New generation of interactive platforms based on novel printed smart materials

Programa doutoral em Engenharia Eletrónica e de Computadores (área de Instrumentação e Microssistemas Eletrónicos)The last decade was marked by the computer-paradigm changing with other digital devices suddenly becoming available to the general public, such as tablets and smartphones. A shift in perspective from computer to materials as the centerpiece of digital interaction is leading to a diversification of interaction contexts, objects and applications, recurring to intuitive commands and dynamic content that can proportionate more interesting and satisfying experiences. In parallel, polymer-based sensors and actuators, and their integration in different substrates or devices is an area of increasing scientific and technological interest, which current state of the art starts to permit the use of smart sensors and actuators embodied within the objects seamlessly. Electronics is no longer a rigid board with plenty of chips. New technological advances and perspectives now turned into printed electronics in polymers, textiles or paper. We are assisting to the actual scaling down of computational power into everyday use objects, a fusion of the computer with the material. Interactivity is being transposed to objects erstwhile inanimate. In this work, strain and deformation sensors and actuators were developed recurring to functional polymer composites with metallic and carbonaceous nanoparticles (NPs) inks, leading to capacitive, piezoresistive and piezoelectric effects, envisioning the creation of tangible user interfaces (TUIs). Based on smart polymer substrates such as polyvinylidene fluoride (PVDF) or polyethylene terephthalate (PET), among others, prototypes were prepared using piezoelectric and dielectric technologies. Piezoresistive prototypes were prepared with resistive inks and restive functional polymers. Materials were printed by screen printing, inkjet printing and doctor blade coating. Finally, a case study of the integration of the different materials and technologies developed is presented in a book-form factor.A última década foi marcada por uma alteração do paradigma de computador pelo súbito aparecimento dos tablets e smartphones para o público geral. A alteração de perspetiva do computador para os materiais como parte central de interação digital levou a uma diversificação dos contextos de interação, objetos e aplicações, recorrendo a comandos intuitivos e conteúdos dinâmicos capazes de tornarem a experiência mais interessante e satisfatória. Em simultâneo, sensores e atuadores de base polimérica, e a sua integração em diferentes substratos ou dispositivos é uma área de crescente interesse científico e tecnológico, e o atual estado da arte começa a permitir o uso de sensores e atuadores inteligentes perfeitamente integrados nos objetos. Eletrónica já não é sinónimo de placas rígidas cheias de componentes. Novas perspetivas e avanços tecnológicos transformaram-se em eletrónica impressa em polímeros, têxteis ou papel. Neste momento estamos a assistir à redução da computação a objetos do dia a dia, uma fusão do computador com a matéria. A interatividade está a ser transposta para objetos outrora inanimados. Neste trabalho foram desenvolvidos atuadores e sensores e de pressão e de deformação com recurso a compostos poliméricos funcionais com tintas com nanopartículas (NPs) metálicas ou de base carbónica, recorrendo aos efeitos capacitivo, piezoresistivo e piezoelétrico, com vista à criação de interfaces de usuário tangíveis (TUIs). Usando substratos poliméricos inteligentes tais como fluoreto de polivinilideno (PVDF) ou politereftalato de etileno (PET), entre outos, foi possível a preparação de protótipos de tecnologia piezoelétrica ou dielétrica. Os protótipos de tecnologia piezoresistiva foram feitos com tintas resistivas e polímeros funcionais resistivos. Os materiais foram impressos por serigrafia, jato de tinta, impressão por aerossol e revestimento de lâmina doctor blade. Para terminar, é apresentado um caso de estudo da integração dos diferentes materiais e tecnologias desenvolvidos sob o formato de um livro.This project was supported by FCT – Fundação para a Ciência e a Tecnologia, within the doctorate grant with reference SFRH/BD/110622/2015, by POCH – Programa Operacional Capital Humano, and by EU – European Union

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed

A Digital Manufacturing Process For Three-Dimensional Electronics

Additive manufacturing (AM) offers the ability to produce devices with a degree of three-dimensional complexity and mass customisation previously unachievable with subtractive and formative approaches. These benefits have not transitioned into the production of commercial electronics that still rely on planar, template-driven manufacturing, which prevents them from being tailored to the end user or exploiting conformal circuitry for miniaturisation. Research into the AM fabrication of 3D electronics has been demonstrated; however, because of material restrictions, the durability and electrical conductivity of such devices was often limited. This thesis presents a novel manufacturing approach that hybridises the AM of polyetherimide (PEI) with chemical modification and selective light-based synthesis of silver nanoparticles to produce 3D electronic systems. The resulting nanoparticles act as a seed site for the electroless deposition of copper. The use of high-performance materials for both the conductive and dielectric elements created devices with the performance required for real-world applications. For printing PEI, a low-cost fused filament fabrication (FFF); also known as fused deposition modelling (FDM), printer with a unique inverted design was developed. The orientation of the printer traps hot air within a heated build environment that is open on its underside allowing the print head to deposit the polymer while keeping the sensitive components outside. The maximum achievable temperature was 120 °C and was found to reduce the degree of warping and the ultimate tensile strength of printed parts. The dimensional accuracy was, on average, within 0.05 mm of a benchmark printer and fine control over the layer thickness led to the discovery of flexible substrates that can be directly integrated into rigid parts. Chemical modification of the printed PEI was used to embed ionic silver into the polymer chain, sensitising it to patterning with a 405 nm laser. The rig used for patterning was a re-purposed vat-photopolymerisation printer that uses a galvanometer to guide the beam that is focused to a spot size of 155 µm at the focal plane. The positioning of the laser spot was controlled with an open-sourced version of the printers slicing software. The optimal laser patterning parameters were experimentally validated and a link between area-related energy density and the quality of the copper deposition was found. In tests where samples were exposed to more than 2.55 J/cm^2, degradation of the polymer was experienced which produced blistering and delamination of the copper. Less than 2.34 J/cm^2 also had negative effect and resulted in incomplete coverage of the patterned area. The minimum feature resolution produced by the patterning setup was 301 µm; however, tests with a photomask demonstrated features an order of magnitude smaller. The non-contact approach was also used to produce conformal patterns over sloped and curved surfaces. Characterisation of the copper deposits found an average thickness of 559 nm and a conductivity of 3.81 × 107 S/m. Tape peel and bend fatigue testing showed that the copper was ductile and adhered well to the PEI, with flexible electronic samples demonstrating over 50,000 cycles at a minimum bend radius of 6.59 mm without failure. Additionally, the PEI and copper combination was shown to survive a solder reflow with peak temperatures of 249°C. Using a robotic pick and place system a test board was automatically populated with surface mount components as small as 0201 resistors which were affixed using high-temperature, Type-V Tin-Silver-Copper solder paste. Finally, to prove the process a range of functional demonstrators were built and evaluated. These included a functional timer circuit, inductive wireless power coils compatible with two existing standards, a cylindrical RF antenna capable of operating at several frequencies below 10 GHz, flexible positional sensors, and multi-mode shape memory alloy actuators

Digital fabrication of custom interactive objects with rich materials

As ubiquitous computing is becoming reality, people interact with an increasing number of computer interfaces embedded in physical objects. Today, interaction with those objects largely relies on integrated touchscreens. In contrast, humans are capable of rich interaction with physical objects and their materials through sensory feedback and dexterous manipulation skills. However, developing physical user interfaces that offer versatile interaction and leverage these capabilities is challenging. It requires novel technologies for prototyping interfaces with custom interactivity that support rich materials of everyday objects. Moreover, such technologies need to be accessible to empower a wide audience of researchers, makers, and users. This thesis investigates digital fabrication as a key technology to address these challenges. It contributes four novel design and fabrication approaches for interactive objects with rich materials. The contributions enable easy, accessible, and versatile design and fabrication of interactive objects with custom stretchability, input and output on complex geometries and diverse materials, tactile output on 3D-object geometries, and capabilities of changing their shape and material properties. Together, the contributions of this thesis advance the fields of digital fabrication, rapid prototyping, and ubiquitous computing towards the bigger goal of exploring interactive objects with rich materials as a new generation of physical interfaces.Computer werden zunehmend in Geräten integriert, mit welchen Menschen im Alltag interagieren. Heutzutage basiert diese Interaktion weitgehend auf Touchscreens. Im Kontrast dazu steht die reichhaltige Interaktion mit physischen Objekten und Materialien durch sensorisches Feedback und geschickte Manipulation. Interfaces zu entwerfen, die diese Fähigkeiten nutzen, ist allerdings problematisch. Hierfür sind Technologien zum Prototyping neuer Interfaces mit benutzerdefinierter Interaktivität und Kompatibilität mit vielfältigen Materialien erforderlich. Zudem sollten solche Technologien zugänglich sein, um ein breites Publikum zu erreichen. Diese Dissertation erforscht die digitale Fabrikation als Schlüsseltechnologie, um diese Probleme zu adressieren. Sie trägt vier neue Design- und Fabrikationsansätze für das Prototyping interaktiver Objekte mit reichhaltigen Materialien bei. Diese ermöglichen einfaches, zugängliches und vielseitiges Design und Fabrikation von interaktiven Objekten mit individueller Dehnbarkeit, Ein- und Ausgabe auf komplexen Geometrien und vielfältigen Materialien, taktiler Ausgabe auf 3D-Objektgeometrien und der Fähigkeit ihre Form und Materialeigenschaften zu ändern. Insgesamt trägt diese Dissertation zum Fortschritt der Bereiche der digitalen Fabrikation, des Rapid Prototyping und des Ubiquitous Computing in Richtung des größeren Ziels, der Exploration interaktiver Objekte mit reichhaltigen Materialien als eine neue Generation von physischen Interfaces, bei

Additive Manufactured Antennas and Novel Frequency Selective Sensors

The research work carried out and reported in this thesis focuses on the application of additive manufacturing (AM) for the development antennas and novel frequency selective surfaces structures. Various AM techniques such as direct writing (DW), material extrusion, nanoparticle conductive inks are investigated for the fabrication of antennas and FSS based sensors. This research has two parts. The first involves the development of antennas at the microwave and millimetre wave bands using AM techniques. Inkjet printing of nanoparticle silver inks on paper substrate is employed in the fabrication of antennas for an origami robotic bird. This provides an exploration on the practicability of developing foldable antennas which can be integrated on expendable robots using low-cost household inkjet printers. This is followed using Aerosol jet printing in the fabrication of fingernail wearable antennas. The antennas are developed to operate at microwave and millimetre wave bands for potential use in 5G Internet of Things (IoT) or body-centric networks. The second part of the research work involves the development of frequency selective sensors. Trenches have been incorporated on an FSS structure to produce a new concept of liquid sensor. The sensor is fabricated using standard etching techniques and then using FDM method in conjunction with nanoparticle conductive ink. Finally, a new concept displacement sensor using an FSS coupled with a retracting substrate complement is introduced. The displacement sensor is a 3D structure which is conveniently fabricated using AM techniques

Flexible and Stretchable Electronics

Flexible and stretchable electronics are receiving tremendous attention as future electronics due to their flexibility and light weight, especially as applications in wearable electronics. Flexible electronics are usually fabricated on heat sensitive flexible substrates such as plastic, fabric or even paper, while stretchable electronics are usually fabricated from an elastomeric substrate to survive large deformation in their practical application. Therefore, successful fabrication of flexible electronics needs low temperature processable novel materials and a particular processing development because traditional materials and processes are not compatible with flexible/stretchable electronics. Huge technical challenges and opportunities surround these dramatic changes from the perspective of new material design and processing, new fabrication techniques, large deformation mechanics, new application development and so on. Here, we invited talented researchers to join us in this new vital field that holds the potential to reshape our future life, by contributing their words of wisdom from their particular perspective