higher circuit density and integrate more heterogeneous devices. A new generation of photonic packaging is also required to handle the increasing device density and data rate of the PICs. An important element to package the PICs is the carrier board which also serves as an interposer between the PIC and the package. The usual interposer material for PICs is a single-layer aluminium nitride (AlN) substrate due to its high thermal conductivity and good microwave performance. In contrast, other high-speed and high-density applications use multi-layer substrates as carrier boards. The typical multi-layer technologies for high-speed interposers is low-temperature co-fired ceramic (LTCC). The motivation of this research is the need of multi-layer interposers suitable for the packaging of high-speed and high-density PICs. A key element to enable this multi-layer interposer is the high-speed channels. The task of this research was the microwave design of these high-speed channels for a multi-layer interposer and carrier board suitable for PICs. The main findings of this research can be divided into three areas. First, improvements to the microwave theory. A novel impedance profile reconstruction algorithm based on time-domain reflectometry (TDR) was developed. Additionally, a novel set of equations to calculate the characteristic impedance and the complex propagation constant from the vector network analyser (VNA) measurements of long lines was found and tested with positive results. Also, a novel single impedance thru-only de-embedding algorithm was completed. Second, the design of a novel rotatable vertical transition. The vertical transition has a 3 dB bandwidth around 35 GHz and small penalties on the eye diagram at 40 Gbit s−1 . Third, positive measured results of these designs in co-fired AlN. The measurements of the co-fired AlN board show similar results than in an LTCC board proving that co-fired AlN is an attractive option for PICs where the thermal management is important. The main conclusion from these findings is that the designed transmission lines and vertical transitions are suitable for the use of LTCC or of co-fired AlN as multi-layer interposers for the packaging of high-speed PICs Future work include improvements to the novel microwave algorithms, the development of equation-based models for the transmission lines. Also, the vertical transition has a resonance around 35 GHz that could be compensated using stubs or other elements. Finally, the transmission line designs and vertical transition designs need to be used for real applications of high-speed PICs using LTCC or co-fired AlN

La modélisation de l’immunité des circuits intégrés au-delà de 1 GHz

Electromagnetic Compatibility (EMC) is the faculty of working devices to co-exist electromagnetically. In practice, it turns out to be very complex to create electromagnetically compatible devices. The weapon to succeed the complex challenge of creating First-Time-Right (FTR) compatible devices is modelling. This thesis investigates whether it makes sense to model the conducted immunity of Integrated Circuits (ICs) beyond 1 GHz and how to do that. If the Printed Circuit Board (PCB) traces determine a PCB's radiated immunity, it is interesting to predict their coupling efficiency and to understand how that depends on the trace routing. Because full-wave solvers are slow and do not yield understanding, the existing Taylor cell model is modified to yield another 100 times speedup and an insightful upper bound, for vertically polarised, grazing-incident plane wave illumination of electrically long, multi-segment traces with arbitrary terminal loads. The results up to 20 GHz match with full-wave simulations to within 2.6 dB average absolute error and with Gigahertz Transverse Electromagnetic-cell (GTEM-cell) measurements to within 4.0 dB average absolute error. If the conducted immunity of ICs is interesting above 1 GHz, a measurement method is needed that is valid beyond 1 GHz. There is no standardised method yet, because with rising frequency, the common measurement set-up increasingly obscures the IC's immunity. An attempt to model and remove the set-up's impact on the measurement result proved difficult. Therefore, a simplified set-up and extraction method is proposed and a proof-of-concept of the automatic generation of the set-up's PCB is given. The conducted immunity of an LM7805 voltage regulator is measured up to 4.2 GHz to demonstrate the method. Except for a general trend of rising frequencies, there is only little concrete proof for the relevance of IC immunity modelling beyond 1 GHz. A full-wave simulation suggests that up to 10 GHz, most energy enters the die via the trace. Similarly, the radiated immunity of a microstrip trace and an LM7805 voltage regulator is predicted by concatenating the models developed above. Although this model neglects the radiated immunity of the IC itself, the prediction corresponds with GTEM-cell measurement to within 2.1 dB average absolute error. These experiments suggest the most radiation enters a PCB via its traces, well beyond 1 GHz, hence it is useful to model the conducted immunity of IC beyond 1 GHz. Therefore, the extension of IEC 62132-4 to 10 GHz should be seriously considered. Moreover, the speed and transparency of the modified Taylor model for field-to-trace coupling open up new possibilities for computer-aided design. The semi-automatic generation of lean extraction PCB could facilitate model extraction. There are also critical remaining questions, remaining to be answered.La compatibilité électromagnétique (CEM) est l'aptitude des produits électroniques à coexister au niveau électromagnétique. Dans la pratique, c'est une tâche très complexe que de concevoir des produits compatibles. L'arme permettant de concevoir des produits bon-du-premier-coup est la modélisation. Cette thèse étudie l'utilité et la faisabilité de la modélisation de l'immunité des circuits intégrés (CI) au-delà de 1 GHz. Si les pistes des circuits imprimés déterminent l'immunité rayonnée de ces circuits, il serait pertinent de pouvoir prévoir l'efficacité de couplage et de comprendre comment elle découle du routage des pistes. Les solveurs full-wave sont lents et ne contribuent pas à la compréhension. En conséquence, un modèle existant (la cellule de Taylor) est modifié de manière à ce que son temps de calcul soit divisé par 100. De plus, ce modèle modifié est capable de fournir une explication de la limite supérieure pour le couplage d'une onde plane, rasante et polarisée verticalement vers une piste de plusieurs segments, électriquement longue et avec des terminaisons arbitraires. Les résultats jusqu'à 20 GHz corrèlent avec des simulations fullwave à une erreur absolue moyenne de 2,6 dB près et avec des mesures en cellule GTEM (Gigahertz Transversale Electromagnétique) à une erreur absolue moyenne de 4,0 dB près. Si l'immunité conduite des CI est intéressante au-delà de 1 GHz, il faut une méthode de mesure, valable au-delà de 1 GHz. Actuellement, il n'y a pas de méthode normalisée, car la fréquence élevée fausse les observations faites avec la manipulation normalisée. Il est difficile de modéliser et de compenser le comportement de la manipulation normalisée. Par conséquent, une manipulation simplifiée et sa méthode d'extraction correspondante sont proposées, ainsi qu'une démonstration du principe de génération automatique de la carte d'essai utilisée dans la manipulation simplifiée. Pour illustrer la méthode simplifiée, l'immunité conduite d'un régulateur de tension LM7805 est mesurée jusqu'à 4,2 GHz. À part la tendance générale des fréquences qui montent, il y a peu de preuve concrète qui étaye la pertinence de la modélisation de l'immunité conduite des CI au-delà de 1 GHz. Une simulation full-wave suggère que jusqu'à 10 GHz, la plus grande partie de l'énergie rentre dans la puce à travers la piste. Par concaténation des modèles développés ci-dessus, l'immunité rayonnée d'une piste micro-ruban et d'un régulateur de tension LM7805 est prédite. Bien que ce modèle néglige l'immunité rayonnée du CI lui-même, la prédiction corrèle avec des mesures en cellule GTEM à une erreur absolue de 2,1 dB en moyenne. Ces expériences suggèrent que la plus grande partie du rayonnement entre dans un circuit imprimé à travers ses pistes, bien au-delà de 1 GHz. Dans ce cas, la modélisation de l'immunité conduite au-delà de 1 GHz serait utile. Par conséquent, l'extension jusqu'à 10 GHz de la méthode de mesure CEI 62132-4 devrait être considérée. De plus, la vitesse et la transparence du modèle de Taylor modifié pour le couplage champ-à-ligne permettent des innovations dans la conception assistée par l'ordinateur. La génération semiautomatique des cartes d'essais dites maigres pourrait faciliter l'extraction des modèles. Certaines questions critiques et importantes demeurent ouvertes

A feasibility study of unmanned rendezvous and docking in Mars orbit. Volume 2: Technical studies and results

For abstract, see N75-14801

NASA Tech Briefs, September 1990

Topics covered include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences

Modeling EMI Resulting from a Signal Via Transition Through Power/Ground Layers

Signal transitioning through layers on vias are very common in multi-layer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current must switch from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in noise on the power bus that can lead to signal integrity, as well as EMI problems. Numerical methods, such as the finite-difference time-domain (FDTD), Moment of Methods (MoM), and partial element equivalent circuit (PEEC) method, were employed herein to study this problem. The modeled results are supported by measurements. In addition, a common EMI mitigation approach of adding a decoupling capacitor was investigated with the FDTD method

The Third International Symposium on Space Terahertz Technology: Symposium proceedings

Papers from the symposium are presented that are relevant to the generation, detection, and use of the terahertz spectral region for space astronomy and remote sensing of the Earth's upper atmosphere. The program included thirteen sessions covering a wide variety of topics including solid-state oscillators, power-combining techniques, mixers, harmonic multipliers, antennas and antenna arrays, submillimeter receivers, and measurement techniques