Physical Design of Optoelectronic System-on-a-Chip/Package Using Electrical and Optical Interconnects: CAD Tools and Algorithms

Current electrical systems are faced with the limitation in performance by the electrical interconnect technology determining overall processing speed. In addition, the electrical interconnects containing many long distance interconnects require high power to drive. One of the best ways to overcome these bottlenecks is through the use of optical interconnect to limit interconnect latency and power. This research explores new computer-aided design algorithms for developing optoelectronic systems. These algorithms focus on place and route problems using optical interconnections covering system-on-a-chip design as well as system-on-a-package design. In order to design optoelectronic systems, optical interconnection models are developed at first. The CAD algorithms include optical interconnection models and solve place and route problems for optoelectronic systems. The MCNC and GSRC benchmark circuits are used to evaluate these algorithms.Ph.D.Committee Chair: Abhijit Chatterjee; Committee Member: C. P. Wong; Committee Member: David E. Schimmel; Committee Member: John A. Buck; Committee Member: Madhavan Swaminatha

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Interconnects architectures for many-core era using surface-wave communication

PhD ThesisNetworks-on-chip (NoCs) is a communication paradigm that has emerged aiming to address on-chip communication challenges and to satisfy interconnection demands for chip-multiprocessors (CMPs). Nonetheless, there is continuous demand for even higher computational power, which is leading to a relentless downscaling of CMOS technology to enable the integration of many-cores. However, technology downscaling is in favour of the gate nodes over wires in terms of latency and power consumption. Consequently, this has led to the era of many-core processors where power consumption and performance are governed by inter-core communications rather than core computation. Therefore, NoCs need to evolve from being merely metalbased implementations which threaten to be a performance and power bottleneck for many-core efficiency and scalability. To overcome such intensified inter-core communication challenges, this thesis proposes a novel interconnect technology: the surface-wave interconnect (SWI). This new RF-based on-chip interconnect has notable characteristics compared to cutting-edge on-chip interconnects in terms of CMOS compatibility, high speed signal propagation, low power dissipation, and massive signal fan-out. Nonetheless, the realization of the SWI requires investigations at different levels of abstraction, such as the device integration and RF engineering levels. The aim of this thesis is to address the networking and system level challenges and highlight the potential of this interconnect. This should encourage further research at other levels of abstraction. Two specific system-level challenges crucial in future many-core systems are tackled in this study, which are cross-the-chip global communication and one-to-many communication. This thesis makes four major contributions towards this aim. The first is reducing the NoC average-hop count, which would otherwise increase packet-latency exponentially, by proposing a novel hybrid interconnect architecture. This hybrid architecture can not only utilize both regular metal-wire and SWI, but also exploits merits of both bus and NoC architectures in terms of connectivity compared to other general-purpose on-chip interconnect architectures. The second contribution addresses global communication issues by developing a distance-based weighted-round-robin arbitration (DWA) algorithm. This technique prioritizes global communication to be send via SWI short-cuts, which offer more efficient power dissipation and faster across-the-chip signal propagation. Results obtained using a cycleaccurate simulator demonstrate the effectiveness of the proposed system architecture in terms of significant power reduction, considervii able average delay reduction and higher throughput compared to a regular NoC. The third contribution is in handling multicast communications, which are normally associated with traffic overload, hotspots and deadlocks and therefore increase, by an order of magnitude the power consumption and latency. This has been achieved by proposing a novel routing and centralized arbitration schemes that exploits the SWI0s remarkable fan-out features. The evaluation demonstrates drastic improvements in the effectiveness of the proposed architecture in terms of power consumption ( 2-10x) and performance ( 22x) but with negligible hardware overheads ( 2%). The fourth contribution is to further explore multicast contention handling in a flexible decentralized manner, where original techniques such as stretch-multicast and ID-tagging flow control have been developed. A comparison of these techniques shows that the decentralized approach is superior to the centralized approach with low traffic loads, while the latter outperforms the former near and after NoC saturation

High Input/output Density Optoelectronic Probe Card For Wafer-level Test Of Electrical And Optical Interconnect Components, Methods Of Fabrication, And Methods Of Use

Optoelectronic probe cards, methods of fabrication, and methods of use, are disclosed. Briefly described, one exemplary embodiment includes an optoelectronic probe card adapted to test an electrical quality and an optical quality of an optoelectronic structure under test having electrical and optical components.Georgia Tech Research Corporatio

On Multicast in Asynchronous Networks-on-Chip: Techniques, Architectures, and FPGA Implementation

In this era of exascale computing, conventional synchronous design techniques are facing unprecedented challenges. The consumer electronics market is replete with many-core systems in the range of 16 cores to thousands of cores on chip, integrating multi-billion transistors. However, with this ever increasing complexity, the traditional design approaches are facing key issues such as increasing chip power, process variability, aging, thermal problems, and scalability. An alternative paradigm that has gained significant interest in the last decade is asynchronous design. Asynchronous designs have several potential advantages: they are naturally energy proportional, burning power only when active, do not require complex clock distribution, are robust to different forms of variability, and provide ease of composability for heterogeneous platforms. Networks-on-chip (NoCs) is an interconnect paradigm that has been introduced to deal with the ever-increasing system complexity. NoCs provide a distributed, scalable, and efficient interconnect solution for today’s many-core systems. Moreover, NoCs are a natural match with asynchronous design techniques, as they separate communication infrastructure and timing from the computational elements. To this end, globally-asynchronous locally-synchronous (GALS) systems that interconnect multiple processing cores, operating at different clock speeds, using an asynchronous NoC, have gained significant interest. While asynchronous NoCs have several advantages, they also face a key challenge of supporting new types of traffic patterns. Once such pattern is multicast communication, where a source sends packets to arbitrary number of destinations. Multicast is not only common in parallel computing, such as for cache coherency, but also for emerging areas such as neuromorphic computing. This important capability has been largely missing from asynchronous NoCs. This thesis introduces several efficient multicast solutions for these interconnects. In particular, techniques, and network architectures are introduced to support high-performance and low-power multicast. Two leading network topologies are the focus: a variant mesh-of-trees (MoT) and a 2D mesh. In addition, for a more realistic implementation and analysis, as well as significantly advancing the field of asynchronous NoCs, this thesis also targets synthesis of these NoCs on commercial FPGAs. While there has been significant advances in FPGA technologies, there has been only limited research on implementing asynchronous NoCs on FPGAs. To this end, a systematic computeraided design (CAD) methodology has been introduced to efficiently and safely map asynchronous NoCs on FPGAs. Overall, this thesis makes the following three contributions. The first contribution is a multicast solution for a variant MoT network topology. This topology consists of simple low-radix switches, and has been used in high-performance computing platforms. A novel local speculation technique is introduced, where a subset of the network’s switches are speculative that always broadcast every packet. These switches are very simple and have high performance. Speculative switches are surrounded by non-speculative ones that route packets based on their destinations and also throttle any redundant copies created by the former. This hybrid network architecture achieved significant performance and power benefits over other multicast approaches. The second contribution is a multicast solution for a 2D-mesh topology, which is more complex with higher-radix switches and also is more commonly used. A novel continuous-time replication strategy is introduced to optimize the critical multi-way forking operation of a multicast transmission. In this technique, a multicast packet is first stored in an input port of a switch, from where it is sent through distinct output ports towards different destinations concurrently, at each output’s own rate and in continuous time. This strategy is shown to have significant latency and energy benefits over an approach that performs multicast using multiple distinct serial unicasts to each destination. Finally, a systematic CAD methodology is introduced to synthesize asynchronous NoCs on commercial FPGAs. A two-fold goal is targeted: correctness and high performance. For ease of implementation, only existing FPGA synthesis tools are used. Moreover, since asynchronous NoCs involve special asynchronous components, a comprehensive guide is introduced to map these elements correctly and efficiently. Two asynchronous NoC switches are synthesized using the proposed approach on a leading Xilinx FPGA in 28 nm: one that only handles unicast, and the other that also supports multicast. Both showed significant energy benefits with some performance gains over a state-of-the-art synchronous switch