Developing an advanced module for back-contact solar cells

This paper proposes a novel concept for integrating ultrathin solar cells into modules. It is conceived as a method for fabricating solar panels starting from back-contact crystalline silicon solar cells. However, compared to the current state of the art in module manufacturing for back-contact solar cells, this novel concept aims at improvements in performance, reliability, and cost through the use of an alternative encapsulant, namely silicones as opposed to ethylene vinyl acetate, an alternative deposition technology, being wet coating as opposed to dry lamination; and alternative module-level metallization techniques, as opposed to cell-level tabbing-stringing or conductive foil interconnects. The process flow is proposed, and the materials and fabrication technologies are discussed. As the durability of the module, translated into the module's lifetime, is very important in the targeted application, namely solar cell modules, modeling and reliability testing results and considerations are presented to illustrate how the experimental development process may be guided by experience and theoretical derivations. Finally, feasibility is demonstrated in some first proofs of the concept, and an outlook is given pointing out the direction for further research

Refractive uses of layered and two-dimensional materials for integrated photonics

The scientific community has witnessed tremendous expansion of research on layered (i.e. two-dimensional, 2D) materials, with increasing recent focus on applications to photonics. Layered materials are particularly exciting for manipulating light in the confined geometry of photonic integrated circuits, where key material properties include strong and controllable light-matter interaction, and limited optical loss. Layered materials feature tunable optical properties, phases that are promising for electro-optics, and a panoply of polymorphs that suggest a rich design space for highly-nonperturbative photonic integrated devices based on phase-change functionality. All of these features are manifest in materials with band gap above the photonics-relevant near-infrared (NIR) spectral band ($\sim$ 0.5 - 1 eV), meaning that they can be harnessed in refractive (i.e. non-absorptive) applications.Comment: review paper. ACS Photonics (2020

The Boston University Photonics Center annual report 2016-2017

This repository item contains an annual report that summarizes activities of the Boston University Photonics Center in the 2016-2017 academic year. The report provides quantitative and descriptive information regarding photonics programs in education, interdisciplinary research, business innovation, and technology development. The Boston University Photonics Center (BUPC) is an interdisciplinary hub for education, research, scholarship, innovation, and technology development associated with practical uses of light.This has undoubtedly been the Photonics Center’s best year since I became Director 10 years ago. In the following pages, you will see highlights of the Center’s activities in the past year, including more than 100 notable scholarly publications in the leading journals in our field, and the attraction of more than 22 million dollars in new research grants/contracts. Last year I had the honor to lead an international search for the first recipient of the Moustakas Endowed Professorship in Optics and Photonics, in collaboration with ECE Department Chair Clem Karl. This professorship honors the Center’s most impactful scholar and one of the Center’s founding visionaries, Professor Theodore Moustakas. We are delighted to haveawarded this professorship to Professor Ji-Xin Cheng, who joined our faculty this year.The past year also marked the launch of Boston University’s Neurophotonics Center, which will be allied closely with the Photonics Center. Leading that Center will be a distinguished new faculty member, Professor David Boas. David and I are together leading a new Neurophotonics NSF Research Traineeship Program that will provide $3M to promote graduate traineeships in this emerging new field. We had a busy summer hosting NSF Sites for Research Experiences for Undergraduates, Research Experiences for Teachers, and the BU Student Satellite Program. As a community, we emphasized the theme of “Optics of Cancer Imaging” at our annual symposium, hosted by Darren Roblyer. We entered a five-year second phase of NSF funding in our Industry/University Collaborative Research Center on Biophotonic Sensors and Systems, which has become the centerpiece of our translational biophotonics program. That I/UCRC continues to focus on advancing the health care and medical device industries

The future circular collider study

At the end of 2018, a large worldwide collaboration, withcontributors from more than 350 institutes completed theconceptual design of the Future Circular Collider (FCC),a∼100 km accelerator infrastructure linked to the existingCERN complex, that would open up the way to the post-LHC era in particle physics. We present an overview of thetwo main accelerator options considered in the design study,namely the lepton collider (FCC-ee), serving as highest-luminosity Higgs and electroweak factory, and the 100-TeVenergy-frontier hadron collider (FCC-hh), along with theongoing technological R&D efforts and the planned nextsteps. A recently approved EU co-funded project, the FCCInnovation Study (FCCIS), will refine the design of the lep-ton collider and prepare the actual implementation of theFCC, in collaboration with European and global partners,and with the local authorities

Nanoenergetic Materials for MEMS: A Review

New energetic materials (EMs) are the key to great advances in microscale energy-demanding systems as actuation part, igniter, propulsion unit, and power. Nanoscale EMs (nEMs)particularly offer the promise of much higher energy densities, faster rate of energy release, greater stability, and more security sensitivity to unwanted initiation). nEMs could therefore give response to microenergetics challenges. This paper provides a comprehensive review of current research activities in nEMs for microenergetics application. While thermodynamic calculations of flame temperature and reaction enthalpies are tools to choose desirable EMs, they are not sufficient for the choice of good material for microscale application where thermal losses are very penalizing. A strategy to select nEM is therefore proposed based on an analysis of the material diffusivity and heat of reaction. Finally, after a description of the different nEMs synthesis approaches, some guidelines for future investigations are provided

25th Space Photovoltaic Research and Technology Conference

The attached document contains abstracts of presentations from the 25th Space Photovoltaic Research and Technology (SPRAT) Conference held in Cleveland, OH from September 19 to 21, 2018. The abstracts represent work that furthers the advancement of space solar power ranging from the cell level to full arrays in flight. For additional information on any presentation, please contact the author using the information provided with each abstract

Functional-Material-Based Touch Interfaces for Multidimensional Sensing for Interactive Displays: A Review

Multidimensional sensing is a highly desired attribute for allowing human-machine interfaces (HMIs) to perceive various types of information from both users and the environment, thus enabling the advancement of various smart electronics/applications, e.g., smartphones and smart cities. Conventional multidimensional sensing is achieved through the integration of multiple discrete sensors, which introduces issues such as high energy consumption and high circuit complexity. These disadvantages have motivated the widespread use of functional materials for detecting various stimuli at low cost with low power requirements. This work presents an overview of simply structured touch interfaces for multidimensional (x-y location, force and temperature) sensing enabled by piezoelectric, piezoresistive, triboelectric, pyroelectric and thermoelectric materials. For each technology, the mechanism of operation, state-of-the-art designs, merits, and drawbacks are investigated. At the end of the article, the author discusses the challenges limiting the successful applications of functional materials in commercial touch interfaces and corresponding development trends

Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach

Ever growing demands for portability and functionality have always governed the electronic technology innovations. IC downscaling with Moore s law and system miniaturization with System-On-Package (SOP) paradigm has resulted and will continue to result in ultraminiaturized systems with unprecedented functionality at reduced cost. The trend towards 3D silicon system integration is expected to downscale IC I/O pad pitches from 40µm to 1- 5 µm in future. Device- to- system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. As supply currents will increase upto 220 A by 2012, the current density will exceed the maximum allowable current density of solders. The intrinsic delay and electromigration in solders are other daunting issues that become critical at nanometer size technology nodes. In addition, formation of intermetallics is also a bottleneck that poses significant mechanical issues. Recently, many research groups have investigated various techniques for copper-copper direct bonding. Typically, bonding is carried out at 400oC for 30 min followed by annealing for 30 min. High thermal budget in such process makes it less attractive for integrated systems because of the associated process incompatibilities. In the present study, copper-copper bonding at ultra fine-pitch using advanced nano-conductive and non-conductive adhesives is evaluated. The proposed copper-copper based interconnects using advanced conductive and non-conductive adhesives will be a new fundamental and comprehensive paradigm to solve all the four barriers: 1) I/O pitch 2) Electrical performance 3) Reliability and 4) Cost. This thesis investigates the mechanical integrity and reliability of copper-copper bonding using advanced adhesives through test vehicle fabrication and reliability testing. Test vehicles were fabricated using low cost electro-deposition techniques and assembled onto glass carrier. Experimental results show that proposed copper-copper bonding using advanced adhesives could potentially meet all the system performance requirements for the emerging micro/nano-systems.M.S.Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Ra

Technology for large space systems: A bibliography with indexes (supplement 20)

This bibliography lists 694 reports, articles, and other documents introduced into the NASA Scientific and Technical Information System between July, 1988 and December, 1988. Its purpose is to provide helpful information to the researcher or manager engaged in the development of technologies related to large space systems. Subject areas include mission and program definition, design techniques, structural and thermal analysis, structural dynamics and control systems, electronics, advanced materials, assembly concepts, and propulsion