Addressing the Smart Systems Design Challenge: The SMAC Platform

This article presents the concepts, the organization, and the preliminary application results of SMAC, a smart systems co-design platform. The SMAC platform, which has been developed as Integrated Project (IP) of the 7th ICT Call under the Objective 3.2 \u201cSmart components and Smart Systems integration\u201d addresses the challenges of the integration of heterogeneous and conflicting domains that emerge in the design of smart systems. SMAC includes methodologies and EDA tools enabling multi-disciplinary and multi-scale modelling and design, simulation of multidomain systems, subsystems and components at different levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics. The article presents the preliminary results obtained by adopting the SMAC platform for the design of a limb tracking smart system

Modellierung, Simulation und Optimierung integrierter Schaltkreise

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UNIFIED MODELLING TECHNIQUE USING VHDL-AMS AND SOFTWARE COMPONENTS

International audienceThe paper deals with the dynamic modeling of mechatronic devices, which usually need detailed modeling to be described and to take into account the physical properties of the system. VHDL-AMS 1 , which is a powerful unified modeling language for mixed system, allows to describe a large range of physical systems, for their dynamic simulation. It allows to describe models of physical components and then to connect them to obtain the model of a system.. However, this language cannot support the description of some physical phenomena, such local ones, defined by numerical methods (e.g.: finite element method, special numerical integrals). When an aspect of a model cannot be described in VHDL-AMS, the paper proposes to use software components. So, the aim of the paper is to propose a generic way to extend the computation capability of VHDL-AMS, by coupling the models described in VHDL-AMS with external ones specified as software components (where VHDL-AMS fails). The approach has been applied on several applications, among them the time simulation of an electrical plunge

RF-MEMS for high-performance and widely reconfigurable passive components – A review with focus on future telecommunications, Internet of Things (IoT) and 5G applications

Abstract Since its first discussions in literature during late '90s, RF-MEMS technology (i.e. Radio Frequency MicroElectroMechanical-Systems) has been showing uncommon potential in the realisation of high-performance and widely reconfigurable RF passives for radio and telecommunication systems. Nevertheless, against the most confident forecasts sparkling around the successful exploitation of RF-MEMS technology in mass-market applications, with the mobile phone segment first in line, already commencing from the earliest years of the 2000s, the first design wins for MEMS-based RF passives have started to be announced just in late 2014. Beyond the disappointment of all the most flattering market forecasts and, on the other hand, the effective employment of RF-MEMS in niche applications (like in very specific space and defence scenarios), there were crucial aspects, not fully considered since the beginning, that impaired the success of such a technology in large-market and consumer applications. Quite unexpectedly, the context has changed rather significantly in recent years. The smartphones market segment started to generate a factual need for highly reconfigurable and high-performance RF passive networks, and this circumstance is increasing the momentum of RF-MEMS technology that was expected to take place more than one decade ago. On a broader landscape, the Internet of Things (IoT) and the even wider paradigm of the Internet of Everything (IoE) seem to be potential fields of exploitation for high-performance and highly reconfigurable passive components in RF-MEMS technology. This work frames the current state of RF-MEMS market exploitation, analysing the main reasons impairing in past years the proper employment of Microsystem technology based RF passive components. Moreover, highlights on further expansion of RF-MEMS solutions in mobile and telecommunication systems will be briefly provided and discussed

Design of electronic systems for automotive sensor conditioning

This thesis deals with the development of sensor systems for automotive, mainly targeting the exploitation of the new generation of Micro Electro-Mechanical Sensors (MEMS), which achieve a dramatic reduction of area and power consumption but at the same time require more complexity in the sensor conditioning interface. Several issues concerning the development of automotive ASICs are presented, together with an overview of automotive electronics market and its main sensor applications. The state of the art for sensor interfaces design (the generic sensor interface concept), consists in sharing the same electronics among similar sensor applications, thus saving cost and time-to-market but also implementing a sub-optimal system with area and power overheads. A Platform Based Design methodology is proposed to overcome the limitations of generic sensor interfaces, by keeping the platform generality at the highest design layers and pursuing the maximum optimization and performances in the platform customization for a specific sensor. A complete design flow is presented (up to the ASIC implementation for gyro sensor conditioning), together with examples regarding IP development for reuse and low power optimization of third party designs. A further evolution of Platform Based Design has been achieved by means of implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform. ISIF is a highly programmable mixed-signal chip which allows a substantial reduction of design space exploration time, as it can implement in a short time a wide class of sensor conditioning architectures. Thus it lets the designers evaluate directly on silicon the impact of different architectural choices, as well as perform feasibility studies, sensor evaluations and accurate estimation of the resulting dedicated ASIC performances. Several case studies regarding fast prototyping possibilities with ISIF are presented: a magneto-resistive position sensor, a biosensor (which produces pA currents in presence of surface chemical reactions) and two capacitive inertial sensors, a gyro and a low-g YZ accelerometer. The accelerometer interface has also been implemented in miniboards of about 3 cm2 (with ISIF and sensor dies bonded together) and a series of automatic trimming and characterization procedures have been developed in order to evaluate sensor and interface behaviour over the automotive temperature range, providing a valuable feedback for the implementation of a dedicated accelerometer interface